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J. M. Koo, J. L. Jo, J. B. Lee, Y. N. Kim, J. W. Kim, B. I. Noh, J. H. Moon, D. U. Kim and S. B. Jung "Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate", Jpn. J. Appl. Phys., 47(5), 4309 (2008).
DOI
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S. Das, A. N. Tiwari and A. R. Kulkarni "Thermo-compression Bonding of Alumina Ceramics to Metal", J. Mater. Sci., 39, 3345 (2004)
DOI
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Y. Charlier, J. L. Hedrick, T. P. Russell, A. Jonas and W. Volksen "High Temperature Polymer Nanofoams Based on Amorphous, High Tg Polyimides", Polymer, 36(5), 987 (1995).
DOI
ScienceOn
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J. W. Yoon, W. C. Moon and S. B. Jung, "Core Technology of Electronic Packaging (in Kor.)", Journal of KWS, 23(2), 116 (2005).
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J. M. Koo, J. W. Kim, J. W. Yoon, B. I. Noh, C. Y. Lee, J. H. Moon, C. D. Yoo and S. B. Jung "Ultrasonic Bonding Technology for Flip Chip Packaging (in Kor.)", Journal of KWS, 26(1), 31 (2008).
과학기술학회마을
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J. W. Yoon, J. W. Kim, J. M. Koo, S. S. Ha, B. I. Noh, W. C. Moon, J. H. Moon and S. B. Jung "Flip-chip Technology and Reliability of Electronic Packaging (in Kor.)", Journal of KWS, 25(2), 108 (2007).
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J. W. Kim, Y. C. Lee, B. I. Noh, J. W. Yoon and S. B. Jung "Recent Advances in Conductive Adhesives for Electronic Packaging Technology (in Kor.)", J. Microelectron. Packag. Soc., 16(2), 1 (2009)
과학기술학회마을
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J. M. Koo, J. H. Moon and S. B. Jung "Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor (in Kor.)", J. Microelectron. Packag. Soc., 14, 19 (2007).
과학기술학회마을
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