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Chip on Glass Interconnection using Lateral Thermosonic Bonding Technology  

Ha, Chang-Wan (Department of Mechanical Engineering, KAIST)
Yun, Won-Soo (Department of Mechanical Engineering, Korea Polytechnic Univ.)
Park, Keum-Saeng (Yoi System Co., Ltd.)
Kim, Kyung-Soo (Department of Mechanical Engineering, KAIST)
Publication Information
Journal of the Korean Society for Precision Engineering / v.27, no.7, 2010 , pp. 7-12 More about this Journal
Abstract
In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.
Keywords
Lateral Thermosonic Bonding; Thermo-compression Bonding; Anisotropic Conductive Film(ACF); Flip Chip Bonding; Chip on Glass(COG);
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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