Browse > Article
http://dx.doi.org/10.6117/kmeps.2019.26.3.001

Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders  

Jeon, Wook Sang (Department of Materials Science and Engineering, University of Seoul)
Rajendran, Sri Harini (Department of Materials Science and Engineering, University of Seoul)
Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.3, 2019 , pp. 1-6 More about this Journal
Abstract
Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.
Keywords
wetting balance test; wettability; wetting angle; surface tension; nano-composite solder;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Y. Li, X. C. Zhao, Y. Liu, Y. Wang, and Y. Wang, "Effect of $TiO_2$ addition concentration on the wettability and intermetallic compounds growth of Sn-3.0Ag-0.5Cu-$xTiO_2$ nanocomposite solders", Journal of Materials Science: Materials in Electronics, 25(9), 3816 (2014).   DOI
2 A. Sharma, H. R. Sohn, and J. P. Jung, "Effect of graphene nanoplatelets on wetting, microstructure, and tensile characteristics of Sn-3.0Ag-0.5Cu (SAC) alloy", Metall. Mater. Trans. A., 47(1), 494 (2016).   DOI
3 D. H. Jung, A. Sharma, D. U. Lim, J. H. Yun, and J. P. Jung, "Effects of AlN nanoparticles on the microstructure, solderability, and mechanical properties of Sn-Ag-Cu solder", Metall. Mater. Trans. A., 48(9), 4372 (2017).   DOI
4 Y. Gu, Y. Liu, X. Zhao, S. Wen, H. Li, and Y. Wang, "Effects of Cobalt nanoparticles addition on shear strength, wettability and interfacial intermetallic growth of Sn-3.0Ag-0.5Cu solder during thermal cycling", Materials Science Forum, 815, 97 (2015).   DOI
5 https://en.wikipedia.org/wiki/Restriction_of_Hazardous_Substances_Directive
6 X. Jiachen, X. Songbai, L. Dongxue, W. He, and X. Peng, "Effect of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solder", Adv. Mater. Sci. Eng., 1 (2017).
7 S. M. Hong, J. Y. Park, C. B. Park, and J. P. Jung, C. S. Kang, "A study on the wetting properties of UBM-coated Si-wafer", J. Microelectron. Packag. Soc., 7(2), 55 (2000).
8 S. J. Lee, and J. P. Jung, "Lead-free solder technology and reliability for automotive electronics", J. Microelectron. Packag. Soc., 22(3), 1 (2015).   DOI
9 J. Y. Park, "Study on the analysis of wetting forces in the wetting balance curve and application to the prediction of solder joint geometry", in Ph.D. Thesis, Seoul National University, Seoul (2000).
10 M. F. Arenas, and V. L. Acoff, "Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates", J. Electron. Mater., 33(12), 1452 (2004).   DOI
11 S. M. Hong, J. Y. Park, C. S. Kang, and J. P. Jung, "Fluxless wetting properties of UBM-coated Si-wafer to Sn-3.5wt%Ag solder", IEEE Trans. Compon. Packag. Technol., 26(1), 255 (2003).   DOI
12 D. H. Jung, and J. P. Jung, "Review of the wettability of solder with a wetting balance test for recent advanced microelectronic pacakaging", Crit. Rev. Solid State Mater. Sci., 44(4), 324 (2018).   DOI
13 L. G. Earle, "A quantitative study of soft soldering by means of the Kollagraph", J. I. Met., 7(6)1, 45 (1945).
14 J. Y. Park, C. S. Kang, and J. P. Jung, "The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders", J. Electron. Mater., 28(11), 1256 (1999).   DOI
15 J. L. Jellison, D. R. Johnson, and F. M. Hosking, "Statistical interpretation of meniscograph solderability tests", IEEE Transactions on Parts, Hybrids, and Packaging, 12(2), 126 (1976).   DOI
16 C. Lea, and W. A. Dench, Quantitative solderability measurement of electronic components Part 2: An Index of solderability", Solder. Surf. Mount Tech., 2(1), 14 (1990).   DOI
17 A. Mayhew, and K. Monger, "Solderability by Meniscometry", Proc. Internepcon, 53 (1972).
18 I. Artaki, A. M. Jackson, and P. T. Vianco, "Evaluation of lead-free solder joints in electronic assemblies", J. Electron. Mater., 23(8), 757 (1994).   DOI
19 W. Gasior, Z. Moser, J. Pstrus, K. Bukat, R. Kisiel, and J. Sitek, "(Sn-Ag)eut + Cu soldering materials, Part I: Wettability studies", J. Phase Equilib. Diff., 25(2), 115 (2003).   DOI
20 J. I. Lee, S. W. Chen, H. Y. Chang, and C. M. Chen, "Reactive wetting between molten Sn-Bi and Ni substrate", J. Electron. Mater., 32(3), 117 (2003).   DOI
21 JFE Techno-Research Corporation, "Solder wettability test", http://www.jfe-tec.co.jp/en/electronic-component/case/case03.html
22 K. M. Martorano, M. A. Martorano, and S. D. Brandi, "Optimal conditions for the wetting balance test", J. Mater. Process. Tech., 209(6), 3091 (2009).
23 C. B. Lee, S. B.Jung, Y. E. Shin, and C. C. Shur, "The effect of Bi concentration on wettability of Cu substrate by Sn-Bi solders", Mater. Trans., 42(5), 751 (2001).   DOI
24 X. Zhao, Y. Wen, Y. Li, Y. Liu, and Y. Wang, "Effect of ${\gamma}$-$Fe_2O_3$ nanoparticles size on the properties of Sn-1.0Ag-0.5Cu nano-composite solders and joints", J. Alloy. Compd., 662, 272 (2016).   DOI
25 https://en.wikipedia.org/wiki/Waste_Electrical_and_Electronic_Equipment_Directive
26 https://en.wikipedia.org/wiki/End_of_Life_Vehicles_Directive