• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.8
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• pp.1747-1752
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• 2012

The SiOC film of carbon centered system was prepared using bistrimethylsilylmethane (BTMSM) and oxygen mixed precursor by the chemical vapor deposition. The dielectric constant is measured by MIS(metal/insulator/Si) structure, but it could decrease the reliability because the uniformity is not assured. To research the dielectric constant of SiOC film, the range of low polarization was researched in SiOC film using the optical analysis and hardness, and then calculated the dielectric constant of SiOC film with amorphous structure of high degree. After annealing, the dielectric constant of SiOC film was decreased owing to the lowering of polarization, and FTIR spectra of the main bond was shifted to higher wave number. The main bond of 950~1200 cm-1 was composed of the Si-C and Si-O bonds. The intensity increases in Si-O bond infers the bonding strength became stronger than that of deposited film. Annealed SiOC film showed 2.06 in dielectric constant.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.287-295
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• 2019

Privacy films are typically manufactured by combining black resin and transparent louver-shaped patterns. The use of black resin results in excellent light-shielding. However, black resin can reduce the transmittance of privacy films at the front viewing angle. In this study, we applied $SiO_2/SiON$ multi-layer thin films on a privacy film to maintain transmittance at the front viewing angle and improve light-shielding at the side viewing angle. We determined the optimum combination of thicknesses of the $SiO_2/SiON$ multi-layer stacks to increase the overall transmittance; the light shielding could be maximized at the side viewing angle.

• Electrical & Electronic Materials
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• v.9 no.4
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• pp.336-343
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• 1996

We have studied the preparation and the properties of $Ba_{1-x}$Sr$_{x}$TiO$_{3}$(BST) thin films by using the sol-gel method. Through the comparison of the effects of various solvents and additives in making solutions, we establish the production method of the stable solution which generates the high quality of BST film. We also set up the heat-treatment conditions for depositing the BST thin film through the TGA and XRD analyses. Through the comparison of the surface conditions of BST films deposited on Pt/Ta/SiO$_{2}$/Si and Pt/Ti/SiO$_{2}$/Si substrates, we find that Ta is more efficient diffusion barrier of Si than Ti so that Ta layer prevents the formation of hillocks. We fabricate the planar type capacitor and measure the dielectric properties of the BST thin film deposited on the Pt/Ta/SiO$_{2}$/Si substrate. Dielectric constant and dielectric loss tangent at 1V, 10kHz, and leakage current density at 3V of the BST thin film are 339, 0.052 and 13.3.mu.A/cm$^{2}$, respectively.ely.

• Journal of the Korean Ceramic Society
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• v.35 no.6
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• pp.535-542
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• 1998

SOI(silicon oninsulator) was fabricated through the direct bonding of a hydrophilized single crystal Si wafer and a thermally oxidized SiO2 thin film to investigate the stacking faults in silicon at the Si/SiO2 in-terface. At first the oxidation kinetics of SiO2 thin film and the stacking fault distribution at the oxidation interface were investigated. The stacking faults could be divided into two groups by their size and the small-er ones were incorporated into the larger ones as the oxidation time and temperature increased. The den-sity of the smaller ones based critically lower eventually. The SOI wafers directly bonded at the room temperature were annealed at 120$0^{\circ}C$ for 1 hour. The stacking faults at the bonding and oxidation interface were examined and there were anomalies in the distributions of the stacking faults of the bonded region to arrange in ordered ring-like fashion.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.45 no.2
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• pp.242-248
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• 1996

The properties of TiN/TiSi$_{2}$ bilayer formed by a rapid thermal annealing is investigated when thin SiO$_{2}$ film exists at the Ti-Si interface. The competitive reaction for the TiN/TiSi_2 bilayer occurs above 600 .deg. C. The thickness of the TiSi$_{2}$ layer decreases with increasing SiO$_{2}$ film thickness and also decreases with increasing anneal temperture When the competitive reaction for the TiN/TiSi$_{2}$ bilayer is occured by rapid thermal annealing, the composition of TiN layer represents TiN$_{x}$O$_{y}$ due to the SiO$_{2}$ layer at the Ti-Si interface but the structures of the TiN and TiSi$_{2}$ layers were not changed.d.d.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.9
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• pp.2065-2070
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• 2010

The diluted PMMA treated $SiO_2$ films as an passivation materials for semiconductor devices was researched by using the FTIR spectra. The diluted PMMA solution with various ratios changed the surface of $SiO_2$ film as the hydrophilic, hydrophobic or hybrid type properties. The sample 7 with little carbon content showed dramatically the chemical variation by the FTIR spectra analysis. Beacuse the little carbon with electrons decreased the polarity and surface energy on the $SiO_2$ film, and then became a stable bonding structure and decreased the leakage current. The FTIR spectra can define the detail variation due to the chemical reaction on the organic thin film, and help to research the characteristic of the organic materials.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.5
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• pp.8-14
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• 2007

In this paper, $HfO_2$/Hf stacked film has been applied as the gate dielectric in MOS devices. The $HfO_2$ thin film was deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$ as precursors. Prior to the deposition of the $HfO_2$ film, a thin Hf metal layer was deposited as an intermediate layer. Round-type MOS capacitors have been fabricated on Si substrates with 2000${\AA}$-thick Al or Pt top electrode. The prepared film showed the stoichiometric components. At the $HfO_2$/Si interface, both Hf-Si and Hf-Si-O bonds were observed, instead of Si-O bond. The sandwiched Hf metal layer suppressed the growing of $SiO_x$ layer so that $HfSi_xO_y$ layer was achieved. It seems that the intermediate Hf metal layer has a benefit for the enhancement of electric characteristics of gate dielectric in $HfO_2$/Si structure.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.5
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• pp.211-213
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• 2005

[$SiO_2$] film coated as a passivation layer for YBCO based electronic devices is investigated by measuring the micro wave properties of micro strip line resonators. The $SiO_2$ film coated resonators are compared with coated resonators for two degradation conditions, a $200^{\circ}C$ annealing in air and an exposure to air at $85^{\circ}C\;85\%$ relative humidity. The $SiO_2$ film reduces the YBCO thin film degradation caused by oxygen stoichiometry change and reaction with water.

• Journal of Magnetics
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• v.12 no.1
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• pp.21-26
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• 2007

Si-based electromagnetic noise suppressors on coplanar waveguide transmission lines incorporated with a $SiO_2$ dielectric layer and a nanogranular Co-Fe-Al-O magnetic thin film are reported. Unlike glass-based devices, large signal attenuation is observed even in the bare structure without coating the magnetic thin film. Much larger signal attenuation is achieved in fully integrated devices. The transmission scattering parameter ($S_{21}$) is as small as -90 dB at 20 GHz at the following device dimensions; the thicknesses of the $SiO_2$ and Co-Fe-Al-O thin films are 0.1 $\mu$m and 1 $\mu$m, respectively, the length of the transmission line is 15 mm, and the width of the magnetic thin film is 2000 $\mu$m. In all cases, the reflection scattering parameter ($S_{11}$) is below -10 dB over the whole frequency band. Additional distributed capacitance formed by the Cu transmission line/$SiO_2$/Si substrate is responsible for these characteristics. It is considered that the present noise suppressors based on the Si substrate are a first important step to the realization of MMIC noise suppressors.

• Textile Coloration and Finishing
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• v.30 no.3
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• pp.190-198
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• 2018

We fabricated high transmission and high scattering poly(ethylene-co-vinyl acetate)(EVA) films embedding $SiO_2$ nanoparticles to improve outcoupling efficiency in organic display. The 800nm diameter $SiO_2$ nanoparticles aggregated and formed $1.56{\mu}m$ (with ${\pm}0.853{\mu}m$ standard deviation) diameter microparticles in EVA. The total transmission of scattering film was 83.3% on Polyethylene terephthalate(PET), which was higher than reference 82.8% PET substrate. The diffuse transmission and haze of the $SiO_2$ embedded EVA film were 76.1% and 91.4%, respectively. The optimized condition was 1:1 weight ratio of $SiO_2$ nanoparticles to EVA in Tetrahydrofuran(THF) solution. When the ratio of $SiO_2$ was larger than 1, the total transmission decreased by the increase in backscattering of light due to high scattering. With the optimized condition, we could succeed to fabricate a large scale film(35m in length) with a roll-to-roll process.