Array Lens and Pinhole-based Multi-Confocal Robot Vision System : Micro Bump Inspections in Wafer Level Packaging
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Kim, Min-Young
(경북대학교 IT대학 전자공학부)
Kim, Hyun-Woo (경북대 전자전기컴퓨터학부) Lee, Soon-Geul (경희대학교 기계공학과) |
| 1 | Ishihara, M. and Sasaki, H., High-speed surface measurement using a nonscanning multiple-beam confocal microscope, Optical Engineering, 38-6 (1999), 1035-1040 DOI |
| 2 | Toh, P. S., Confocal Imaging, U.S. Patent 6,838,650, Jan. 4, 2005 |
| 3 | Zabolitzky, J., Device for Measuring in Three Dimensions A Topographical Shape of An Object, U.S. Patent 7,446,885, Nov. 4, 2008 |
| 4 | http://www.siliconfareast.com/wl_package.htm |
| 5 | http://www.izm.fraunhofer.de/EN/abteilungen/ hdi/index.jsp |
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