• 센서학회지
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• 제13권6호
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• 정보저장시스템학회논문집
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• 제2권3호
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• pp.163-168
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• 2006

Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

• Journal of Welding and Joining
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• 제29권1호
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• pp.29-32
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• 2011

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.47-51
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• 2013

본 연구에서는 웨이퍼 레벨 Cu 본딩을 이용한 3D 적층 IC의 개발을 위해 2단계 기계적 화학적 연마법(CMP)을 제안하고 그 결과를 고찰하였다. 다마신(damascene) 공정을 이용한 $Cu/SiO_2$ 복합 계면에서의 Cu dishing을 최소화하기 위해 Cu CMP 후 $SiO_2$ CMP를 추가로 시행하였으며, 이를 통해 Cu dishing을 $100{\sim}200{\AA}$까지 낮출 수 있었다. Cu 범프의 표면거칠기도 동시에 개선되었음을 AFM 관찰을 통해 확인하였다. 2단 CMP를 적용하여 진행한 웨이퍼 레벨 Cu 본딩에서는 dishing이나 접합 계면이 관찰되지 않아 2단 CMP 공정이 성공적으로 적용되었음을 확인할 수 있었다.

• 마이크로전자및패키징학회지
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• 제13권4호
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• pp.1-7
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• 2006

WLCSP(wafer level chip size package)는 웨이퍼 레벨에서 패키지 공정이 이루어지는 차세대 패키지 중 하나이다. WLCSP는 웨이퍼 레벨에서 패키지 공정이 이루어진다는 특징으로 인하여 웨이퍼당 생산되는 반도체 칩의 수에 따라 그 패키징 비용을 크게 줄일 수 있다는 장점이 있다. 그러나 응력 버퍼 역할을 하는 기판을 없애는 혁신적인 구조로 인하여 솔더 조인트의 신뢰성이 기존의 BGA 패키지에 비하여 취약하게 되는데, 이러한 솔더 조인트 신뢰성에 대하여 반도체 칩과 솔더볼을 연결하는 폴리머 절연층은 열팽창계수 차이에 의해 발생하는 응력을 흡수하는 중요한 역할을 하게 된다. 본 연구에서는 하이닉스에서 개발한 Omega-CSP를 사용하여 솔더볼 배열 변화와 제 1 절연층의 특성에 따른 솔더 조인트의 열피로 특성을 평가하였다. 그 결과 절연층의 특성 변화가 솔더 조인트의 열피로 특성에 주는 영향은 솔더볼 배열 구조에 따라 변화되는 것을 확인하였다.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1297-1305
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• 2004

Reliability of MEMS devices is receiving more attention as they are heading towards commercial production. In particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out several reliability tests such as environmental storage, fatigue, shock, and vibration, and we investigated the failure mechanisms of the anodically bonded vacuum gyroscope sensors. It was found that successful vacuum packaging could be achieved through reducing outgassing inside the cavity by deposition of titanium as well as by pre-taking process. The current gyroscope structure is found to be safe from fatigue failure for 1000 hours of operation test. The gyroscope sensor survives the drop and vibration tests without any damage, indicating robustness of the sensor. The reliability test results presented in this study demonstrate that MEMS gyroscope sensor is very close to commercialization.

• 센서학회지
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• 제20권1호
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• pp.58-63
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• 2011

A low loss radio frequency(RF) micro electro mechanical systems(MEMS) switch driven by a low actuation voltage was designed for the development of a new RF MEMS switch. The RF MEMS switch should be encapsulated. The glass cap and fabricated RF MEMS switch were assembled by the Au/Sn eutectic bonding principle for wafer-level packaging. The through-vias on the glass substrate was made by the glass dry etching and Au electroplating process. The packaged RF MEMS switch had an actuation voltage of 12.5 V, an insertion loss below 0.25 dB, a return loss above 16.6 dB, and an isolation value above 41.4 dB at 6 GHz.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• 한국정밀공학회지
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• 제22권11호
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.43-49
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• 2007

웨이퍼 레벨 솔더범핑시 under bump metallurgy (UBM)의 종류와 리플로우 시간에 따른 Sn 솔더범프의 평균 금속간화합물 층의 두께와 UBM의 소모속도를 분석하였다. Cu UBM의 경우에는 리플로우 이전에 $0.6\;{\mu}m$ 두께의 금속간화합물 층이 형성되어 있었으며, $250^{\circ}C$에서 450초 동안 리플로우함에 따라 금속간화합물 층의 두께가 $4\;{\mu}m$으로 급격히 증가하였다. 이에 반해 Ni UBM에서는 리플로우 이전에 $0.2\;{\mu}m$ 두께의 금속간화합물 층이 형성되었으며, 450초 리플로우에 의해 금속간화합물의 두께가 $1.7\;{\mu}m$으로 증가하였다. Cu UBM의 소모속도는 15초 리플로우시에는 100 nm/sec, 450초 리플로우시에는 4.5 nm/sec이었으나, Ni UBM에서는 소모속도가 15초 리플로우시에는 28.7 nm/sec, 450초 리플로우시에는 1.82 nm/sec로 감소하였다.