• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.13 no.2
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• pp.169-175
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• 2020

This paper studied the SET situation in VLSI because the electronic devices exposed to SET can indicate irregular operation and output errors. The SET environment was established using the exponential static wave (iexp) in the fold-cascode comparator. The comparator was experimented with how it affected it by the SET. In a folded comparator that did not enter the SET situation, the propagation delay was measured at 0.26㎲ and the gain was 0.649. The MOSFET close to the output stage was measured sensitively in the folded comparator that entered the SET situation. And propagation delay was calculated from 0.36 to 0.37㎲ and the gain was 0.649. The mid-position MOSFET was calculated from 0.28 to 0.30㎲ and the gain was 0.649. The MOSFET, which is farthest from the output stage from the folded comparator, was calculated with the propagation delay between 0.25 and 0.26㎲ and the gain of 0.649. In SET situations, the MOSFET close to the output portion of the folded comparator was sensitive. And at the MOSFET far from the output, the same results were obtained as a normal folded comparator without the SET input.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.62-68
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• 2010

This work proposes a 10b 100MS/s DAC based on a segmented local matching technique primarily for small chip area. The proposed DAC employing a segmented current-steering structure shows the required high linearity even with the small number of devices and demonstrates a fast settling behavior at resistive loads. The proposed segmented local matching technique reduces the number of current cells to be matched and the size of MOS transistors while a double-cascode topology of current cells achieves a high output impedance even with minimum sized devices. The prototype DAC implemented in a 0.13um CMOS technology occupies a die area of $0.13mm^2$ and drives a $50{\Omega}$ load resistor with a full-scale single output voltage of $1.0V_{p-p}$ at a 3.3V power supply. The measured DNL and INL are within 0.73LSB and 0.76LSB, respectively. The maximum measured SFDR is 58.6dB at a 100MS/s conversion rate.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.91-96
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• 2011

In this paper, a low-power direct-conversion transmitter based on current-mode operation, which satisfies the IEEE 802.15.4 standard, is proposed and implemented in a $0.13{\mu}m$ CMOS technology. The proposed transmitter consists of DACs, LPFs, variable gain I/Q up-conversion mixer, a divide-by-two circuit with LO buffer, and a drive amplifier. By combining DAC, LPF, and variable gain I/Q up-conversion mixer with a simple current mirror configuration, the transmitter's power consumption is reduced and its linearity is improved. The drive amplifier is a cascode amplifier with gain controls and the 2.4GHz I/Q differential LO signals are generated by a divide-by-two current-mode-logic (CML) circuit with an external 4.8GHz input signal. The implemented transmitter has 30dB of gain control range, 0dBm of maximum transmit output power, 33dBc of local oscillator leakage, and 40dBc of the transmit third harmonic component. The transmitter dissipates 10.2mW from a 1.2V supply and the die area of the transmitter is $1.76mm{\times}1.26mm$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.6
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• pp.719-725
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• 2019

We propose a 2.4-GHz CMOS power amplifier (PA) with a bypass structure to improve the power-added efficiency (PAE) in the low-power region. The primary winding of the output transformer is split into two parts. One of the primary windings is connected to the output of the power stage for high-power mode. The other primary winding is connected to the output of the driver stage for low-power mode. Operation of the high power mode is similar to conventional PAs. On the other hand, the output power of the driver stage becomes the output power of the overall PA in the low power mode. Owing to a turning-off of the power stage, the power consumption is decreased in low-power mode. We designed the CMOS PA using a 180-nm RFCMOS process. The measured maximum output power is 27.78 dBm with a PAE of 20.5%. At a measured output power of 16 dBm, the PAE is improved from 2.5% to 12.7%.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.12
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• pp.20-26
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• 1999

A CMOS 6-bit 100MSPS ADC for DBS receiver is designed. The proposed ADC is composed of folding block, latch block, and digital block. The cascode interpolating block and kickback reduced latch are proposed with a high speed architecture. To verify the performance of ADC, simulations are carried out by HSPICE. The ADC achieves a clock frequency of 100MHz with a power dissipation of 40mW for 3 V supply voltage. The active chip area is $1500{\mu}m{\times}1000{\mu}m$with $0.65{\mu}m$ 2-poly 2-metal CMOS process. Further, INL and DNL are within ${\pm}0.6LSB$, ${\pm}0.5LSB$, respectively. SNDR is about 33dB at 10MHz input frequency.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.838-841
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• 2012

To avoid the damage to circuit and performance degradation by temperature changes, temperature sensing circuit applicable to the IC is proposed in this paper. Temperature sensing is executed by PTAT circuit and power saving mode is activated by internal switch if internal temperature is in high. Also, characteristics of current matching are increased by using current mirror and cascode circuits. From the simulation results, this circuit is operating in action mode if input signal is in low. But it immediately goes into power saving mode if output signal is in high. It shows the output voltage of 1V at $75^{\circ}C$ and 1.75V at $125^{\circ}C$ in action mode and near 0 V(0V~ 7uV) in power saving mode.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.45-51
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• 2011

This paper presents a wideband low-noise amplifier (LNA) covering 800MHz~5.8GHz for various wireless communication standards by utilizing in a 0.13um CMOS technology. Particularly, the LNA consists of two stages to improve the low-noise characteristics, that is, a cascode input stage and an output buffer with noise cancellation technique. Also, a feedback resistor is exploited to help achieve wideband impedance matching and wide bandwidth. Measure results demonstrate the bandwidth of 811MHz~5.8GHz, the maximum gain of 11.7dB within the bandwidth, the noise figure of 2.58~5.11dB. The chip occupies the area of $0.7{\times}0.9mm^2$, including pads. DC measurements reveal the power consumption of 12mW from a single 1.2V supply.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.7 s.361
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• pp.41-46
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• 2007

A novel post-linearization technique is proposed for CMOS cascode low noise amplifier (LNA). The technique uses dual common gate FETs one of which delivers the linear currents to a load and the other one sinks the $3^{rd}$ order intermodulation currents of output currents from the common source FET. Selective current branching can be implemented in $0.18{\mu}m$ CMOS process by using a thick oxide FET as an IM3 sinker with a normal FET as a linear current buffer. A differential LNA adopting this technique is designed at 2.14GHz. The measurement results show 11dBm IIP3, 15.5dB power gain and 2.85dB noise figure consuming 12.4mA from 1.8V power supply. Compared with the LNA with turning off the IM3 sinker, the proposed technique improves the IIP3 by 7.5 dB.