• Title/Summary/Keyword: 열회로

Search Result 319, Processing Time 0.023 seconds

Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder (Sn-Pb 솔더를 이용한 경연성 인쇄 회로 기판간의 열압착 본딩)

  • Choi, Jung-Hyun;Lee, Jong-Gun;Yoon, Jeong-Won;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.17 no.3
    • /
    • pp.11-15
    • /
    • 2010
  • In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method (열압착법을 이용한 경.연성 인쇄회로기판 접합부의 접합 강도에 미치는 접합 조건의 영향)

  • Lee, Jong-Gun;Ko, Min-Kwan;Lee, Jong-Bum;Noh, Bo-In;Yoon, Jeong-Won;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.18 no.2
    • /
    • pp.63-67
    • /
    • 2011
  • We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

A Study on the Characteristics Assessment and Fabrication of Distribution Board according to KEMC Standards (KEMC 규정에 의한 분전반의 제작 및 특성 평가에 관한 연구)

  • Lee, Byung-Seol;Choi, Chung-Seog
    • Fire Science and Engineering
    • /
    • v.31 no.3
    • /
    • pp.63-72
    • /
    • 2017
  • This study fabricated a low-voltage 10 circuit distribution board based on the KEMC (Korea Electrical Manufacturers Cooperative) 2102-610 standard and performed a characteristics assessment of the developed 10 circuit distribution board to secure product stability. The developed 10 circuit distribution board is designed to have the characteristics of insulation materials, as well as resistance to corrosion ultraviolet radiation and mechanical impact. The developed distribution board is fabricated to have an appropriate protection class of enclosure, electric shock prevention and protection circuits, switchgear and its components, internal electrical circuits and connectors, external conduct terminal, insulation characteristics, temperature rise test, heat resistance, etc. The developed 10 circuit distribution board consists of a single phase circuit and 3-phase circuits. It is possible to measure in real time the leakage current generated from the load distribution line by installing a sensor module at the load side of each of the branched switchgears. In addition, it is possible to increase a circuit according to the use and purpose of the load and to also manage and check the load in real time. Temperature rise tests were performed on the developed 10 circuit distribution board at 18 places including the inlet connection, main circuit and distribution circuit bus bars and bus bar supports, etc. The highest temperature of $65.3^{\circ}C$ was measured at the R-Phase of the connection of the MCCB power supply for the branch circuit bus bar and a temperature rise of $61.6^{\circ}C$ was measured at the T-Phase of the load side. When applying thermal stress to an MCCB for 6 hours at $180^{\circ}C$ using a heat resistant experimental device, it was found that the actuator lever was transformed and moved in the tripped state.

A Study on the Transient Temperature Characteristics in Ceramic Package with Thermal Via (Thermal Via에 의한 세라믹 패키지의 과도 열특성에 관한 연구)

  • Kim, Y.J.
    • Electronics and Telecommunications Trends
    • /
    • v.10 no.1 s.35
    • /
    • pp.47-57
    • /
    • 1995
  • 최근 전자 및 통신기기에는 시스템의 소형화, 고기능 및 고신뢰도를 실현하기 위하여 하나의 기판위에 여러개의 chip을 장착하는 다중칩 패키지 기술이 사용되고 있다. 그러나 이로 인하여 기판 면적당 칩수의 증가로 power dissipation이 증가하게 되었으며, 이러한 power의 증가는 온도를 상승시켜서 시스템의 신뢰도를 저하시키는 원인이 되고 있기 때문에 이에 대한 열 해석이 요구되어진다. 따라서 본 고에서는 다중칩 패키지의 열 성능을 위하여 전도성이 좋은 세라믹 기판의 과도 온도 특성을 해석하고자, 전기적 유사 회로를 이용하여 thermal via가 없는 경우와 있는 경우에 대하여 열전달 특성을 고찰하였다. 그 결과 themal via에 의한 기판의 열전달 향상으로 다중칩 패키지의 동작 온도가 낮아짐을 알 수 있었다.

Development of Simulation Model for Greenhouse Heating System Using Latent Heat Storage System (잠열축열을 이용한 그린하우스 난방시스템의 시뮬레이션 모델개발)

  • 노정근;송현갑
    • Proceedings of the Korean Society for Bio-Environment Control Conference
    • /
    • 2001.04b
    • /
    • pp.31-33
    • /
    • 2001
  • 잠열축열 그린하우스 난방 시스템의 난방특성을 분석하기 위하여 이에 대한 열평형 이론을 정립하고 수치해석에 의하여 컴퓨터 시뮬레이션 모델을 개발하고자 잠열축열 그린하우스 난방 시스템의 열저항 회로망을 구성하였다. 그리고 그린하우스의 피복재, 내부 공기, 토양표면, 잠열 축열재와의 열평형 방정식을 구성하였으며, Newton-Raphson반복법을 이용하여 수치해석을 하였고, 실험 분석을 통하여 수치해의 타당성을 검증하였다. 시뮬레이션 모델을 위하여 C언어를 사용하였으며, 겨울철 (11월-2월)의 기후 조건이 유사한 여러 날을 선정하여 온도, 태양강도, 상대습도, 토양 수분함량 등을 자료로 하여 모델링을 하였다. 여기에 사용된 토양 조건은 사양토로 건조한 상태를 유지하였다. 이상과 같은 분석에 의하여 그린하우스내 경시적 공기온도 변화와 열전달 현상의 실험치와 이론분석 결과가 잘 일치하고 있음을 알 수 있었다.

  • PDF

Reactive Power Circulation based Active Thermal Control for Paralleled Power Converters for Wind Turbine (풍력발전용 병렬형 컨버터를 위한 무효전력순환 기반 능동 열 제어기법)

  • Ko, Youngjong
    • Proceedings of the KIPE Conference
    • /
    • 2020.08a
    • /
    • pp.251-252
    • /
    • 2020
  • 화석연료 사용으로 발생하는 환경문제 대처방안으로 풍력 등 신재생 에너지원 사용의 필요성이 강조되고 있으며, 이러한 사회적 요구에 따라 신재생 에너지 발전 시스템의 대용량화 추세에 있다. 시스템 대용량화에 있어 안정적인 에너지 발전과 공급을 위해 전력변환장치의 신뢰성 향상이 필요하다. 특히, 풍력발전시스템의 경우 돌풍 등 일정하지 않은 풍속으로 인하여 전력변환장치의 잦은 고장이 발생하고, 이는 전체 시스템의 신뢰성 결정에 주된 영향을 미친다. 본 논문에서는 병렬형 전력변환장치에서 높은 고장률을 보이는 스위칭 소자의 열적 스트레스를 줄이기 위한 무효전력순환 기반 능동 열 제어기법을 제안한다. 제안한 기법의 동작특성을 이론적으로 분석하고, 열 회로망 시뮬레이션을 통해 그 영향을 검증한다.

  • PDF

Thermal Management on 3D Stacked IC (3차원 적층 반도체에서의 열관리)

  • Kim, Sungdong
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.22 no.2
    • /
    • pp.5-9
    • /
    • 2015
  • Thermal management becomes serious in 3D stacked IC because of higher heat flux, increased power generation, extreme hot spot, etc. In this paper, we reviewed the recent developments of thermal management for 3D stacked IC which is a promising candidate to keep Moore's law continue. According to experimental and numerical simulation results, Cu TSV affected heat dissipation in a thin chip due to its high thermal conductivity and could be used as an efficient heat dissipation path. Other parameters like bumps, gap filling material also had effects on heat transfer between stacked ICs. Thermal aware circuit design was briefly discussed as well.

A Active Replica LDO Regulator with DC Matching Circuit (DC정합회로를 갖는 능동 Replica LDO 레귤레이터)

  • Ryu, In-Ho;Bang, Jun-Ho;Yu, Jae-Young
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.12 no.6
    • /
    • pp.2729-2734
    • /
    • 2011
  • In this paper, an active replica Low-dropout(LDO) regulator with DC voltage matching circuit is presented. In order to match the voltage between replica and output of regulator, DC voltage matching circuit is designed. The active replica low dropout regulator has higher Power Supply Rejection(PSR) than that of conventional regulator. The designed DC voltage matching circuit can reduce the drawback that may be occurred in replica regulator. And using fully active element in regulator can reduce the chip area and heat noise with resistor. As results of HSPICE simulation with 0.35um CMOS parameter, the designed active replica LDO regulator achieves Power Supply Rejection, -28@10Hz better than -17@10Hz of conventional replica regulator without DC matching circuit. And the output voltage is 3V.

Design of Compensated Digital Interface Circuits for Capacitive Pressure Sensor (용량형 압력센서용 디지탈 보상 인터페이스 회로설계)

  • Lee, Youn-Hee;Sawada, Kouji;Seo, Hee-Don;Choi, Se-Gon
    • Journal of Sensor Science and Technology
    • /
    • v.5 no.5
    • /
    • pp.63-68
    • /
    • 1996
  • In order to implement the integrated capacitive pressure sensors, which contains integrated interface circuits to detect the electrical output signal, several main factors that have a bad effect on the characteristics of sensors must be improved, such as parasitic capacitance effects, temperature/thermal drift, and the leakage current of a readout circuitry. This paper describes the novel design of the dedicated CMOS readout circuitry that is consists of two capacitance to frequency converters and 4 bit digital logic compensating circuits. Dividing the oscillation frequency of a sensing sensor by that of reference sensor, this circuit is designed to eliminate the thermal/temperature drift and the effect of the leakage currents, and to access a digital signals to obtain a high signal-to-noise(S/N)ratio. Therefore, the resolution of this circuit can be increased by increasing the number of the digital bits. Digital compensated circuits of this circuits, except for the C-F converters, are fabricated on a FPGA chip, and fundamental performance of the circuits are evaluated.

  • PDF

Analysis of the Flow Rate for a Natural Cryogenic Circulation Loop during Acceleration and Low-gravity Section (극저온 자연순환회로의 가속 및 저중력 구간 유량 분석)

  • Baek, Seungwhan;Jung, Youngsuk;Cho, Kiejoo
    • Journal of the Korean Society of Propulsion Engineers
    • /
    • v.23 no.5
    • /
    • pp.43-52
    • /
    • 2019
  • Cryogenic propellant rockets utilize a natural circulation loop of cryogenic fluid to cool the engine inlet temperature before launch. The geometric information about the circulation system, such as length and diameter of the pipes and the heat input to the system, defines the mass flow rate of the natural circulation loop. We performed experiments to verify the natural circulation mass flow rate and compared the results with the analytical results. The comparison of the mass flow rate between experiments and numerical simulations showed a 12% offset. We also included a prediction of the natural circulation flow rate in the low-gravity section and in the acceleration section in the upper stage of the launch vehicle. The oxygen tank should have 100 kPa(a) of pressure in the acceleration section to maintain a high flow rate for the natural circulation loop. In the low-gravity section, there should be an optimal tank pressure that leads to the maximum natural circulation flow rate.