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Investigation on Fabrication Process and Tolerance of Resistance Body with A Uniform Thickness Shape on Organic Substrate for Application of Embedded Resistor  

Park, Hwa-Sun (Samsung Electro-Mechanics Co., LTD)
Publication Information
Abstract
This paper investgated on fabrication process and tolerance of resistance body with a uniform thickness formed by the process of cavity type on organic substrate for application of embedded resistor. To improve the tolerance of resistance value according to a position of PCB cause by conventional screen printing, we introduced the process of cavity type from organic substrate. A resistor with a desired shape and volume was precisely formed by the process of cavity using a resistor paste and screen printing. This method can increase PCB's productivity by shortening its production time because process conditions of a screen prining device can be set quickly without any affection on its position accuracy.
Keywords
PCB (Printed Circuit Board); Embedded Resistor; Cavity; Screen Printing;
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