• Title/Summary/Keyword: 젖음 특성

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The Fluxless Wetting Properties of UBM-Coated Si-Wafer to the Pb-Free Solders (UBM이 단면 증착된 Si-Wafer에 대한 Pb-free 솔더의 무플럭스 젖음 특성)

  • 홍순민;박재용;김문일;정재필;강춘식
    • Journal of Welding and Joining
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    • v.18 no.6
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    • pp.74-82
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    • 2000
  • The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

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Wetting Behavior and Evaporation Characteristics of Nanofluid Droplets on Glass Surfaces (나노유체 액적의 젖음거동 및 증발 특성)

  • Shin, Dong-Hwan;Lee, Seong-Hyuk
    • Journal of ILASS-Korea
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    • v.17 no.1
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    • pp.9-13
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    • 2012
  • This study investigates experimentally evaporation characteristics of nanofluid droplets containing 50 nm alumina($Al_2O_3$) particles and the wettability changes on a hydrophilic glass surfaces. From the captured digital images by using a CMOS camera and a magnifying lens, we examined the effect of particle concentration on droplet evaporation rate which can be indirectly deduced from the measured droplet volumes varying with time. In particular, with the use of a digital image analysis technique, the present study measured droplet perimeters and the contact angles to study the wetting dynamics during evaporating process. In addition, we compared the measured total evaporation time with theoretically estimated values. It was found that as the volume fractions of nanofluid increased, the total evaporation time and the initial contact angles decreased, while the droplet perimeters increased.

Reflectivity of Sn-3.5Ag Solder for LED lead frame (LED 리드프레임을 위한 Sn-3.5Ag 솔더의 반사율)

  • Gi, Se-Ho;Xu, Zengfeng;Choe, Jeong-Beom;Kim, Won-Jung;Jeong, Jae-Pil
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2011.05a
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    • pp.192-192
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    • 2011
  • 본 연구에서는 LED lead frame을 위한 Sn-3.5Ag 솔더의 젖음 특성과 반사율에 관하여 조사하였다. 금속기판과 액체금속간의 젖음성은 wetting balance tester를 이용하여 평가하였으며, 최대인출력, 최대인출시간 등을 측정하고 표면장력을 계산하였다. Sn-3.5Ag 솔더를 $250{\sim}290^{\circ}C$의 온도에서 젖음성을 측정하였는데 온도가 증가함에 따라 젖음성이 향상되는 것을 확인할 수 있었다. 또한 솔더가 도금된 Cu-coupon의 반사율을 측정하였는데 $270^{\circ}C$에서 가장 높은 반사율을 나타냈다.

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The Wetting Property of Sn-3.5Ag Eutectic Solder (Sn-3.5Ag 공정 솔더의 젖음특성)

  • 윤정원;이창배;서창제;정승부
    • Journal of Welding and Joining
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    • v.20 no.1
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    • pp.91-96
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    • 2002
  • Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders (웨팅밸런스법을 통한 젖음성 평가와 솔더의 젖음 특성)

  • Jeon, Wook Sang;Rajendran, Sri Harini;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.3
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    • pp.1-6
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    • 2019
  • Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

An experimental Study of Heat Transfer of Rivulet Flow over an Inclined, Heated Surface (경사진 가열 평판을 흐르는 리뷸릿 유동의 열전달 특성에 관한 실험적 연구)

  • Kang, Chi-Suk;Kang, Byung-Ha
    • Proceedings of the SAREK Conference
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    • 2006.06a
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    • pp.156-161
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    • 2006
  • The rivulet is a narrow stream of liquid flowing down a solid surface. Heat transfer of rivulet flow over on inclined heated surface has been investigated experimentally. This problem is of particular interest in the understanding of fundamental mechanism on rivulet heat transfer as well as in the design of a regenerative evaporative cooler. The rivulet is seem to be meandering flow, single wide flat flow. and film flow as rivulet flow rate is increased. Even though the wetted surface area is increased with an increase in the rivulet flow rate, the absorbed heat transfer of rivulet flow from a heated surface strongly depends on the flow pattern of rivulet.

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Analysis of Pollutant tranport in the natural river using FVM (유한체적법을 이용한 하천 오염물의 이송해석)

  • Park, Jae Hong
    • Proceedings of the Korea Water Resources Association Conference
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    • 2020.06a
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    • pp.207-207
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    • 2020
  • 하천으로 유입된 오염물질의 거동을 정확하게 예측하는 것은 하천 시스템의 수질 유지관리에 매우 중요하다. 본 연구에서는 1차 감쇠율(decay rate)을 가진 비보존성 오염물의 비정상 이송해석 방정식의 해를 위해 유한체적기법이 개발되어졌다. 하천 흐름 해석을 위해 자연형 단면에서의 마름-젖음 해석이 가능한 기법이 도입되었다. 이 기법은 2차-정도의 정확성와 Courant 수가 1 까지 안정함을 보장한다. 도입된 기법은 Godnov 형의 유한체적기법을 이용하여 St. Venant 방정식들을 해석하였고 질량 및 운동량 플럭스는 Roe 형의 Riemann Solver 를 사용하여 연산하였다. 오염물의 이송 해석은 추가적인 이송-확산 방정식을 도입을 통해 기존의 St. Venant 방정식과 함께 풀려질 수 있다. 추가된 방정식과 St. Venant 식은 3×3 eigenstructure를 구성하였고 이는 2차원 흐름해석 기법과 유사하게 해석될 수 있었다. 본 연구 모형의 검증을 위해 오염물의 계속적 주입을 가정한 가상 및 실제 하천에 적용되었다. 연구된 기법은 모든 적용에서 합리적 정확도를 가지고 오염물질의 연속적인 특성을 잘 모의하고 있었다.

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Moisture Transmission Characteristics of Fabric for High Emotional Garments -Moisture Transmission Characteristics according to Fiber Properties, Yarn Characteristics and Test Method- (고감성 의류용 직물의 수분이동특성 -섬유소재와 실 특성 및 실험방법에 따른 수분이동특성-)

  • Kim, SeungJin;Kim, Hyunah
    • Journal of the Korean Society of Clothing and Textiles
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    • v.41 no.1
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    • pp.28-42
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    • 2017
  • Moisture transfer characteristics of high emotional garments are important to evaluate wear comfort. Wicking and drying measurement methods are also critical for perspiration absorption and quick dry fabric made of high functional fibers. In this study, the wicking and drying properties of high emotional fabrics made from hybrid composite yarns using CoolMax, Tencel, Bamboo staple fibers and PP. PET CoolMax filaments were also measured and analyzed according to various measuring methods. The wicking property of hybrid composite yarn fabrics by Bireck method was mostly influenced by the structure of hybrid yarns than the absorption rate of constituent fibers; however, both the hygroscopicity of fibers and the composite yarn structure affected the wicking property of the fabrics in the drop method. Concerning drying properties, the KSK 0815B method measuring distilled moisture weight was more relevant to explain the drying characteristics of hybrid yarn fabrics than the KSK 0815A method measuring the time to drying. This study revealed that the drying properties of hybrid yarn fabrics were influenced by the hygroscopicity of constituent fibers, wicking properties of constituent yarns and structure of composite yarns.

Characterisrics of the Ag System Insert Metal Produced by Powder Mixing Process (분말 혼합 공정으로 만들어진 은계 삽입금속의 특성)

  • Kim, Gwang-Soo;Kim, Sang-Duck
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.9 no.2
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    • pp.311-316
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    • 2008
  • Powder type Ag system insert metals were manufactured by ball milling process. The variables of milling process were constant except the milling time. The milling times were selected for 24, 48 and 72 hours. The insert metals made by milling process were evaluated by performing scanning electron microscope, DSC(differential scanning calorimetry) analyses, spreading test and further in terms of wettability test. The selected insert metals that have the good characteristics compared to commercial insert metals were applied to make the brazed joints. The characterizations of those brazed joints were also conducted by microstructural observations. The results indicated that milling time of 48 hours for making powder type insert metals was the best condition showing the good spreadibility, low wetting angle. The brazed joints that applied the 48 hours milled insert metal were very sound condition indicating the stable microstructure in spite of containing small amount of porosity and the microhardness value of the joint was about 138VHN.

A Study on the Silver Nanoparticle Deposition for Optical Amplification (광 증폭용 플라즈모닉 나노구조 제작을 위한 은 나노입자 증착 연구)

  • Kang, J.S.;Kim, J.H.;Jeong, M.Y.
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.1
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    • pp.11-15
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    • 2018
  • In this study, we deposited silver nanoparticles on the nanocone array structure which was fabricated by the UV nanoimprint process for optical signal amplification. The deposition of the silver nanoparticles was based on the evaporation behavior of the solution droplet according to wettability of surface and the deposition pattern changed from the center of the droplet to the edge depending on the difference of thermal energy. The optical property of silver nanoparticles that were deposited on imprinted nanohole patterns was simulated by the Finite difference time domain (FDTD) analysis method, and it was confirmed that energy was concentrated around the silver nanoparticle of the finally fabricated structure.