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Characteristic of Pd-Cu-Ni Alloy Hydrogen Membrane using the Cu Reflow  

Kim, Dong-Won (Department of Advanced Materials Engineering, Kyonggi University)
Kim, Heung-Gu (Department of Advanced Materials Engineering, Kyonggi University)
Um, Ki-Youn (Department of Advanced Materials Engineering, Kyonggi University)
Kim, Sang-Ho (Department of Materials Engineering, Korea University of Technology and Education)
Lee, In-Seon (Department of Materials Engineering, Korea University of Technology and Education)
Park, Jong-Su (Korea Institute of Energy Research)
Ryi, Shin-Kun (Korea Institute of Energy Research)
Publication Information
Korean Chemical Engineering Research / v.44, no.2, 2006 , pp. 160-165 More about this Journal
Abstract
A Pd-Cu-Ni alloyed hydrogen membrane has fabricated on porous nickel support formed by nickel powder. Porous nickel support made by sintering shows a strong resistance to hydrogen embrittlement and thermal fatigue. Plasma surface modification treatment is introduced as pre-treatment process instead of conventional HCl wet activation. Nickel was electroplated to a thickness of $2{\mu}m$ in order in to fill micropores at the nickel support surface. Palladium and copper were deposited at thicknesses of $4{\mu}m$ and $0.5{\mu}m$, respectively, on the nickel coated support by DC sputtering process. Subsequently, copper reflow at $700^{\circ}C$ was performed for an hour in $H_2$ ambient. And, as a result PdCu-Ni composite membrane has a pinhole-free and extremely dense microstructure, having a good adhesion to the porous nickel support and infinite hydrogen selectivity in $H_2/N_2$ mixtures.
Keywords
Cu Reflow; Porous Nickel Support; Pd-Cu-Ni Alloyd Hydrogen Membrane; Plasma Surface Treatment; Electroplating; Sputtering Deposition;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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