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http://dx.doi.org/10.4313/JKEM.2009.22.3.199

Thermocompression Anisothropic Conductive Films(ACFs) bonding for Flat Panel Displays(FPDs) Application  

Pak, Jin-Suk (중앙대학교 기계공학부)
Jo, Il-Jea (중앙대학교 기계공학부)
Shin, Young-Eui (중앙대학교 기계공학부)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.22, no.3, 2009 , pp. 199-204 More about this Journal
Abstract
The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.
Keywords
Anisotropic conductive adhesive films; Conductive particle; Thermocompression bonding; Thermal shock test;
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