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Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder  

Choi, Jung-Hyun (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Lee, Jong-Gun (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Yoon, Jeong-Won (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.3, 2010 , pp. 11-15 More about this Journal
Abstract
In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.
Keywords
thermo-compression bonding; FPCB; solder; peel test; fracture energy;
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Times Cited By KSCI : 3  (Citation Analysis)
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