• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.79-80
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• 2007

연속 동판재 생산을 위하여 전주도금 기술과 고속동도금 기술을 응용하여 동도금 공정을 개발하였다. 동 연속 전주 장비를 개발하고 적절한 동도금 조건의 개발을 통하여 연속적인 동도금 판재의 생산이 가능하게 하였다. 연속 전주 장치에서 제작된 동판재의 최종 물성을 살펴보면 두께 형성 속도는 $20{\mu}m/min$. 속도이고, 동판재의 두께 편차는 5%이내의 두께 편차를 나타내었다. 제작된 동 판재의 비저항은 $2.2{\times}10-6\;{\Omega} cm$를 나타내었으며, SEM을 이용한 표면관찰에서 void-free한 형태를 나타내었다. 판재상의 피막의 불순물은 500ppm 이하의 물성을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.49-53
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• 2009

In order to investigate the formation behavior of hollow Cu via for MEMS packaging, we observed the microstructure of the Cu vias and measured the average thickness and the thickness deviation with variations of pulse-reverse pulse current density and electrodeposition time. With electrodeposition for 3 hours at the pulse and reverse pulse current densities of $-5\;mA/cm^2$ and $15\;mA/cm^2$, the average thickness and the thickness deviation of the Cu vias were $5\;{\mu}m$ and $0.63\;{\mu}m$, respectively. With increasing the electrodeposition time to 6 hours, it was possible to form the Cu vias, of which the average thickness and thickness variation of the Cu vias were $10\;{\mu}m$ and $1\;{\mu}m$, respectively. With increasing the pulse and reverse pulse current densities to $-10\;mA/cm^2$ and $30\;mA/cm^2$, Cu vias of uniform thickness could not be formed due to the faster increase of the thickness deviation than that of the average thickness with increasing the electrodeposition time.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.148-148
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• 2009

알루미늄휠의 크롬도금은 휠의 복잡한 형상 때문에 고전류 부분인 스포크에 비해 저전류 부분인 윈도우는 도금의 두께가 얇아 부식이 발생할 가능성이 높아 도금두께를 향상시키기 위하여 보조양극을 설계, 개발하였으며 고전류와 저전류의 도금두께 편차를 줄이고 균일도금의 가능성을 확인하고 캐스시험을 통해 내식성이 향상됨을 알 수 있었다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.72-77
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• 2008

This paper investgated on fabrication process and tolerance of resistance body with a uniform thickness formed by the process of cavity type on organic substrate for application of embedded resistor. To improve the tolerance of resistance value according to a position of PCB cause by conventional screen printing, we introduced the process of cavity type from organic substrate. A resistor with a desired shape and volume was precisely formed by the process of cavity using a resistor paste and screen printing. This method can increase PCB's productivity by shortening its production time because process conditions of a screen prining device can be set quickly without any affection on its position accuracy.

• Composites Research
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• v.20 no.5
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• pp.49-55
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• 2007

Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.11
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• pp.2709-2714
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• 2014

This paper has analyzed the change of threshold voltage and conduction path for the ratio of top and bottom gate oxide thickness of asymmetric double gate MOSFET. The asymmetric double gate MOSFET has the advantage that the factor to be able to control the current in the subthreshold region increases. The analytical potential distribution is derived from Poisson's equation to analyze the threshold voltage and conduction path for the ratio of top and bottom gate oxide thickness. The Gaussian distribution function is used as charge distribution. This analytical potential distribution is used to derive off-current and subthreshold swing. By observing the results of threshold voltage and conduction path with parameters of bottom gate voltage, channel length and thickness, projected range and standard projected deviation, the threshold voltage greatly changed for the ratio of top and bottom gate oxide thickness. The threshold voltage changed for the ratio of channel length and thickness, not the absolute values of those, and it increased when conduction path moved toward top gate. The threshold voltage and conduction path changed more greatly for projected range than standard projected deviation.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.411-416
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• 2010

In this research, we intended to improve the tolerance of thick film resistor using photosensitive polymer resistor paste which was fabricated with alkali-solution developable photosensitive resin and conductive carbon black. At first, we investigated the effect of the selection of carbon black and photosensitive resin on the resistance range and tolerance level of polymer thick film resistor (PTFR). And then, a difference in resistance tolerance was evaluated according to the coating methods of photosensitive resistor paste on test board. In case that the photosensitive resistor paste was coated on whole surface of test board using screen printing, large positional tolerance was obtained because the formation of the thick film with uniform thickness was difficult. On the other hand, when the paste was coated with roller, the resistive thick film with uniform thickness was formed on the whole board area and the result of resistance evaluation showed low tolerance in ${\pm}10%$ range. The tolerance of PTFR could be improved by combination of the precise patterning using photo-process and the coating process for the resistive thick film with uniform thickness.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.293-293
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• 2012

마그네트론 스퍼터링으로 Al과 Al 합금(Al-3wt%Si, Al-10wt%Si) 박막을 코팅하였다. 기판은 냉연강판과 Si 웨이퍼를 사용하였으며 알코올과 아세톤으로 초음파 세척 후 진공용기에서 플라즈마 청정을 실서히였다. 시편 청정이 끝나면 기판은 0, 30, 45, 60, 90도의 다양한 각도로 고정시켜 Al과 Al 합금 박막을 코팅하였다. 빗각 증착 기술(Oblique Angle Deposition: OAD)은 입사증기가 기판과 수직하지 않게 기울여 코팅하는 방법으로 조직을 다양하게 제어할 수 있다. 빗각으로 코팅한 순수한 Al 박막의 경우, 동일한 두께의 박막보다 반사율 및 표면조도, 내식성이 향상되는 결과를 얻었다. 따라서 본 연구에서는 빗각 및 Si 함유량이 반사율 및 표면조도, 내식성에 미치는 영향을 비교 분석하였다. 기판의 위치에 따른 변화를 관찰하기 위해 시편은 좌, 우, 중간으로 구분하여 분석하였다. 단일층 박막의 경우 타겟과의 거리에 따른 두께 편차가 발생하였으며 이러한 두께 편차를 해결하기 위한 방법으로 동일한 각도를 유지하며 반대 방향으로 회전시켜 다층구조로 박막을 제조하였다. Si 함유량 및 빗각에 따른 반사율 및 표면조도를 분석하였으며 내식성 평가를 위한 염수 분무 테스트도 실시하여 각각의 공정 변수에 따른 결과를 비교 분석하였다.

• Journal of Advanced Marine Engineering and Technology
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• v.20 no.4
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• pp.101-107
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• 1996

This test was performed on the hydraulic automatic gauge control(AGC) system of adaptive mass flow method. Fundamental purpose of this study are performance evaluation of this AGC system under the actual rolling condition. It was concluded that the response of AGC system depends on the dynamic characteristics of a reel motor or roll position. The test results are as follows : 1) The control method of reel motor current is better than than of the roll position as AGC system. 2) The more steel strip thickness of delivery side is thick, the larger the gauge deviation is large, and the more it is thin, the larger the gauge deviation rate is large. 3) Because the gauge deviation is large at acceleration and deceleration speed than steady speed, so AGC system is better to adopt over 50m/min. By applying this AGC system, not only the accurary in strip thickness were improved but also productivity was improved dramatically.

• International Journal of Highway Engineering
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• v.9 no.2 s.32
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• pp.141-151
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• 2007

The current standards and specifications for the road pavement construction have been developed based on materials and construction methods. The pavements constructed in accordance with those specifications do not guarantee high performance of pavements since they do not consider long-term performance of pavements. Therefore, as part of the study to develop performance-based construction standards for pavements, the payment adjustment methods based on the pavement performance are currently being developed. This paper presents preliminary studies performed to develop the payment adjustment methods when there is deficiency in the concrete slab thickness that is one oi the most important factors for the pavement design and construction. First, the payment adjustment methods in USA were investigated. Then, the AASHTO failure equation, the relationship between slab thickness and stress, and the relationship between stress level and pavement life were employed to propose the payment adjustment concepts based on the pavement performance for the deficient slab thickness. The variation in the slab thickness according to measurement locations was investigated by taking cores. In addition, the measurement methods of slab thickness and the variation of measured thicknesses depending on performers were analyzed, and finally the methodology to develop the thickness deficiency ranges for the use in the payment adjustment methods was proposed.