Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method
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Lee, Jong-Gun
(School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Ko, Min-Kwan (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Lee, Jong-Bum (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Noh, Bo-In (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Yoon, Jeong-Won (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University) |
1 | J. W. Yoon, J. H. Park, C. C. Shur and S. B. Jung, "Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus content" Microelectronic Engineering., 84(11), 2552 (2007). DOI ScienceOn |
2 | J. W. Kim, Y. C. Lee, B. I. Noh, J. W. Yoon and S. B. Jung "Recent Advances in Conductive Adhesives for Electronic Packaging Technology" J. Microelectron. Packag. Soc., 16(2), 1 (2009) |
3 | J. W. Yoon, W. C. Moon and S. B. Jung, "Core Technology of Electronic Packaging (in Kor)", J. KWS, 23(2), 116 (2005). |
4 | Judith Glazer, "Mictrostructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly" J. Electron. Mater., 23(8), 693 (1994). DOI ScienceOn |
5 | D. R. Frear, J. W. Jang and C. Zhang, "Pb-free solders for flip-chip interconnects" JOM. J. Minerals, Met. Mat. Soc., 53(6), 28 (2001). DOI ScienceOn |
6 | J. M. Koo, J. H. Moon and S. B. Jung "Ultrasonic bonding of Au flip chip bump for CMOS image sensor (in Kor.)" J. Microelectron. Packag. Soc., 14(1), 19 (2007). |
7 | J. M. Koo, J. L. Jo, J. B. Lee, Y. N. Kim, J. W. Kim, B. I. Noh, J. H. Moon, D. U. Kim and S. B. Jung, "Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate", Jpn. J. Appl. Phys., 47(5), 4309 (2008). DOI |
8 | J. B. Lee, J. M. Koo, J. W. Kim, B. I. Noh, J. G. Lee and S. B. Jung, "Ultrasonic bonding of electrodes of rigid and flexible printed circuit boards with non-conductive film (NCF)", J. Adhesion., 85(6), 341 (2009). DOI ScienceOn |
9 | J. W. Yoon and S. B. Jung, "Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu (ENIG) sandwich solder joints", J. Alloys Compd., 448(1), 177 (2008). DOI |
10 | J. H. Choi, J. G. Lee, J. W. Yoon and S. B. Jung, "Thermocompression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder", J. Microelectron. Packag. Soc., 17(3), 11 (2010) |
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