The Wetting Property of Sn-3.5Ag Eutectic Solder |
윤정원
(성균관대학교 신소재공학과)
이창배 (성균관대학교 신소재공학과) 서창제 (성균관대학교 신소재공학과) 정승부 (성균관대학교 신소재공학과) |
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2 |
The Effect of Pretinning on the Solderability of Cooper
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3 |
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4 |
Issues in the Replacement of Lead-Bearing Solders
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5 |
Reactive Isothermal Solidification in the Ni-Sn System
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DOI ScienceOn |
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7 |
The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
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DOI ScienceOn |
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Metallurgy of low temperature Pb-free solders for electronic assembly
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Characterization of Eutectic Sn-Bi Solder Joints
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DOI |
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Solderability of Pre-Tinned Cu Sheet
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DOI |
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