• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• 제15권12호
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• pp.1131-1140
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• 2004

In this paper, we proposed a flate-plate antenna employing semi-annular slots for satellite broadcast reception. The radiating element of the antenna is dual annular slots fed by a strip dipole, which have a wider bandwidth than the rectangular slot. A $16{\times}16$ array antenna is designed using stripline T-junction power dividers. Measurements of the fabricated antenna show a gain of 28.0$\~$29.5 dB in 11.7$\~$12.8 GHz frequency range.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제22권3호
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

• Journal of the Korean institute of surface engineering
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• 제45권1호
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• Journal of the Korean Society for Precision Engineering
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• 제27권7호
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• The Transactions of The Korean Institute of Electrical Engineers
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• 제60권1호
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• pp.105-108
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• 2011

Newly-developed fabrication of a p-n heterojunction diode constructed with a p-Si nanowire (NW) and an n-ZnO nanoparticle (NP) thin-film by the dielectrophoresis (DEP) technique is demonstrated in this study. With the bias of 20 Vp-p at the input frequency of 1 MHz, the most efficient assembly of the n-ZnO NPs is shown for the fabrication of the p-n heterojunction diode with a p-Si NW. The p-n heterojunction diode fabricated in this study represents current rectifying characteristics with the turn on voltage of 1.1 V. The diode can be applied to the fabrication of optoelectrical devices such as photodetectors, light-emitting diodes (LEDs), or solar cells based on the high conductivity of the NW and the high surface to volume ratio of the NP thin film.

• Journal of radiological science and technology
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• 제31권2호
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• pp.183-188
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• 2008

Aim of this study is to investigate the feasibility of 2D ion chamber array as a substitute of the water phantom system in a periodic Linac QA. For the feasibility study, a commercial ion chamber matrix was used as a substitute of the water phantom in the measurement for a routine QA beam properties. The device used in this study was the I'm RT MatriXX (Wellhofer Dosimetrie, Germany). The MatriXX consists of a 1,020 vented ion chamber array, arranged in $24{\times}24\;cm^2$ matrix. Each ion chamber has a volume of $0.08\;cm^3$, spacing of 0.762 cm. We investigated dosimetric parameters such as dose symmetry, energy ($TPR_{20,10}$), and absolute dose for comparing with the water phantom data with a Farmer-type ionization chamber (FC65G, Wellhofer Dosimetrie, Germany). For the MatriXX measurements, we used the white polystyrene phantom (${\rho}:\;1.18\;g/cm^3$) and also considered the intrinsic layer (${\rho}:\;1.06\;g/cm^3$, t: 0.36 cm) of MatriXX to be equivalent to water depth. In the preliminary study of geometrical QA using MatriXX, the rotation axis of collimator and half beam junction test were included and compared with film measurements. Regarding the dosimetrical QA, the MatriXX has shown good agreements within ${\pm}1%$ compared to the water phantom measurements. In the geometrical test, the data from MatriXX were comparable with those from the films. In conclusion, the MatriXX is a good substitute for water phantom system and film measurements. In addition, the results indicate that the MatriXX as a cost-effective novel QA tool to reduce time and personnel power.

• Korean Journal of Food Science and Technology
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• 제42권4호
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• pp.452-458
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• 2010

This study aimed at improving the packaging technology of Yukwa to improve the quality and extend the shelflife using secondary packaging. After packaging the Yukwa using an OPP film, P2, P3, and P4 packaging materials were applied secondarily. Various films including (1) P1: OPP (oriented polypropylene), (2) P2: P1+OPP/LLDPE (linear low density polyethylene), (3) P3: P1+PET (polyethylene terephthalate)/NY (nylon)/CPP (cast polypropylene) and (4) P4: P1+PET/AL (aluminum)/NY/CPP (P4) were used for packaging Yukwa. The experiment was conducted at $25^{\circ}C$ for 12 weeks. P1 showed the highest acid value score (1.26 mg KOH/g), and P3 had the highest peroxide value score (32.91 meq/kg) among all packaging groups. Nevertheless, these values did not exceed the guideline values of 2.0 g KOH/g and 40 meq/kg specified in the Korean food code. The overall color difference showed a tendency for decreasing Hunter 'L' values and increasing 'a' and 'b' values; however, no noticeable difference in the outer appearance was observed in any of the packaging treatments except in the P1 for greater than 10 weeks of storage. Some texture defects were observed in the Yukwa when the moisture contents dropped below 5%. The P4 packaging treatment had the lowest moisture permeability and showed the least rheological deterioration change, followed by P3 and P2. In conclusion, the use of a secondary packaging with less gas and moisture permeability was more effective for maintaining the quality and extending the shelf-life of Yukwa than other types of packaging material.

• Polymer(Korea)
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• 제34권3호
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• pp.191-197
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• 2010

To improve the curing method of anisotropic conductive film (ACF) at low temperature, it was studied to replace the thermal latent curing agent of imidazole compounds by the curing agent of cationically initiating type. Thermo-mechanical properties such as glass transition temperature, storage modulus, and coefficient of thermal expansion were investigated for the analysis of curing behavior. The reliability of ACF were observed in thermal cycle and high temperature-high humidity test. ACF using cationic initiator showed faster curing, lower CTE, and higher $T_g$ than the case of using imidazole curing agent, which is important for the high temperature stability. Furthermore, ACF using cationic initiator maintained a stable contact resistance in reliability test, although it was cured at low temperature and fast rate. With these results, it was confirmed that the curing method of epoxy had great effect on thermo-mechanical properties and reliability of ACF.

• Polymer(Korea)
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• 제36권4호
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• pp.486-493
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• 2012

Photocurable sulfonated polyimide (SPI) polyelectrolyte containing chalcone group was prepared and fabricated on an alumina electrode pretreated with chalcone-containing silane-coupling agent. SPI films with bis(tetramethyl)ammonium 2,2'-benzidinedisulfonate ($Me_4N$-BDS)/4,4'-diaminochalcone (DAC)/pyromellitic dianhydride (PA)= 90/10/100 possessed very linear response(Y = -0.04528X+7.69446, $R^2=0.99675$) and showed resistance changing from 4.48 to $2.1k{\Omega}$ between 20 and 95 %RH. The response time for absorption and desorption measurements between 33 and 94 %RH% was about 79 s, which affirmed the high efficiency of crosslinked SPI film for rapid detection of humidity. A negative temperature coefficient showing $-0.49%RH/^{\circ}C$ was found and proper temperature compensation should be considered in future applications. Moreover, pretreatment of the substrates with chalcone-containing silane-coupling agent was performed to improve the water durability and the stability of the humidity sensors at a high humidity and a high temperature and long-term stability for 480 h. The crosslinked SPI films anchored to electrode substrate could be a promising material for the fabrication of efficient humidity sensors with superior characteristics compared to the commercially available sensors.

• Journal of the Korea Institute of Information and Communication Engineering
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• 제16권4호
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• pp.759-764
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• 2012

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N at thermo-compression process. Through the simulation work, it was proved that the CPTB decreased in its size of conduction area as time passes, however it was largely affected by the copper oxidation.