• 한국전기전자재료학회논문지
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• 제19권7호
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• pp.605-610
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• 2006

We have investigated $Al_{0.25}Ga_{0.75}As/In_{0.2}Ga_{0.8}As$ structures for pseudomorphic high electron mobility transistor(pHEMT), which were grown by molecular beam epitaxy(MBE) and consequently annealed by rapid thermal anneal(RTA), using Hall measurement, photoluminescence, and transmission electron microscopy (TEM). According to intensity and full-width at half maximum maintained stable at the same energy level, the quantized energy level in $Al_{0.25}Ga_{0.75}As/In_{0.2}Ga_{0.8}As$ quantum wells was independent of the RTA conditions. However, the Hall mobility was decreased from $6,326cm^2/V.s\;to\;2,790cm^2/V.s\;and\;2,078cm^2/V.s$ after heat treatment respectively at $500^{\circ}C\;and\;600^{\circ}C$. The heat treatment which is indispensable during the fabrication procedure would cause catastrophic degradation in electrical transport properties. TEM observation revealed atomically non-uniform interfaces, but no dislocations were generated or propagated. From theoretical consideration about the mobility changes owing to inter-diffusion, the degraded mobility could be directly correlated to the interface scattering as long as samples were annealed below $600^{\circ}C$ lot 1 min.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.160-163
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• 1996

To develope output characteristics of GaAs MESFET, which utilized in high frequency ranges, $Al_{0.2}$Ga$_{0.8}$As/GaAs layer was used. In this case, to minimize effects of deep-level in $Al_{0.2}$Ga$_{0.8}$As/GaAs layer, aluminium mole fraction was design to 0.2. HP 4145B was used in measurement, I$_{dss}$ was 25mA when V$_{G}$=0. Maximum transconductance was 168.75mS/mm, electron mobility was 3750 $\textrm{cm}^2$/V-s, therefore, it must be suitable for active device in MMIC. Also, Ideality factor was 1.26, which was similar to that of ideal schottky diode.

• 한국진공학회지
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• 제19권2호
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• pp.134-140
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• 2010

Metal-organic chemical vapour deposition (MOCVD)법으로 성장된 $In_{0.5}(Ga_{1-x}Al_x)_{0.5}P$/GaAs 이중 이종접합 구조의 특성을 contactless electroreflectance (CER) 분광법으로 조사하였다. CER 측정은 변조전압($V_{ac}$), 온도 및 dc 바이어스 전압($V_{bias}$)의 함수로 수행하였다. 상온에서는 5개의 신호가 관측되었는데, 이 신호들은 각각 GaAs, $In_{0.5}Ga_{0.5}P$, $In_{0.5}(Ga_{0.73}Al_{0.27})_{0.5}P$, $In_{0.5}(Ga_{0.5}Al_{0.5})_{0.5}P$ 및 $In_{0.5}(Ga_{0.2}Al_{0.8})_{0.5}P$ 전이에 관련된 것이다. CER 스펙트럼의 온도 의존성으로부터 Varshni 계수 및 평탄인 자를 구하였다. 그리고 인가전압에 따른 신호의 진폭은 순방향 바이어스 전압 인가시 점차로 감소하나, 역방향 바이어스 전압 인가시에는 반대의 경향을 보였다.

• 센서학회지
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• 제30권6호
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• pp.436-440
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• 2021

The impact of the gate length (L_g) on the DC and high-frequency characteristics of indium-rich In_0.8Ga_0.2As channel high-electron mobility transistors (HEMTs) on a 3-inch InP substrate was inverstigated. HEMTs with a source-to-drain spacing (L_SD) of 0.8 ㎛ with different values of L_g ranging from 1 ㎛ to 19 nm were fabricated, and their DC and RF responses were measured and analyzed in detail. In addition, a T-shaped gate with a gate stem height as high as 200 nm was utilized to minimize the parasitic gate capacitance during device fabrication. The threshold voltage (V_T) roll-off behavior against L_g was observed clearly, and the maximum transconductance (g_{m_max}) improved as L_g scaled down to 19 nm. In particular, the device with an L_g of 19 nm with an L_SD of 0.8 mm exhibited an excellent combination of DC and RF characteristics, such as a g_{m_max} of 2.5 mS/㎛, On resistance (R_ON) of 261 Ω·㎛, current-gain cutoff frequency (f_T) of 738 GHz, and maximum oscillation frequency (f_max) of 492 GHz. The results indicate that the reduction of L_g to 19 nm improves the DC and RF characteristics of InGaAs HEMTs, and a possible increase in the parasitic capacitance component, associated with T-shap, remains negligible in the device architecture.

• 전자공학회논문지A
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• 제28A권1호
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• pp.30-39
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• 1991

The influence of physical parameters (Al mole fraction, thickness, doping concentration) in the window and emitter on the efficiency characteristics of heteroface p-$Al_{x}Ga_{1-x}As/p-GaAs/n-GaAs/n^{+}$-GaAs solar cell is investigated. The maximum efficiency theoretically calculated in this device is obtained when a thickness of the window is in a range of (400-1000))$\AA$and a thickness/doping concentration of the emitter is in a range of (0.5-0.8)$\mu$m/(1-7)${\times}10^{17}cm^{-3}$, respectively. Also is the efficiency improved according to the increase of Al mole fraction in the indirect gap window(0.41${\le}x{\le}1.0$). The optimum designed heteroface cell with an area of 0.165cm$^2$fabricated using MOCVD exhibits an active area conversion efficiency of 17%, having a short circuit current density of 21.2mA/cm\ulcorner an open circuit voltage of 0.94V, and a fill factor of 0.75 under ELH-100mW/cm$^2$illumination.

• 대한전자공학회논문지SD
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• 제43권5호
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• pp.25-33
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• 2006

전달 행렬 방법과 capacitance-voltage 특성, 그리고 측정된 광응답 스펙트럼을 이용하여 Schottky 다이오드 UV-A와 B 광검출기에 사용되는 GaN, $Al_{0.2}Ga_{0.8}N$ 등의 반도체 및 Schottky 접촉 금속 Ni의 물질특성인 흡수계수(absorption coefficient)를 추출하였다. 입사된 빛이 반도체의 공핍영역에서 흡수되는 양을 구하고, 이로부터 각 파장에서의 광응답 특성을 얻는 과정을 컴퓨터 프로그램으로 구현하였다. 그리고, 계산 값을 측정치와 비교하여 각 파장에서 GaN, $Al_{0.2}Ga_{0.8}N$, Ni의 흡수계수를 얻을 수 있었다. 추출된 흡수계수를 이용하여 자외선 광검출기의 광응답을 높이는 설계 방안을 모색하였다. Ni의 흡수계수가 크기 때문에 광응답을 결정하는 주요 요소는 Ni 전극의 두께이다. 따라서 Schottky 접촉 금속 Ni의 두께를 줄이고, 공핍 영역의 크기를 늘릴 수 있다면 광응답 특성이 더욱 향상된 광검출기의 실현이 가능해질 것이다.

• 한국진공학회지
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• 제5권3호
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• pp.206-212
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• 1996

저압MOCVD 방법을 이용하여 76 Torr에서 $In_{1-x}Ga_xAs$ 에피층을 성장하였다. 성장온도에 따른 성장속도의 변화는 크지 않았으며, 격자불일치와 성장온도, $AsH_3/(TMIn+TMGa)$ 비에 따라 표면형상이 변화하는 경향성을 관찰하였다. 깨끗한 byaus을 가지는 $In_{1-x}Ga_xAs$ 에피층의 5K PL 측정을 통하여 2.8meV 반가폭을 가지는 결정성이 좋은 에피가 성장되었음을 확인하였다. 성장온도에 따른 조성의 변화는 크지 않았으며, 고체상에서의 $In_{1-x}Ga_xAs$ 조성은 기체상에서의 원료가스의 확산단계에 의해 결정되었다. 격자불일치와 성장온도가 $In_{1-x}Ga_xAs$ 에피층의 전기적 특성을 결정하는 가장 중요한 변수로 확인되었고, 최적조건에서 성장한 에피층에 대해 상온에서 $8{\times}10^{14}/cm^3$의 전자농도와 11,000$\textrm{cm}^2$/V.sec 의 전자이동도를 얻었다.

• 한국환경농학회지
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• 제42권4호
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• pp.389-395
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• 2023

This study evaluated the effects of gibberellic acid (GA₃) on the growth and quality of creeping bentgrass (Agrostis palustris Huds.). Experimental treatments included a No application of fertilizer and GA₃ (NFG) Control [3 N active ingredient (a.i.) g/m²], 0.3GA₃ (GA₃ 0.3 a.i. mg/m²/200 mL), 0.6GA₃ (GA₃ 0.6 a.i. mg/m²/200 mL), 1.2GA₃ (GA₃ 1.2 a.i. mg/m²/200 mL), and 2.4GA₃ (GA₃ 2.4 a.i. mg/m²/200 mL). Additionally, the study included a 1.5N+GA₃ experiment with similar GA₃ treatments combined with 1.5N a.i. g/m² : NFG, Control (3N a.i. g/m²), 1.5N+ 0.3GA₃ (1.5N a.i. g/m²+GA₃ 0.3 a.i. mg/m²/200 mL), 1.5N+0.6GA₃ (1.5N a.i. g/m²+GA₃ 0.6 a.i. mg/m²/200 mL), 1.5N+1.2GA₃ (1.5N a.i. g/m²+GA₃ 1.2 a.i. mg/m²/ 200 mL), and 1.5N+2.4GA₃ (1.5N a.i. g/m²+GA₃ 2.4 a.i. mg/m²/200 mL). Compared to the NFG, turf color index chlorophyll content was not significantly different (p< 0.05). However, shoot length in 1.2GA₃, 2.4GA₃, 1.5N+0.3GA₃, 1.5N+0.6GA₃, 1.5N+1.2GA₃, and 1.5N+2.4GA₃ treatments increased by 0.8%, 10.6%, 5.15%, 8.3%, 13.5 %, and 21.6%, respectively, compared to the control. As compared to the control, clipping yield in 1.5N+1.2GA₃ and 1.5N+2.4GA₃ treatments increased by 7.1% and 14.3 %, respectively. These results indicated that GA₃ application increased shoot length, with the 1.2GA₃ treatment showing shoot length similar to the control (3N a.i. g /m² ).

• 한국재료학회지
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• 제21권8호
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• pp.461-467
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• 2011

Cu(In, Ga)$Se_2$ (CIGS) precursor films were electrodeposited on Mo/glass substrates in acidic solutions containing $Cu^{2+}$, $In^{3+}$, $Ga^{3+}$, and $Se^{4+}$ ions at -0.6 V (SCE) and pH. 1.8. In order to induce recrystallization, the electrodeposited $Cu_{1.00}In_{0.81}Ga_{0.09}Se_{2.08}$ (25.0 at.% Cu + 20.2 at.% In + 2.2 at.% Ga + 52.0 at.% Se) precursor films were annealed under a high Se gas atmosphere for 15, 30, 45, and 60 min, respectively, at $500^{\circ}C$. The Se amount in the film increased from 52 at.% to 62 at.%, whereas the In amount in the film decreased from 20.8 at.% to 9.1 at.% as the annealing time increased from 0 (asdeposited state) to 60 min. These results were attributed to the Se introduced from the furnace atmosphere and reacted with the In present in the precursor films, resulting in the formation of the volatile $In_2Se$. CIGS precursor grains with a cauliflower shape grew as larger grains with the $CuSe_2$ and/or $Cu_{2-x}Se$ faceted phases as the annealing times increased. These faceted phases resulted in rough surface morphologies of the CIGS films. Furthermore, the CIGS layers were not dense because the empty spaces between the grains were not removed via annealing. Uniform thicknesses of the $MoSe_2$ layers occurred at the 45 and 60 min annealing time. This implies that there was a stable reaction between the Mo back electrode and the Se diffused through the CIGS film. The results obtained in the present research were sufficiently different from comparable studies where the recrystallization annealing was performed under an atmosphere of Ar gas only or a low Se gas pressure.

• Transactions on Electrical and Electronic Materials
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• 제18권5호
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• pp.253-256
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• 2017

A thin Te interlayer was applied to a Ni/n-InGaAs contact to reduce the contact resistance between Ni-InGaAs and n-InGaAs. A 5-nm-thick Te layer was first deposited on a Si-doped n-type $In_{0.53}Ga_{0.47}As$ layer, followed by in situ deposition of a 30-nm-thick Ni film. After the formation of the Ni-InGaAs alloy by rapid thermal annealing at $300^{\circ}C$ for 30 s, the extracted specific contact resistivity (${\rho}_c$) reduced by more than one order of magnitude from $2.86{\times}10^{-4}{\Omega}{\cdot}cm^2$ to $8.98{\times}10^{-6}{\Omega}{\cdot}cm^2$ than that of the reference sample. A thinner Ni-InGaAs alloy layer with a better morphology was obtained by the introduction of the Te layer. The improved interface morphology and the graded Ni-InGaAs layer formed at the interface were believed to be responsible for ${\rho}_c$ reduction.