Browse > Article
http://dx.doi.org/10.5369/JSST.2011.20.1.58

Wafer-Level Package of RF MEMS Switch using Au/Sn Eutectic Bonding and Glass Dry Etch  

Kang, Sung-Chan (School of Electrical Engineering, Seoul National University)
Jang, Yeon-Su (School of Electrical Engineering, Seoul National University)
Kim, Hyeon-Cheol (School of Electrical Engineering, Ulsan University)
Chun, Kuk-Jin (School of Electrical Engineering, Seoul National University)
Publication Information
Journal of Sensor Science and Technology / v.20, no.1, 2011 , pp. 58-63 More about this Journal
Abstract
A low loss radio frequency(RF) micro electro mechanical systems(MEMS) switch driven by a low actuation voltage was designed for the development of a new RF MEMS switch. The RF MEMS switch should be encapsulated. The glass cap and fabricated RF MEMS switch were assembled by the Au/Sn eutectic bonding principle for wafer-level packaging. The through-vias on the glass substrate was made by the glass dry etching and Au electroplating process. The packaged RF MEMS switch had an actuation voltage of 12.5 V, an insertion loss below 0.25 dB, a return loss above 16.6 dB, and an isolation value above 41.4 dB at 6 GHz.
Keywords
Wafer-level Package; RF MEMS switch; Eutectic Bonding; Glass dry etch;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 M. Sakata, Y. Komura, T. Seki, K. Kobayashi, K. Sano, and S. Horiike, “Micromachined relay which utilizes single crystal silicon electrostatic actuator”, 12th IEEE International Conference on Micro Electro Mechanical Systems, pp. 21-24, Orlando, USA, 1999.
2 E. Lee, W. Kim, I. Song, S. Moon, H. C. Kim, M. K. Kang, S. D. Choi, and K. Chun, “Wafer level lateral bonding scheme with LEGO-like structure”, Sensors and Materials, vol. 16, no. 5, pp. 227-236, 2005.
3 K. H. Na, I. H. Kim, E. S. Lee, H. C. Kim, and K. Chun, “Adhesive bonding using thick polymer film of SU-8 photoresist for wafer level package”, J. Kor. Sensors Soc., vol. 16, no. 5, pp. 325-330, 2007.   과학기술학회마을   DOI   ScienceOn
4 T. Seki, “Recent progress in packaging of RF MEMS”, IEEE CSIC Dig., pp. 233-236, Monterey, USA, 2004.
5 S. Yamamoto, K. Itoi, T. Suemasu and T. Takizawa, “Si through-hole interconnections filled with Au-Sn solder by molten metal suction method”, 16th IEEE International Conference on Micro Electro Mechanical Systems, pp. 19-23, Kyoto, Japan, 2003.
6 S. Kang, H. C. Kim, and K. Chun, “A low-loss, singlepole, four-throw RF MEMS switch driven by a double stop comb drive”, Journal of Micromechanics and Microengineering, vol. 19, no. 3, p. 035011, 2009.   DOI   ScienceOn
7 Q. Wang, S. H. Choa, W. Kim, J. Hwang, S. Ham, and C. Moon, “Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer-level packaging”, Journal of Electronic Materials, vol. 35, no. 3, pp. 425-432, 2006.   DOI
8 J. H. Park, N. E. Lee, J. Lee, J. S. Park, and H. D. Park, “Deep dry etching of borosilicate glass using SF6 and SF6/Ar inductively coupled plasmas”, Microelectronics Engineering, vol. 82, no. 2, pp. 119-128, 2005.   DOI   ScienceOn
9 H. A. C. Tilmans, W. D. Raedt and E. Beyne, "MEMS for wireless communications: ‘from RF-MEMS components to RF MEMS SiP’", Journal of Micromechanics and Microengineering, vol. 13, no. 4, pp. S139-S163, 2003.   DOI   ScienceOn
10 G. W. Dahlmann, E. M. Yeatman, P. Young, I. D. Robertson and S. Lucyszyn, “High Q achieved in microwave inductors fabricated by parallel self-assembly”, Proc. 11th Int. Conf. on Solid-State Sensors and Actuators, pp. 1098-1101, Munich, Germany, 2001.
11 Z. Feng, W. Zhang, B. Su, K. F. Harsh, K. C. Gupta, V. Bright, and Y. C. Lee, “Design and modeling of RF MEMS tunable capacitors using electro-thermal actuators”, Proc. IEEE MTT-S Int. Microw. Symp., pp. 1507-1510, Anaheim, USA, 1999.
12 Jae-Hyoung Park, “A study on the design and fabrication of electrostatically actuated RF MEMS switches”, J. Kor. Sensors Soc., vol. 19, no. 4, pp. 320-327, 2010.   DOI   ScienceOn
13 J. C. Chiao, Y. Fu, I. M. Chio, M. Delisio, and L. Y. Lin, “MEMS reconfigurable Vee antenna”, IEEE MTT-S Int. Microw. Symp., pp. 1515-1518, Anaheim, USA, 1999.
14 S. Lucyszyn, "Review of radio frequency microelectromechanical systems technology", IEEE Proc. Sci. Meas. Tech., vol. 1551, no. 2, pp. 93-103, 2004.