• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.17-18
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• 2007

The etching characteristics of Zinc Oxide (ZnO) and etch selectivity of ZnO to $SiO_2\;in\;BCl_3$/Ar plasma were investigated. It was found that ZnO etch rate shows a non-monotonic behavior with increasing both Ar fraction in $BCl_3$ plasma, RF power, and gas pressure. The maximum ZnO etch rate of 50.3 nm/min was obtained for $BCl_3$ (80%)/Ar(20%) gas mixture. The plasmas were characterized using optical emission spectroscopy (OES) analysis measurements while chemical state of etched surfaces was investigated with X-ray photoelectron spectroscopy (XPS). From these data the suggestions on the ZnO etch mechanism were made.

• Journal of the Korean institute of surface engineering
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• v.48 no.5
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• pp.205-210
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• 2015

NbN coatings were prepared by ICP (inductively coupled plasma) assisted magnetron sputtering from a Nb metal target in $Ar+N_2$ atmosphere at various ICP powers. Effect of ICP on the microstructure, crystalline structure and mechanical properties of NbN coatings was investigated by field emission electron microscopy, X-ray diffraction, atomic force microscopy and nanoindentation measurements. The results show that ICP power has a significant influence on coating microstructure, structure and mechanical properties of NbN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Crystalline structure of NbN coatings were changed from cubic ${\delta}$-NbN to hexagonal ${\beta}-Nb_2N$ with increase of ICP power. The maximum nano hardness of 25.4 GPa with Ra roughness of 0.5 nm was obtained from the NbN coating sputtered at ICP power of 200 W.

• Journal of the Korean institute of surface engineering
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• v.49 no.4
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• pp.376-381
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• 2016

The effects of ICP (Inductively Coupled Plasma) power, ranging from 0 to 200 W, on the crystal structure, microstructure, surface roughness and mechanical properties of magnetron sputtered VN coatings were systematically investigated with FE-SEM, AFM, XRD and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of VN coatings. With the increasing of ICP power, coating microstructure evolves from a porous columnar structure to a highly dense one. Average crystal grain size of single phase cubic fcc VN coatings was decreased from 10.1 nm to 4.0 nm with increase of ICP power. The maximum hardness of 28.2 GPa was obtained for the coatings deposited at ICP power of 200 W. The smoothest surface morphology with Ra roughness of 1.7 nm was obtained from the VN coating sputtered at ICP power of 200 W.

• Journal of the Korean institute of surface engineering
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• v.45 no.5
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• pp.206-211
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• 2012

Process analysis was carried out during deposition of MgO by inductively coupled plasma assisted reactive magnetron sputtering in Ar and $O_2$ ambient. At the initiation of Mg sputtering with bipolar pulsed dc power in Ar ambient, total pressure showed sharp increase and then slow fall. To analyse partial pressure change, QMS was used in downstream region, where the total pressure was maintained as low as $10^{-5}$ Torr during plasma processing, good for ion source and quadrupole operation. At base pressure, the major impurity was $H_2O$ and the second major impurity was $CO/N_2$ about 10%. During sputtering of Mg in Ar, $H_2$ soared up to 10.7% of Ar and remained as the major impurity during all the later process time. When $O_2$ was mixed with Ar, the partial pressure of Ar decreased in proportion to $O_2$ flow rate and that of $H_2$ dropped down to 2%. It was understood as Mg target surface was oxidized to stop $H_2$ emission by Ar ion sputtering. With ICP turned on, the major impurity $H_2$ was converted into $H_2O$ consuming $O_2$ and C was also oxidized to evolve CO and $CO_2$.

• Journal of the Korean institute of surface engineering
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• v.45 no.3
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• pp.123-129
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• 2012

Nanocrystalline CrN coatings were fabricated by DC and ICP (inductively coupled plasma) assisted magnetron sputtering techniques. The effect of ICP power, ranging from 0 to 500 W, on coating microstructure, preferred orientation mechanical properties were systematically investigated with HR-XRD, SEM, AFM and nanoindentation. The results show that ICP power has an significant influence on coating microstructure and mechanical properties of CrN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Grain size of CrN coatings were decreased from 11.7 nm to 6.6 nm with increase of ICP power. The maximum nanohardness of 23.0 GPa was obtained for the coatings deposited at ICP power of 500 W. Preferred orientation in CrN coatings also vary with ICP power, exerting an effective influence on film nanohardness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.183-186
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• 2004

The dry etch behavior of PZT thin films was investigated in $BCl_3/N_2$ plasma. The experiments were carried out with measuring etch rates and selectivities of PZT to $SiO_2$ as a function of gas concentration and input rf power, chamber pressure. The maximum etch rate was 126 nm/min when 30% $N_2$ was added to $BCl_3$ chemistry. Also, as input rf power increases, the etch rate of PZT thin films was increased. Langmuir probe measurement showed the noticeable influence of $BCl_3/N_2$ mixing ratio on electron temperature and electron density as input rf power increased. The variation of Cl radical density as plasma parameters changed was examined by Optical Emission Spectroscopy (OES) analysis. According to X-ray diffraction (XRD) analysis, PZT thin films were damaged in plasma and an increase in (100), (200) and (111) phases showed the improvement in structure of the PZT thin films after the $O_2$ annealing process.

• Journal of the Korean institute of surface engineering
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• v.54 no.6
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• pp.348-356
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• 2021

In this study, optical diagnosis of plasma was performed for nitrogen doping in graphene using a horizontal inductively coupled plasma (ICP) system. Graphene was prepared by mechanical exfoliation and the ICP system using nitrogen gas was ignited for plasma-induced and defect-suppressed nitrogen doping. In order to derive the optimum condition for the doping, plasma power, working pressure, and treatment time were changed. Optical emission spectroscopy (OES) was used as plasma diagnosis method. The Boltzmann plot method was adopted to estimate the electron excitation temperature using obtained OES spectra. Ar ion peaks were interpreted as a reference peak. As a result, the change in the concentration of nitrogen active species and electron excitation temperature depending on process parameters were confirmed. Doping characteristics of graphene were quantitatively evaluated by comparison of intensity ratio of graphite (G)-band to 2-D band, peak position, and shape of G-band in Raman profiles. X-ray photoelectron spectroscopy also revealed the nitrogen doping in graphene.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.166-166
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• 1998

반도체 공정에서 기존보다 큰 30cm 웨이퍼훌 이용하기 위해서 기존의 ECR, Helicon, ICP, 등 공정용 고 밀도 플라즈마 원들의 대면적화에 대한 연구가 세계적으로 진행되고 있다 현 상황에서는 평판형 안테 나룰 이용한 TCP가 대면적용 폴라즈마 원의 가장 유력한 후보로 여겨지고 있다 TCP롤 대면적화 하는 데 있어서 중요한 문제점으로는 대면적에서의 큰 안테나 인되턴스로 인한 임피던스 정합과 대면적에서 의 유전울질의 기계적 강도이다. 앓은 유전물질올 사용힐 수 있도록 대면적 TCP 플라즈마 원올 실계 저l작하였고 이차원 가열이론올 이용한 TCPRP code 률 이용하여 안테나의 반경옳 결정하였디 안테나의 인덕턴스 값올 줄이기 위해서는 주m수는 13.56MHz 보다 낮은 4-5MHz 부근에서 작동하는 RF 파워룰 선택하였다 이 파워 서플라이는 보통 사용되는 50n 흩력 입묘$\mid$던스훌 갖는 형태가 Of니라 LC 공진현상 올 이용하여 부하에 파워률 전달하는 형태이다 .. TCP 장치에 사용할 수 있도록 파워 서플라이 흩력 단에 안테나와 직혈로 가변 콘덴서를 달아서 임11I던스 정합올 힐 수 있게 하였다 안테나에 직훌로 달Of줌으 로써 안테니의 인덕턴스훌 훌여주는 효과훌 얻올 수 있다 안테나에 흐르는 전류룰 측정하기 위해서 사 각형 루프로 전류 픽업 코일을 만들었고 진공상태에서 RF 파워률 인가하고 안테나의 전류와 전압을 측정하여 픽업 코일걸과훌 조정하였다. 발생기체로는 헬륨올 사용하였고 1-100mTorr 의 압력범위에서 실험을 하였다 플라즈마롤 빌샘시키고 파워를 증가 시킴에 따라 E-H mode transition 현상이 관찰되었고 그 때의 임계 전류 값을 측정하였다. 압력이 낮올수록 모드 변화가 일어나는 전류의 값이 작았다 임계 전류는 압력에 대해서 선형적인 특성을 보였다 이는 압력이 낮을수록 유도걸힘이 더 잘 된다는 것을 의미한다 1 1 mTorr에서는 H-mode에서 안테나의 전류가 파워훌 증가시킴에 따라 계속 증가하였으니, 압력이 올라 갈수록 조금씩 증가하는 정도가 줄어들고. 100mTorr에서는 포화된 값을 나타냈다 H-mode로 넘어간 후 에는 파워가 증가황에 따라 안테나의 임피던스 값이 모든 압력영역에서 줄어드는 경황을 보였고, 이는 플라즈마의 인덕턴스에 의해서 안테나의 인덕턴스 기 감소되기 때문이다, 파워가 증가할수록 안테U오} 플라즈마 루프사이의 상호걸합이 증가하는 걸로 해석힐 수 있다 안테나의 인되턴스 변화보다는 저항.성 분의 변화가 컸다 하지만 전체 임피던스로 볼 때 저항성분이 상대적으로 작기 때문에 인덕턴스의 감소 가 더 큰 영향을 미치는 걸로 볼 수 있다. 하지만 플라즈마로의 파워 전달에는 저항성분만이 영향올 미 치므로 저항성분의 큰 변화는 파워가 많이 전달될올 의미한다 피워전달 효율을 계산해 본 결과 수 r mTorr 부근이 80-90% 정도의 높은 효율올 보였고 5mTorr 일 때가 가장 좋았다.

• Korean Journal of Environmental Agriculture
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• v.30 no.3
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• pp.288-294
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• 2011

BACKGROUND: Methylmercury is analyzed by HPLC-ICP/MS because of the simplicity for sample preparation and interference. However, most of the pre-treatment methods for methylmercury need a further pH adjustment of the extracted solution and removal of organic matter for HPLC. The purpose of this study was to establish a rapid and accurate analytical method for determination of methylmercury in fish by using HPLC-ICP/MS. METHOD AND RESULTS: We conducted an experiment for pre-treatment and instrument conditions and analytical method verification. Pre-treatment condition was established with aqueous 1% L-cysteine HCl and heated at $60^{\circ}C$ in microwave for 20 min. Methylmercury in $50{\mu}L$ of filtered extract was separated by a C18 column and aqueous 0.1% L-cysteine HCl + 0.1% L-cysteine mobile phase at $25^{\circ}C$. The presence of cysteine in mobile phase and sample solution was essential to eliminate adsorption, peak tailing and memory effect problems. Correlation coefficient($r^2$) for the linearity was 0.9998. The limits of detection and quantitation for this method were 0.15 and $0.45{\mu}g/kg$ respectively. CONCLUSION: Result for analytical method verification, accuracy and repeatability of the analytes were in good agreement with the certified reference materials values of methylmercury at a 95% confidence level. The advantage of the established method is that the extracted solution can be directly injected into the HPLC column without additional processes and the memory effect of mercury in the ICP-MS can be eliminated.

• Journal of the Korean Vacuum Society
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• v.18 no.4
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• pp.296-301
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• 2009

An inductively coupled plasma assisted atomic layer deposition(ICP-ALD) system has been constructed for the deposition of ZnO thin films, and various experiments of ZnO thin films on p-type Si(100) substrates have been carried out to find the self-limiting reaction conditions for the ICP-ALD system under non-plasma circumstances. Diethyl zinc[$Zn(C_2H_5)_2$, DEZn] was used as the zinc precursor, $H_2O$ as the oxidant, and Ar as the carrier and purge gas. At the substrate temperature of $150^{\circ}C$, atomic layer deposition conditions based on self-limiting surface reaction were successfully obtained by series of experiments through the variation of exposure times for DEZn, $H_2O$, and Ar. ZnO deposition was repeated at different substrate temperatures of $90{\sim}210^{\circ}C$. As a result, the thermal process window(ALD window) for ZnO thin films was observed to be $110{\sim}190^{\circ}C$ and the average growth rate was measured to be constant of 0.29 nm/cycle. Properties of the film's microstructure and composition(Zn, O, etc.) were also studied. As the substrate temperature increases, the crystallinity was improved and ZnO(002) peak became dominant. The films deposited at all temperatures were high purity, and the films deposited at high temperatures had the composition ratio between Zn and O closer to one of a stable hexagonal wurtzite structure.