• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2020.11a
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• pp.165-166
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• 2020

Internationally, manufacturers attempted respectable portion of in-house logistics to satisfy end users and decrease manpower to compete for manufacturing price and quality optimization. Mostly, manufacturers operate variety of facilities such as collaborative robots, conveyor, etc. based on PLC. To achieve it, manufactures shall operate the optimized number of manufacturing processes with logic controlled by computer to reduce human errors. In prior to it, manufacturing industry still own plenty of fields which have not yet been adjusted with automation. For example, we shall put in-house logistics on the issue. This study focuses on manufacturing industry, evaluate efficiency, costs, etc. in all aspects and suggest alternatives by analysis SWAT and OEE, let alone reason of weakness.

• Journal of Korean Library and Information Science Society
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• v.54 no.3
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• pp.193-221
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• 2023

The purpose of this study is to identify how teacher librarians perceive the importance of each job and the expected job of other teachers and students, and to obtain basic information on their job recognition and to derive their jobs to be improved. To this end, after modifying the 25 jobs selected by Lim Jeong-hoon et al.(2021), 210 librarian teachers were measured for their own importance by job, the expected importance of other teachers and students, and the level of evaluation of their own performance ability. As a result of the analysis, teacher librarians recognized 'reading education and literacy education' as the most important, but recognized 'library event' as the most important task expected of other teachers and students, and recognized that 'library usage guidance' was the most outstanding. In addition, there were nine jobs that needed to be improved.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.5
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• pp.777-784
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• 2023

A sense amplifier is an essential peripheral circuit for designing a memory and is used to sense a small differential input signal and amplify it into digital signal. In this paper, a high-speed sense amplifier applicable to in-memory computing circuits is proposed. The proposed circuit reduces sense delay time through transistor Mtail that provides an additional discharge path and improves the circuit performance of the sense amplifier by applying m-GDI (: modified Gate Diffusion Input). Compared with previous structure, the sense delay time was reduced by 16.82%, the PDP(: Power Delay Product) by 17.23%, the EDP(: Energy Delay Product) by 31.1%. The proposed circuit was implemented using TSMC's 65nm CMOS process, while its feasibility was verified through SPECTRE simulation in this study.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.9
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• pp.14-23
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• 2010

This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.6-13
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• 2009

For X-band phased array systems, a power amplifier, a 6-bit phase shifter, a 6-bit digital attenuator, and a SPDT transmit/receive (T/R) switch are fabricated and measured. All circuits are demonstrated by using CMOS 0.18 um technology. The power amplifier has 2-stage differential and cascade structures. It provides 1-dB gain-compressed output power ($P_{1dB}$) of 20 dBm and power-added-efficiency (PAE) of 19 % at 8-11 GHz frequencies. The 6-bit phase shifter utilizes embedded switched filter structure which consists of nMOS transistors as a switch and meandered microstrip lines for desired inductances. It has $360^{\circ}$ phase-control range and $5.6^{\circ}$ phase resolution. At 8-11 GHz frequencies, it has RMS phase and amplitude errors are below $5^{\circ}$ and 0.8 dB, and insertion loss of $-15.7\;{\pm}\;1,1\;dB$. The 6-bit digital attenuator is comprised of embedded switched Pi-and T-type attenuators resistive networks and nMOS switches and employes compensation circuits for low insertion phase variation. It has max. attenuation of 31.5 dB and 0.5 dB amplitude resolution. Its RMS amplitude and phase errors are below 0.4 dB and $2^{\circ}$ at 8-11 GHz frequencies, and insertion loss is $-10.5\;{\pm}\;0.8\;dB$. The SPDT T/R switch has series and shunt transistor pairs on transmit and receive path, and only one inductance to reduce chip area. It shows insertion loss of -1.5 dB, return loss below -15 dB, and isolation about -30 dB. The fabricated chip areas are $1.28\;mm^2$, $1.9mm^2$, $0.34\;mm^2$, $0.02mm^2$, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.8
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• pp.29-37
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• 2019

Textile quality management targets the physical properties of fabrics and the subjective discriminations of color and fitting. Color is the most representative quality factor that consumers can use to evaluate quality levels without any instruments. For this reason, quantification using a color discrimination device has been used for statistical quality management in the textile industry. However, small and medium-sized domestic textile manufacturers use only visual inspection for color discrimination. As a result, color discrimination is different based on the inspectors' individual tendencies and work procedures. In this research, we want to develop a textile industry-friendly quality management method, evaluating the possibility of rapid color discrimination using a digital imaging device, which is one of the office-automation instruments. The results show that an imaging process-based color discrimination method is highly correlated with conventional color discrimination instruments ($R^2=0.969$), and is also applicable to field discrimination of the manufacturing process, or for different lots. Moreover, it is possible to recognize quality management factors by analyzing color components, ${\Delta}L$, ${\Delta}a$, ${\Delta}b$. We hope that our rapid discrimination method will be a substitute technique for conventional color discrimination instruments via elaboration and optimization.

• Clean Technology
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• v.28 no.1
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• pp.63-78
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• 2022

Electronics industrial wastewater treatment facilities release organic wastewaters containing high concentrations of organic pollutants and more than 20 toxic non-biodegradable pollutants. One of the major challenges of the fourth industrial revolution era for the electronics industry is how to treat electronics industrial wastewater efficiently. Therefore, it is necessary to develop an electronics industrial wastewater modeling technique that can evaluate the removal efficiency of organic pollutants, such as chemical oxygen demand (COD), total nitrogen (TN), total phosphorous (TP), and tetramethylammonium hydroxide (TMAH), by digital twinning an electronics industrial organic wastewater treatment facility in a cyber physical system (CPS). In this study, an electronics industrial wastewater activated sludge model (e-ASM) was developed based on the theoretical reaction rates for the removal mechanisms of electronics industrial wastewater considering the growth and decay of micro-organisms. The developed e-ASM can model complex biological removal mechanisms, such as the inhibition of nitrification micro-organisms by non-biodegradable organic pollutants including TMAH, as well as the oxidation, nitrification, and denitrification processes. The proposed e-ASM can be implemented as a Water Digital Twin for real electronics industrial wastewater treatment systems and be utilized for process modeling, effluent quality prediction, process selection, and design efficiency across varying influent characteristics on a CPS.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.3
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• pp.43-53
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• 2003

Unlike in analog display devices, the physical screen resolution in digital devices are fixed from the manufacturing. It is a weak point on digital devices. The screen resolution displayed in digital display devices is varied. Thus, interpolation or decimation of the resolution on the display is needed to make the input pixels equal to the screen resolution., This process is called image scaling. Many researches have been developed to reduce the hardware cost and distortion of the image of image scaling algorithm. In this paper, we proposed a Winscale algorithm. which modifies the scale up/down in continuous domain to the scale up/down in discrete domain. Thus, the algorithm is suitable to digital display devices. Hardware implementation of the image scaler is performed using Verilog XL and chip is fabricated in a 0.5${\mu}{\textrm}{m}$ Samsung SOG technology. The hardware costs as well as the scalabilities are compared with the conventional image scaling algorithms that are used in other software. This Winscale algorithm is proved more scalable than other image-scaling algorithm, which has similar H/W cost. This image-scaling algorithm can be used in various digital display devices that need image scaling process.

• The Magazine of the IEIE
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• v.29 no.6
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• pp.76-80
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• 2002

'Liquid Crystal의 상전이(相轉移)와 광학적 이방성(異方性)이 1888년과 1889년 F. Reinitzer와 O. Lehmann에 의해 Monatsch Chem.과 Z.Physikal.Chem.에 각각 보고된 후 부터 제2차 세계대전이 끝난 뒤인 1950년대 까지는 Liquid Crystal을 단지실험실에서의 기초학문 차원의 연구 대상으로만 다루어 왔다. 1963년 Williams가 Liquid Crystal Device로는 최초로 특허 출원을 하였으며, 1968년 RCA사의 Heilmeier등은 Nematic 액정(液晶)에 저주파(低周波) 전압(電壓)을 인가하면 투명한 액정이 혼탁(混濁)상태로 변화하는 '동적산란(動的散亂)'(Dynamic Scattering) 현상을 이용하여 최초의 DSM(Dynamic Scattering Mode) LCD(Liquid Crystal Display)를 발명하였다. 비록 150V 이상의 높은 구동전압과 과소비전력의 특성 때문에 실용화에는 실패하였지만 Guest-Host효과와 Memory효과 등을 발견하였다. 1970년대에 이르러 실온에서 안정되게 사용 가능한 액정물질들이 합성되고(H. Kelker에 의해 MBBA, G. Gray에 의한 Cyano-Biphenyl 액정의 합성), CMOS 트랜지스터의 발명, 투명도전막(ITO), 수은전지등의 주변기술들의 발전으로 인하여 LCD의 상품화가 본격적으로 이루어지게 되었다. 1971년에는 M. Shadt, W. Helfrich, J.L. Fergason등이 TN(Twisted Nematic) LCD를 발명하여 전자 계산기와 손목시계에 응용되었고, 1970년대 말에는 Sharp에서 Dot Matrix형의 휴대형 컴퓨터를 발매하였다. 이러한 단순 구동형의 TN LCD는 그래픽 정보를 표시하는 데에는 품질의 한계가 있어 1979년 영국의 Le Comber에 의해 a-Si TFT(amorphous Silicon Thin Film Transistor) LCD의 연구가 시작되었고, 1983년 T.J. Scheffer, J. Nehring, G. Waters에 의해 STN(Super Twisted Nematic) LCD가 창안되었고, 1980년 N. Clark, S. Lagerwall 및 1983년 K.Yossino에 의해 Ferroelectric LCD가 등장하여 LCD의 정보 표시량 증대에 크게 기여하였다. Color화의 진전은 1972년 A.G. Ficher의 셀 외부에 RGB(Red, Green, Blue) filter를 부착하는 방안과, 1981년 T. Uchida 등에 의한 셀 내부에 RGB filter를 부착하는 방법에 의해 상품화가 되었다. 1985년에는 J.L. Fergason에 의해 Polymer Dispersed LCD가 발명되었고, 1980년대 중반에 이르러 동화상(動畵像) 표시가 가능한 a-Si TFT LCD의 시제품(試製品) 개발이 이루어지고 1990년부터는 본격적인 양산 시대에 접어들게 되었다. 1990년대 초에는 STN LCD의 Color화 및 대형화(大型化) 고(高)품위화에 힘입어 Note-Book PC에 LCD가 본격적으로 적용이 되었고, 1990년대 후반에는TFT LCD의 표시품질 대비 가격경쟁력 확보로 인하여 Note-Book PC 시장을 독점하기에 이르렀다. 이후로는 TFT LCD의 대형화가 중요한 쟁점으로 부각되고 있고, 1995년 삼성전자는 당시 세계최대 크기의 22' TFT LCD를 개발하였다. 또한 LCD의 고정세(高情細)화를 위해 Poly Si TFT LCD의 개발이 이루어졌고, 디지타이져 일체형 LCD의 상품화가 그 응용의 폭을 넓혔으며, LCD의 대형화를 위해 1994년 Canon에 의해 14.8', 21' 등의 FLCD가 개발되었다. 대형화 방안으로 Tiled LCD 기술이 개발되고 있으며, 1995년에 Sharp에 의해 21' 두장의 Panel을 이어 붙인 28' TFT LCD가 전시되었고 1996년에는 21' 4장의 Panel을 이어 붙인 40'급 까지의 개발이 시도 되었으며 현재는 LCD의 특성향상과 생산설비의 성능개선과 안정적인 공정관리기술을 바탕으로 삼성전자에서 단패널 40' TFT LCD가 최근에 개발되었다. Projection용 디스플레이로는 Poly-Si TFT LCD를 이용하여 $25'{\sim}100'$사이의 배면투사형과 전면투사형 까지 개발되어 대형 TV시장을 주도하고 있다. 21세기 디지털방송 시대를 맞아 플라즈마디스플레이패널(PDP) TV, 액정표시장치 (LCD)TV, 강유전성액정(FLCD) TV 등 2005년에 약 1500만대 규모의 거대 시장을 형성할 것으로 예상되는 이른바 '벽걸이TV'로 불리는 차세대 초박형 TV 시장을 선점하기 위하여 세계 가전업계들이 양산에 총력을 기울이고 있다. 벽걸이TV 시장이 본격적으로 형성되더라도 PDP TV와 LCD TV가 직접적으로 시장에서 경쟁을 벌이는 일은 별로 없을 것으로 보인다. 향후 디지털TV 시장이 본격적으로 열리면 40인치 이하의 중대형 시장은 LCD TV가 주도하고 40인치 이상 대화면 시장은 PDP TV가 주도할 것으로 보는 시각이 지배적이기 때문이다. 그러나 이러한 직시형 중대형(重大型)디스플레이는 그 가격이 너무 높아서 현재의 브라운관 TV를 대체(代替)하기에는 시일이 많이 소요될 것으로 추정되고 있다. 그 대안(代案)으로는 비교적 저가격(低價格)이면서도 고품질의 디지털 화상구현이 가능한 고해상도 프로젝션 TV가 유력시되고 있다. 이러한 고해상도 프로젝션 TV용으로 DMD(Digital Micro-mirror Display), Poly-Si TFT LCD와 LCOS(Liquid Crystals on Silicon) 등의 상품화가 진행되고 있다. 인터넷과 정보통신 기술의 발달로 휴대형 디스플레이의 시장이 예상 외로 급성장하고 있으며, 요구되는 디스플레이의 품질도 단순한 문자표시에서 그치지 않고 고해상도의 그래픽 동화상 표시와 칼라 표시 및 3차원 화상표시까지 점차로 그 영역이 넓어지고 있다. <표 1>에서 보여주는 바와 같이 LCD의 시장규모는 적용분야 별로 지속적인 성장이 예상되며, 새로운 응용분야의 시장도 성장성을 어느 정도 예측할 수 있다. 따라서 LCD기술의 연구개발 방향은 크게 두가지로 분류할 수 있으며 첫째로는, 현재 양산되고 있는 LCD 상품의 경쟁력강화를 위하여 원가(原價) 절감(節減)과 표시품질을 향상시키는 것이며 둘째로는, 새로운 타입의 LCD를 개발하여 기존 상품을 대체하거나 새로운 시장을 창출하는 분야로 나눌 수 있다. 이와 같은 관점에서 현재 진행되고 있는 LCD기술개발은 다음과 같이 분류할 수 있다. 1) 원가 절감 2) 특성 향상 3) New Type LCD 개발.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.7
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• pp.122-130
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• 2013

This work proposes a 12b 100MS/s 45nm CMOS four-step pipeline ADC for high-speed digital communication systems requiring high resolution, low power, and small size. The input SHA employs a gate-bootstrapping circuit to sample wide-band input signals with an accuracy of 12 bits or more. The input SHA and MDACs adopt two-stage op-amps with a gain-boosting technique to achieve the required DC gain and high signal swing range. In addition, cascode and Miller frequency-compensation techniques are selectively used for wide bandwidth and stable signal settling. The cascode current mirror minimizes current mismatch by channel length modulation and supply variation. The finger width of current mirrors and amplifiers is laid out in the same size to reduce device mismatch. The proposed supply- and temperature-insensitive current and voltage references are implemented on chip with optional off-chip reference voltages for various system applications. The prototype ADC in a 45nm CMOS demonstrates the measured DNL and INL within 0.88LSB and 1.46LSB, respectively. The ADC shows a maximum SNDR of 61.0dB and a maximum SFDR of 74.9dB at 100MS/s, respectively. The ADC with an active die area of $0.43mm^2$ consumes 29.8mW at 100MS/s and a 1.1V supply.