• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.9
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• pp.1837-1844
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• 2009

In this paper, the circuit of 2 variable ternary adder and multiplier circuit using current mode CMOS are implemented. The presented ternary adder circuit and multiplier circuit using current mode CMOS are driven the voltage levels. We show the characteristics of operation for these circuits simulated by HSpice. These circuits are simulated under $0.18{\mu}m$ CMOS standard technology, $5{\mu}A$ unit current in $0.54{\mu}m/0.18{\mu}m$ ratio of NMOS length and width, and $0.54{\mu}m/0.18{\mu}m$ ratio of PMOS length and width, and 2.5V VDD voltage, MOS model Level 47 using HSpice. The simulation results show the satisfying current characteristics. The simulation results of current mode ternary adder circuit and multiplier circuit show the propagation delay time $1.2{\mu}s$, operating speed 300KHz, and consumer power 1.08mW.

• 한국ITS학회:학술대회논문집
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• 2008.11a
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• pp.607-610
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• 2008

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.131-136
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• 2008

Two Ka-band 3-stage power amplifiers were designed and fabricated using $0.18-{\mu}m$ CMOS technology. For low loss matching networks for the amplifiers, two substrate-shielded transmission line structures, having good modeling accuracy up to 40 GHz were used. The measured insertion loss of substrate-shielded microstrip-line (MSL) was 0.5 dB/mm at 27 GHz. A 3-stage CMOS amplifier using substrate-shielded MSL achieved a 14.7-dB small-signal gain and a 14.5-dBm output power at 27 GHz in a compact chip area of 0.83$mm^2$. The measured insertion loss of substrate-shielded coplanar waveguide (CPW) was 1.0 dB/mm at 27 GHz. A 3-stage amplifier using substrate-shielded CPW achieved a 12-dB small-signal gai and a 12.5-dBm output power at 26.5 GHz. This results shows a potential of CMOS technology for low cost short-range wireless communication components and system.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.591-592
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• 2006

Schottky diodes for Radio-frequency identification (RFID) tag integration on chip were designed and fabricated using Samsung electronics System LSI standard $0.18{\mu}m$ CMOS process. Schottky diodes were designed as interdigitated fingers array by CMOS layout design rule. 64 types of Schottky diode were designed and fabricated with the variation of finger width, length and numbers with a $0.6{\mu}m$ guard ring enclosing n-well. Titanium was used as Schottky contact metal to lower the Schottky barrier height. Barrier height of the fabricated Schottky diode was 0.57eV. DC current - voltage measurements showed that the fabricated Schottky diode had a good rectifying properties with a breakdown voltage of -9.15 V and a threshold voltage of 0.25 V.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.567-568
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• 2008

In this paper, we proposed the design on LNA for $3{\sim}5\;GHz$ frequency with Using $0.18{\mu}m$CMOS technology. The LNA gain is 12-15 dB, and noise figure is lower than 5 dB and Input/output matching is lower than 10 dB in frequency range from 3 GHz to 5 GHz. The topology, which common source output of cascode is reduced noise figure and improved gain. Input common gate amplifier extend LNA's bandwidth.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.6
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• pp.52-57
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• 2009

This paper presents a low-noise low-dropout linear regulator that is suitable for on-chip integration with RF transceiver ICs. In the bandgap reference, a stacked diode structure is adopted for saving silicon area as well as maintaining low output noise characteristic. Theoretical analysis for supporting the approach is also described. The linear regulator is fabricated in $0.18{\mu}m$ CMOS process. It operates with an input voltage range of 2.2 V - 5 V and provide the output voltage of 1.8 V and the output current up to 90 mA. The measured line and load regulation is 0.04%/V and 0.46%, respectively. The output noise voltage is measured to be 479 nV/$^\surd{Hz}$ and 186 nV/$^\surd{Hz}$ from 100 Hz and 1 kHz offset, respectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38A no.1
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• pp.88-95
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• 2013

We propose a novel driver circuit design using $0.18{\mu}m$ CMOS process technology that drives a 1550 nm high-speed VCSEL used in optical transceiver. We report a distinct improvement in bandwidth, voltage gain and eye diagram at 3.1Gb/s data rate in comparison with existing topology. In this paper, the design and layout of a 3.1Gb/s VCSEL driver for optical transceiver having arrayed multi-channel of integrating module is confirmed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.79-85
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• 2009

The design of a 3.2 Gb/s serial link receiver in $0.18{\mu}m$ CMOS process is presented. The major factors limiting the performance of high-speed links are transmission channel bandwidth, timing uncertainty. The design uses a multi-level signaling(4-PAM) to overcome these problems. Moreover, to increase data bit-rate and lower BER, we designed this circuit by using a current mode amplifier, Current-mode Logic(CML) sampling latches. The 4-PAM receiver achieves 3.2 Gb/s and BER is less than $1.0\;{\times}\;10^{-12}$. The $0.5\;{\times}\;0.6\;mm^2$ chip consumes 49 mA at 3.2 Gb/s from a 1.8-V supply.

• Journal of Korea Society of Industrial Information Systems
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• v.18 no.5
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• pp.39-44
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• 2013

In this paper, a Relaxation Oscillator with temperature compensation using BGR and ADC is presented. The current to determine the frequency of Relaxation Oscillator can be controlled. By adjusting the current according to the temperature using the code that is output from the ADC and BGR, was to compensate the output frequency of the temperature. It is fabricated in a 0.35 ${\mu}m$ CMOS process with an active area of $240{\mu}m{\times}210{\mu}m$. Current consumption is 600 ${\mu}A$ from a 5 V and the rate of change of the output frequency with temperature shows about ${\pm}1%$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.2 s.117
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• pp.213-218
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• 2007

In this paper, we propose the design and fabrication on high frequency CMOS VCO for DS-UWB(Direct-Sequence Ultra-WideBand) applications using 0.18 ${\mu}m$ process. The complementary cross-coupled LC oscillator architecture which is composed of PMOS, NMOS symmetrically, is designed for improving the phase noise characteristic. The resistor is used instead of current source that reduce the 1/f noise of current source. The high-speed buffer is needed for measuring the output characteristic of VCO using spectrum analyzer, therefore the high-speed inverter buffer is designed with VCO. A fabricated core VCO size is $340{\mu}m{\times}535{\mu}m$. The VCO is tunable between 7.09 and 7.52 GHz and has a phase noise lower than -107 dBc/Hz at 1-MHz offset over entire tuning range. The measured harmonic suppression is 32 dB. The VCO core circuit draws 2.0 mA from a 1.8 V supply.