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http://dx.doi.org/10.6117/kmeps.2011.18.2.063

Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method  

Lee, Jong-Gun (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Ko, Min-Kwan (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Lee, Jong-Bum (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Noh, Bo-In (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Yoon, Jeong-Won (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.2, 2011 , pp. 63-67 More about this Journal
Abstract
We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.
Keywords
Thermo-compression bonding; PCB; Sn; Peel test; Fracture energy;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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