• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.27-27
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• 2004

• Journal of the Korean Electrochemical Society
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• v.7 no.4
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• pp.173-178
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• 2004

Silicon thin film were synthesized from silane and argon gas mixture directly on copper foil by rf PECVD and then lithium ion batteries were prepared from them employed as the negative electrodes without any further treatment. In the present study, two different kinds of silicon thin films, amorphous silicon and copper silicide were prepared by changing deposition temperature. Amorphous silicon film was prepared below $200^{\circ}C$, but copper silicide film with granular shape was formed by the reaction between silicon radical and diffused copper ions under elevating temperature above $400^{\circ}C$. The amorphous silicon film gives higher capacity than copper silicide, but the capacity decreases sharply with charge-discharge cycling. This is possibly due to severe volume changes. The cyclability is improved, however, by employing the copper silicide as a negative electrode. The copper silicide plays an important role as an active material of the electrode, which mitigates volume change cause by the existence of silicon and copper chemical bonding and provides low electrical resistance as well.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.98-102
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• 2005

This article describes a study of chemical vapor deposition (CVD) of copper thin films on TiN substrates using (HFAC)Cu(DMB) as a precursor. The surface morphology and conformality of the Cu films as functions of substrate temperature and the presence or absence of iodine have been investigated. The surface roughness was increased significantly along with decrement of the step coverage by increasing the deposition temperature. The highest conformal films with the lowest surface roughness were obtained using the process of copper CVD, where iodine vapor were discretely introduced into the reactor during the growth of copper.

• Membrane Journal
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• v.32 no.6
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• pp.486-495
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• 2022

This study presents the improved recovery efficiency of rare metal ions through the modified separation membrane wettability and hydrogen ion permeation in the anion exchange membrane (AEM) under the recovery process of combined electrodialysis and solvent extraction. Specifically, the wettability of the separator was enhanced by hydrophilic modification on one separator surface through polydopamine (PDA) and lipophilic modification on the other surface through SiO₂ or graphene oxide (GO). In addition, the modified surface of AEM with polyethyleneimine (PEI), PDA, poly(vinylidene fluoride) (PVDF), etc. reduces the water uptake and modify the pore structure for proton ions generation. The suppressed transport resulted in the reduced hydrogen ion permeation. In the characterization, the surface morphology, chemical properties and composition of membrane or AEM were analyzed with Scanning Electron Microscopy (SEM) and Fourier Transform-Infrared Spectroscopy (FT-IR). Based on the analyses, improved extraction and stripping and hydrogen ion transport inhibition were demonstrated for the copper ion recovery system.

• Korean Chemical Engineering Research
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• v.44 no.2
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• pp.160-165
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• 2006

A Pd-Cu-Ni alloyed hydrogen membrane has fabricated on porous nickel support formed by nickel powder. Porous nickel support made by sintering shows a strong resistance to hydrogen embrittlement and thermal fatigue. Plasma surface modification treatment is introduced as pre-treatment process instead of conventional HCl wet activation. Nickel was electroplated to a thickness of $2{\mu}m$ in order in to fill micropores at the nickel support surface. Palladium and copper were deposited at thicknesses of $4{\mu}m$ and $0.5{\mu}m$, respectively, on the nickel coated support by DC sputtering process. Subsequently, copper reflow at $700^{\circ}C$ was performed for an hour in $H_2$ ambient. And, as a result PdCu-Ni composite membrane has a pinhole-free and extremely dense microstructure, having a good adhesion to the porous nickel support and infinite hydrogen selectivity in $H_2/N_2$ mixtures.

• The Korean Journal of Malacology
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• v.31 no.2
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• pp.151-158
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• 2015

This study was conducted to find out the changes of survival, respiration and organ structure of Tegillarca granosa exposed to copper (Cu). Experimental period was four weeks. Experimental groups were composed of one control condition and three copper exposure conditions (0.125, 0.250 and 0.500 mg/L). The results of the study confirmed that copper induces reduction of survival rate and respiration rate and histopathology of organ structure of the bivalve. In the copper concentration of 0.500 mg/L, mortality was 66.7% after Cu exposure of 4 weeks. Respiration rate was observed exposure groups lower than control decline by 18%. Histological analysis of organ system illustrated degeneration of epithelial layer and connective tissue layer of the mantle. Also, histological degenerations as epithelial atrophy and disappearance of lateral cilia are recognized in the gill and it was observed expansion of hemolymph sinus, disruption of epithelial layer, acidification of mucous and degeneration of muscle fiber bundles in the foot. In the digestive diverticulum, it was showed atrophy and destruction of basophilic cell and epithelial cell in the digestive tubules.

• Journal of the Korean Vacuum Society
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• v.12 no.3
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• pp.174-181
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• 2003

Ta diffusion barriers have been deposited on Si (100) substrate by applying a negative substrate bias voltage. The effect of the substrate bias voltage on the properties of the Ta films was investigated. In the case of the Ta films deposited without the substrate bias voltage, a columnar structure and small grains were observed distinctly, and the electrical resistivity of the deposited Ta films was very high (250 $\mu\Omega$cm). By applying the substrate bias voltage, no clear columnar structure and grain boundary were observed. The resistivity of the Ta films decreased remarkably and at a bias voltage of -125 V, reaching a minimum value of 40 $\mu\Omega$cm, which is close to that of Ta bulk (13 $\mu\Omega$cm). The thermal stability of Cu(100 mm)/Ta(50 mm)/Si structures was evaluated after annealing in H2 atmosphere for 60 min at various temperatures. The Ta films deposited by applying the substrate bias voltage were found to be stable up to $600^{\circ}C$, while the Ta films deposited without the substrate bias voltage degraded at $400^{\circ}C$.

• Journal of the Korean Chemical Society
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• v.55 no.4
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• pp.620-625
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• 2011

A simple, rapid potentiometric back titration of Isoniazid (INH) in the presence of Rifampicin (RIF) in tablets and syrups is described. The method is based on the oxidation of INH by a known excess of copper (II) ion and the back titration of unreacted copper (II) ion potentiometrically with ascorbic acid using a lab-made Copper Based Mercury Film Electrode (CBMFE). The titration conditions have been optimized for the determination of 1.0-10.0 mg of INH in pure and dosage forms. The precision and accuracy of the method have been assessed by the application of lack-of-fit test and other statistical methods. Interference was not caused by RIF and other excipients present in dosage forms. Application of the method for INH assay in tablets and syrups was validated by comparison of the results of proposed method with that of the British Pharmacopoeia (BP) method using F- and t- statistical tests of significance.

• Clean Technology
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• v.8 no.3
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• pp.151-165
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• 2002

In the treatment of the wastewater containing metals($Cu^{2+}$, $Zn^{2+}$, $Ni^{2+}$, $Cr^{3+}$) by using batch precipitation and flocculation followed by membrane filtration, permeate flux and removal efficiency were investigated according to by the effect of pH and coagulants, and the type of membranes used and pore size. It was found that it is most effective to use $0.45{\mu}m$-polysulfone membrane and coagulant(PAC) at the conditions of the pH of 10.0~10.5 for the case of copper containing wastewater, $0.1{\mu}m$-PVDF membrane and coagulant(PAC) at the conditions of the pH of 10.0~10.5 for the case of zinc containing wastewater, $0.1{\mu}m$-PVDF membrane and coagulant at the conditions of the pH of 11.0~11.5 for the case of nickel containing wastewater, $0.2{\mu}m$ membrane and coagulant at the conditions of the pH of 8.0~8.5 for the case of chromic containing wastewater, and $0.2{\mu}m{\sim}0.45{\mu}m$ membrane and coagulant at the conditions of the pH of 11.0~11.5 for the case mixture wastewater. The permeate flux could higher as to be used coagulants except for the case of copper containing wastewater.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.129-129
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• 2014

본 연구는 알루미늄 및 구리 캐리어 소재상에 화학 동도금(Chemical Copper)으로 형성된 극박 동박 표면 및 석출막의 특성 평가에 관한 연구이다. 평가에 사용된 극박 동박은 현재 캐리어박 선점률이 높은 M, J, Y사의 제품이다. 최상층 구리 표면에서 조직, 조성, 표면조도를 평가하였고, 단면 평가에서는 copper layer 및 nodule layer, adhesion layer, anti-corrosion layer, release layer, substrate에서의 물성 및 특성을 평가하였다.