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http://dx.doi.org/10.7234/kscm.2007.20.5.049

Fabrication of Organic-Inorganic Nanocomposite Blade for Dicing Semiconductor Wafer  

Jang, Kyung-Soon (국민대학교 기계자동차공학부 기계설계 대학원)
Kim, Tae-Woo (국민대학교 기계자동차공학부 기계설계 대학원)
Min, Kyung-Yeol (주식회사 동신)
Lee, Jeong-Ick (인하공업전문대학 기계설계)
Lee, Kee-Sung (국민대학교 기계자동차공학부 기계설계 대학원)
Publication Information
Composites Research / v.20, no.5, 2007 , pp. 49-55 More about this Journal
Abstract
Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.
Keywords
Nanocomposite Blade; Dicing; Semiconductor; Wafer; Wet processing; Tape casting;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
1 Chong, C. and Davies, K., 'Plasma Grooved Buried Contact Silicon Solar Cells,' Appl. Phys. Lett., Vol. 57, No. 602, 1991
2 차영업, 최범식, 'A New Dicing Method for Semiconductor Wafer,' 대한기계학회논문집 A권, 제27권 제8호, 2003, pp. 1309-1316
3 이영길, 'SoC 기술동향 및 유망시장', KISTI, 2005.3
4 Ko, K. Y., Cha, Y. Y. and Choi, B. S., 'Monitoring of Wafer Dicing State by Using Back Propagation Algorithm,' Journal of Control Automation and Systems Engineering, Vol. 6, No. 6, 2000, pp. 486-491   과학기술학회마을
5 Subramanian, K., Ramanath, S. and Tricard, M., 'Mechanism of Material Removal in the Pression Production Grinding of Ceramics,' Journal of Manufacturing science and Engineering, Vol. 119, 1997, pp. 509-519   DOI   ScienceOn
6 Wenham, S. R., Chan, B. O., Honsberg, C. B., 'Green MA. Beneficial and Constraining Effects of Laser Scribing in Buried-contact Solar Cells,' Journal of Progress in Photovoltaics : Research & Applications, Vol. 5, No. 2, 1997, pp. 131-137   DOI   ScienceOn
7 Avagliano, S., Bianco, N., Manca, O. and Naso, V., 'Combined Thermal and Optical Anslysis of Laser Back-scribing for Amorphous-Silicon Photovoltaic Cells Processing,' International Journal of Heat & Mass Transfer, Vol. 42, No.4, 1999, pp. 509-519
8 Oklobdzija, V. G. and Barnes, E. R., 'On Implementing Addition in VLSI Technology,' IBM T. J. Watson Research Center, 1998
9 James S. Reed, 'Introduction to the Principles of Ceramic Processing,' Jhon wiley & Sons Publication, New York, USA, 1998, Ch. 20, pp. 348
10 Ko, K. Y., Cha, Y. Y. and Choi, B. S., 'Wafer Dicing State Monitoring by Signal Processing,' Journal of the Korean Society of Precision Engineering, Vol. 17, No. 5, 2000, pp. 70-75
11 김성철, 이은상, 송지복, '실리콘 웨이퍼의 초정밀 절단가공에 관한 연구', 한국공작기계학회논문집, 1999, pp. 502-506
12 Assembly Technology, 'Dicing Saw Cuts Wafers Easily, Accurately,' Machine Design, Vol. 66, 2000, No. 13
13 Hassui, A., Diniz, A. E. ey aI., 'Experimental Evaluation on Grinding Wheel Wear through Vibration and Acoustic Emission,' Wear, VoI.217, 1998, pp. 7-14   DOI   ScienceOn
14 Collier, I. T., Gibbs, M. R. J. and Seddon, N., 'Laser Ablation and Mechanical Scribing in the Amorphous Alloys VAC 6030 and METGLAS 2605 SC,' Journal of Magnetism & Magnetic Materials, Vol. 111, No. 3, 1992, pp. 260-272   DOI   ScienceOn
15 Cha, Y. Y. and Go, K. Y., 'Development of scribing machine for dicing of GaN wafer,' Journal of Control Automation and Systems Engineering, Vol. 8, No. 5, 2002, pp. 419-424   과학기술학회마을   DOI
16 Wang, A., Zhao, J., and Green, M. A., '24% Efficient Silicon Solar Cells,' Appl. Phys. Lett., Vol. 57, No. 602, 1990
17 이우석 외 5명, '저온소성 마이크로파 유전체 세라믹스 복합체의 Tape Casting 특성', 한국세라믹학회논문집, Vol. 42, No. 2, 2005, pp. 132-139   과학기술학회마을   DOI