• Title/Summary/Keyword: 나노기판

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Directed Alignment of DNA Molecule between the gold electrodes (금 전극위에 DNA 분자의 정렬에 관한 연구)

  • Hwang, Hyun Suk;Kim, Hyung Jin
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.8
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    • pp.5586-5590
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    • 2015
  • In this paper, the directed alignment methode of the DNA molecule between the Au electrodes was suggested for the application of nano devices. To fabricate the nano device coated DNA, 2-Aminoethanthiol(AET) was coated on Au electrodes which was formed using photo-lithography process on $SiO_2/Si$ substrates. In general, the AET that was a positive charge with $NH^{3+}$ was strongly combined under the electrostatic interaction with DNA molecule which had to be a negative charge. The DNA molecules could be easily aligned between Au electrodes coated with AET. The structures of the DNA molecules were investigated using AFM(Atomic force microscope), they were changed from single types to bundle according to the AET concentrations.

Preparation of binder-free IrO2-RuO2/TiO2 nanotube electrode for DSA application. (DSA 활용을 위한 바인더를 사용하지 않은 IrO2-RuO2/TiO2 나노튜브 전극 제조)

  • Yu, Hyeon-Seok;Choe, Jin-Seop
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.28-28
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    • 2018
  • 수전해(electrochemical water splitting)는 연료전지의 가역적 역반응을 이용하여 물로부터 수소와 산소를 발생시키는 기술이다. 산소는 음극에서 발생하는데, 이 때 음극 표면은 고농도의 산소 음이온 및 라디칼에 장시간 노출된다. 때문에 기계적, 화학적 내구성이 우수한 전극재를 사용할 필요가 있다. 불용성 전극 (dimensionally stable anode, DSA)은 이러한 기술적 요구사항을 잘 만족하는 상용화 된 전극이다. 티타늄이나 티타늄 합금 표면에 촉매를 미량 반복 살포하여 산화물 형태의 매우 견고한 표면을 형성함으로서 내구성을 확보한다. 그러나, 보통 DSA 제조 기법의 특징에 따라 다공성 표면 구조를 사용하지는 않기 때문에 생산 과정이 복잡하고 비용이 많이 발생하는 문제를 여전히 나타내고 있다. 본 연구는 상기 문제를 개선하기 위한 수전해용 음극 제조 기술에 관한 연구이다. 티타늄과 티타늄 합금은 동일한 양극산화 기술 적용이 가능하다는 점을 이용하여 티타늄 기판으로부터 다공성 구조를 형성함으로써 바인더의 사용을 배제하였다. 단일공정양극산화기법 (single-step anodization)을 이용하여 $IrO_2$$RuO_2$를 도핑함으로써 TiO2에 촉매능을 부여하였다. 제조된 나노튜브들의 구조적 특징을 HR-TEM (High-resolution transmission electron microscope)과 FE-SEM (Field-emission scanning electron microscope)으로 분석하고 SAED (selective area electron diffraction) 패턴을 분석하여 전극재의 결정성을 확인하였다. 알칼라인 분위기에서 일으킨 산소발생반응 (oxygen evolution reaction, OER)의 LSV (linear sweep voltammetry) 결과를 XPS (X-ray photoelectron microscoscopy) 결과와 연관지어 촉매 표면 구조와 과전압의 관계를 해석하였다. LSV 결과로부터 Tafel 분석을 연달아 수행함으로써 전극의 속도결정단계를 정의하였다. 최종적으로 사이클 테스트 통하여 DSA로써의 성능을 평가하였다.

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Variation in the Nanostructural Features of the nc-Si:H Thin Films with Substrate Temperature (수소화된 나노결정 실리콘 박막의 기판온도에 따른 나노구조 변화)

  • Nam, Hee-Jong;Son, Jong-Ick;Cho, Nam-Hee
    • Korean Journal of Materials Research
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    • v.23 no.7
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    • pp.359-365
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    • 2013
  • We investigated the nanostructural, chemical and optical properties of nc-Si:H films according to deposition conditions. Plasma enhanced chemical vapor deposition(PECVD) techniques were used to produce nc-Si:H thin films. The hydrogen dilution ratio in the precursors, [$SiH_4/H_2$], was fixed at 0.03; the substrate temperature was varied from room temperature to $600^{\circ}C$. By raising the substrates temperature up to $400^{\circ}C$, the nanocrystalite size was increased from ~2 to ~7 nm and the Si crystal volume fraction was varied from ~9 to ~45% to reach their maximum values. In high-resolution transmission electron microscopy(HRTEM) images, Si nanocrystallites were observed and the crystallite size appeared to correspond to the crystal size values obtained by X-ray diffraction(XRD) and Raman Spectroscopy. The intensity of high-resolution electron energy loss spectroscopy(EELS) peaks at ~99.9 eV(Si $L_{2,3}$ edge) was sensitively varied depending on the formation of Si nanocrystallites in the films. With increasing substrate temperatures, from room temperature to $600^{\circ}C$, the optical band gap of the nc-Si:H films was decreased from 2.4 to 1.9 eV, and the relative fraction of Si-H bonds in the films was increased from 19.9 to 32.9%. The variation in the nanostructural as well as chemical features of the films with substrate temperature appears to be well related to the results of the differential scanning calorimeter measurements, in which heat-absorption started at a substrate temperature of $180^{\circ}C$ and the maximum peak was observed at ${\sim}370^{\circ}C$.

금속중간층을 이용한 나노결정질 다이아몬드 박막 코팅

  • Na, Bong-Gwon;Myeong, Jae-U;Gang, Chan-Hyeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.99-99
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    • 2013
  • 나노결정질 다이아몬드(Nanocrystalline Diamond: NCD) 박막은 고경도와 낮은 마찰계수를 가지고 있어 초경합금이나 고속도강과 같은 절삭공구 위에 코팅하여 공구의 성능 향상을 도모하려는 노력이 있어 왔다. 그러나 NCD 박막의 잔류응력이 크고, 초경합금과 철계 금속에 NCD가 증착되지 않는다는 문제점이 있다. 따라서 잔류응력 완화와 다이아몬드 핵생성을 위하여 제3의 중간층 재료가 필요하다. 본 연구에서는 W과 Ti을 중간층으로 하여 초경합금(WC-Co)과 고속도강(SKH51)에 NCD 박막을 코팅하고 기계적 특성을 비교하였다. 초경합금 또는 고속도강기판 위에 W 또는 Ti 중간층을 DC magnetron sputter를 이용해 각 1 ${\mu}m$의 두께로 증착하고 그 위에 MPCVD (Microwave Plasma Chemical Vapor Deposition)를 이용해 NCD 박막을 2${\mu}m$의 두께로 코팅하였다. FESEM을 이용하여 표면과 단면의 형상을 관찰하였고, XRD와 Raman spectroscopy를 통해 NCD 박막의 결정성을 확인하였다. 그리고 tribology test를 실시하여 코팅된 박막의 내마모성을 비교하였으며, Rockwell C indentation test를 이용하여 밀착력을 비교하였다. 초경합금에 적용 시, W이 Ti보다 중간층으로서 더 우수한 것으로 나타났으며 이는 열팽창계수 차이에 의한 잔류응력의 차이에 의한 것으로 여겨진다. 중간층 두께에 따른 박막의 기계적 특성 변화를 알아보기 위해 W 중간층의 두께를 1, 2, 4 ${\mu}m$로 변화를 주었다. 중간층 두께가 2 ${\mu}m$ 이상일 때 박막의 밀착력이 증가되는 것으로 나타났다. 고속도강 위에 같은 방법으로 1 ${\mu}m$의 W 또는 Ti 중간층 위에 2 ${\mu}m$의 NCD 박막을 코팅한 시편들은 초경합금에 코팅한 것과 달리 두 시편 모두 낮은 밀착력을 나타내었다. 열팽창계수 차이에 의한 잔류응력을 완화하기 위해 고속도강에 W/Ti 복합박막을 중간층으로 Ti, W순으로 각각 1 ${\mu}m$ 두께로 증착 후 그 위에 NCD 박막을 2 ${\mu}m$ 두께로 코팅 한 후 특성을 비교하였다. Ti/W 복합 중간층 위에 코팅된 NCD 박막의 밀착력이 W 혹은 Ti 단일 중간층에 코팅된 박막에 비해 우수한 것으로 나타났다. 그러나 실제 공구에 적용하기에는 박막의 밀착력 개선이 요구되며 이를 위해서 더 연구가 필요하다.

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Study of relationship between diameter of carbon nanotubes and surface morphology of $Al_2O_3$ supporting layer

  • Kim, Su-Yeon;Song, U-Seok;Choe, Won-Cheol;Jeong, U-Seong;Jeon, Cheol-Ho;Park, Jong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.72-72
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    • 2010
  • 탄소나노튜브(carbon nanotubes : CNTs)는 뛰어난 전기적, 물리적인 특성을 가지고 있기 때문에 다양한 분야에서 이를 활용하려는 노력들이 활발히 이루어지고 있다. CNTs의 전기적인 특성은 직경에 의해 결정되므로, 직경을 균일하게 제어하는 일이 CNTs를 기반으로 한 전자소자 응용에 가장 중요한 사항이라 할 수 있다. 일반적으로 화학기상증착법(chemical vapor deposition, CVD)으로 합성된 CNTs의 직경은 촉매의 크기에 의존하기 때문에, 촉매의 크기를 제어하기 위한 다양한 연구들이 활발히 진행되고 있다[1-3]. 하지만 CNTs의 성장온도 근처에서 촉매 입자는 표면 확산(surface diffusion)에 의해 응집(agglomeration)되기 때문에 작고 균일한 크기의 촉매를 얻기 어렵다. 본 연구에서는 Si(001) 기판 위에 지지층(supporting layer)인 Al의 두께를 변화시켜 증착하고, 열적산화과정을 통해 $Al_2O_3$ 층을 형성한 후 Fe을 증착하여 CNTs를 합성하였다. $Al_2O_3$ 지지층과 Fe 촉매입자의 구조와 화학적 상태를 원자힘현미경 (atomic force microscopy, AFM), 주사전자현미경 (scanning electron microscopy, SEM), 투과전자현미경 (transmission electron microscopy, TEM), X-선 광전자 분광기(X-ray photoelectron spectroscopy)를 통해 분석하였고, 성장된 CNTs는 SEM, TEM, 라만 분광법 (Raman spectroscopy)을 통해 분석하였다. 그 결과, $Al_2O_3$ 층은 두께에 따라 각기 다른 표면 거칠기(RMS roughness)와 결정립(grain)의 크기를 갖게 되며, 이러한 표면구조가 Fe 촉매입자의 표면확산에 의한 응집에 관여하여 CNTs의 직경에 영향을 미치는 것을 확인하였다. 또한 $Al_2O_3$ 지지층의 두께가 15 nm인 경우, Fe의 응집현상이 억제되어 좁은 직경분포를 지닌 고순도 단일벽 탄소나노튜브(Single-walled CNTs)가 성장되는 것을 확인하였다.

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Micropattern Arrays of Polymers/Quantum Dots Formed by Electrohydrodynamic Jet (e-jet) Printing (이젯 프린터를 사용한 고분자/퀀텀닷 마이크로 패터닝 공정)

  • Kim, Simon;Lee, Su Eon;Kim, Bong Hoon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.1
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    • pp.18-23
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    • 2022
  • Electrohydrodynamic jet (e-jet) printing, a type of direct contactless microfabrication technology, is a versatile fabrication process that enables a wide range of micro/nanopattern arrays by applying a strong electric field between the nozzle and the substrate. In general, the morphology and the thickness of polymers/quantum dot micropatterns show a systematic dependence on the diameter of the nozzle and the ink composition with a fully automated printing machine. The purpose of this report is to provide typical examples of e-jet printed micropatterns of polymers/quantum dots to explain the effect of each process variable on the result of experiments. Here, we demonstrate several operating conditions that allow high-resolution printing of layers of polymers/quantum dots with a precise control over thickness and submicron lateral resolution.

Property of Nickel Silicide with 60 nm and 20 nm Hydrogenated Amorphous Silicon Prepared by Low Temperature Process (60 nm 와 20 nm 두께의 수소화된 비정질 실리콘에 따른 저온 니켈실리사이드의 물성 변화)

  • Kim, Joung-Ryul;Park, Jong-Sung;Choi, Young-Youn;Song, Oh-Sung
    • Journal of the Korean Vacuum Society
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    • v.17 no.6
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    • pp.528-537
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    • 2008
  • 60 nm and 20 nm thick hydrogenated amorphous silicon(a-Si:H) layers were deposited on 200 nm $SiO_2$/single-Si substrates by inductively coupled plasma chemical vapor deposition(ICP-CVD). Subsequently, 30 nm-Ni layers were deposited by an e-beam evaporator. Finally, 30 nm-Ni/(60 nm and 20 nm) a-Si:H/200 nm-$SiO_2$/single-Si structures were prepared. The prepared samples were annealed by rapid thermal annealing(RTA) from $200^{\circ}C$ to $500^{\circ}C$ in $50^{\circ}C$ increments for 40 sec. A four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscopy(FE-SEM), transmission electron microscopy(TEM), and scanning probe microscopy(SPM) were used to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure, and surface roughness, respectively. The nickel silicide from the 60 nm a-Si:H substrate showed low sheet resistance from $400^{\circ}C$ which is compatible for low temperature processing. The nickel silicide from 20 nm a-Si:H substrate showed low resistance from $300^{\circ}C$. Through HRXRD analysis, the phase transformation occurred with silicidation temperature without a-Si:H layer thickness dependence. With the result of FE-SEM and TEM, the nickel silicides from 60 nm a-Si:H substrate showed the microstructure of 60 nm-thick silicide layers with the residual silicon regime, while the ones from 20 nm a-Si:H formed 20 nm-thick uniform silicide layers. In case of SPM, the RMS value of nickel silicide layers increased as the silicidation temperature increased. Especially, the nickel silicide from 20 nm a-Si:H substrate showed the lowest RMS value of 0.75 at $300^{\circ}C$.

Transparent Hydrophobic Anti-Reflection Coating with SiO2\TiO2 Thin Layers (SiO2\TiO2 박막에 의한 투명 발수 반사방지 코팅)

  • Noh, Yeoung-Ah;Kim, Ki-Chul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.3
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    • pp.1-6
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    • 2017
  • Functional coatings, such as anti-reflection and self-cleaning, are frequently applied to cover glass for photovoltaic applications. Anti-reflection coatings made of mesoporous silica film have been shown to enhance the light transmittance. $TiO_2$ photocatalyst films are often applied as a self-cleaning coating. In this study, transparent hydrophobic anti-reflective and self-cleaning coatings made of $SiO_2/TiO_2$ thin layers were fabricated on a slide glass substrate by the sol-gel and dip-coating processes. The morphology of the functional coatings was characterized by field emission scanning electron microscopy (FE-SEM) and atomic force microscopy (AFM). The optical properties of the functional coatings were investigated using an UV-visible spectrophotometer. Contact angle measurements were performed to confirm the hydrophobicity of the surface. The results showed that the $TiO_2$ films exhibit a high transmittance comparable to that of the bare slide glass substrate. The $TiO_2$ nanoparticles make the film more reflective and lead to a lower transmittance. However, the transmittance of the $SiO_2/TiO_2$ thin layers is 93.5% at 550 nm with a contact angle of $110^{\circ}$, which is higher than that of the bare slide glass (2.0%).

Fabrication of Photocatalytic $TiO_2$ Thin Film Using Aerosol Deposition Method (Aerosol Deposition 법을 이용한 광촉매 $TiO_2$ 박막 제조)

  • Choi Byung-Kyu;Min Seok-Hong;Kim Jong-Oh;Kang Kyong-Tae;Choi Won-Youl
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.4 s.33
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    • pp.55-59
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    • 2004
  • We fabricates the $TiO_2$ thin film from anatase phase $TiO_2$ powder having good photocatalytic property using aerosol deposition method at room temperature. Aerosol deposition method, which sprays an aerosol powder with ultrasonic velocity and deposits a thin film on substrate at low temperature, has the advantages of low thermal stress and low cost. To fabricate the $TiO_2$ thin film, the aerosol bath pressure and chamber pressure were 500 torr and 0.4 torr, respectively. The difference of aerosol bath pressure and chamber pressure accelerated the $TiO_2$ nano powder to ultrasonic velocity through the nozzle of $0.4 mm{\times}10 mm$ and $TiO_2$ thin film was finally formed. SS mesh with diameter of 50 mm was used as a substrate to apply the $TiO_2$ thin film to water quality purification. The raw powder was dehydrated for the good dispersion of $TiO_2$ powder. To suppress the formation of second particle, the powder was dispersed for 90 min in alcohol bath by ultrasonic treatment and desiccated. The grain size of $1 {\mu}m$ was observed in $TiO_2$ thin film deposited on SUS mesh by scanning electron microscopy (SEM). The anatase phase of $TiO_2$ thin film was also observed by X-ray diffraction (XRD) and the anatase phase of raw powder was nicely maintained after aerosol deposition. The results are applicable to water treatment filter having photocatalytic reaction.

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Property of Nickel Silicides on ICP-CVD Amorphous Silicon with Silicidation Temperature (ICP-CVD 비정질 실리콘에 형성된 처리온도에 따른 저온 니켈실리사이드의 물성 변화)

  • Kim, Jong-Ryul;Choi, Young-Youn;Park, Jong-Sung;Song, Oh-Sung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.9 no.2
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    • pp.303-310
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    • 2008
  • We fabricated hydrogenated amorphous silicon(a-Si:H) 140 nm thick film on a $180\;nm-SiO_2/Si$ substrate with an inductively-coupled plasma chemical vapor deposition(ICP-CVD) equipment at $250^{\circ}C$. Moreover, 30 nm-Ni film was deposited with a thermal-evaporator sequently. Then the film stack was annealed to induce silicides by a rapid thermal annealer(RTA) at $200{\sim}500^{\circ}C$ in every $50^{\circ}C$ for 30 minuets. We employed a four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), and scanning probe microscope(SPM) in order to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure evolution, and surface roughness, respectively. We confirmed that nano-thick high resistive $Ni_3Si$, mid-resistive $Ni_2Si$, and low resistive NiSi phases were stable at the temperature of <300, $350{\sim}450^{\circ}C$, and >$450^{\circ}C$, respectively. Through SPM analysis, we confirmed the surface roughness of nickel silicide was below 12 nm, which implied that it was superior over employing the glass and polymer substrates.