• Journal of Sensor Science and Technology
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• v.15 no.6
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• pp.449-456
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• 2006

The purpose of urodynamic investigation is to obtain the information on the function of the urinary system. The aim of this study is to acquire the useful information of lower urinary tract symptom (LUTS) diagnosis through void force signal as noninvasive method. The system which could evaluate the function of compensatory hypertrophy with noninvasive and comfortable method was implemented to measure uroflow and void force during urination. The implemented system composes of the sensor parts, signal conditioning parts and PC monitoring program. For the evaluation of the implemented system, the simulation of control part of the system was performed and the model system for the lower urinary system was designed. The superiority of a measuring characteristic of the implemented system was verified using the model system. From the evaluation of the model system, we have found out that the void force was dependent on the occlusion degree and compensatory hypertrophy significantly.

• Geomechanics and Engineering
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• v.17 no.1
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• pp.19-30
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• 2019

Recent research on the behavior of silty sand tends to advocate the use of equivalent skeleton void ratio to characterize the density state of this type of soil. This paper presents an investigation to explore the physical meaning of the equivalent skeleton void ratio by means of DEM simulations for assemblies of coarse and fine particles under biaxial shear. The simulations reveal that the distribution pattern of fine particles in the soil skeleton plays a crucial role in the overall macroscopic response: The contractive response observed at the macro scale is mainly caused by the movement of fine particles out of the force chains whereas the dilative response is mainly associated with the migration of fine particles into the force chains. In an assembly of coarse and fine particles, neither all of the fine particles nor all of the coarse ones participate in the force chains to carry the external loads, and therefore a more reasonable definition for equivalent skeleton void ratio is put forward in which a new parameter d is introduced to take into account the fraction of coarse particles absent from the force chains.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.539-542
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• 2000

In this paper, the influence of circular void on a crack in piezoelectric materials under mechanical and electric loads is investigated by using finite element method code, ANSYS. Both ceramics and piezoelectric materials are compared with stress intensity factor and crack extension force at crack tip on arbitrary located circular void under Mode I loads. It was found that piezoelectric materials's crack extension force is larger than ceramics.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.2
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.1-9
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• 2011

Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

• Journal of the Korean Geotechnical Society
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• v.25 no.10
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• pp.111-122
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• 2009

Dissolution of some of geo-materials may yield the loss of the soil strength and the settlement of earth structures. The goal of this study is to monitor the several physical behaviors of soluble mixtures during dissolution. Sand-salt mixtures are used to monitor the meso to macro response including the settlements and shear waves. The mixtures of photoelastic and ice disks are used to monitor micro to meso behavior of soluble mixture including the void ratio, force chain, coordination number and horizontal force changes. In the sand-salt mixtures, shear waves are measured by using bender elements in conventional oedometer cells. In the photoelastic disk - ice disk mixtures, micro to meso response are measured by digital images and load cells. The shear wave velocity decreases at the initial stage of the dissolution, and then increases and approaches to asymptotic value. The larger dissoluble particle and the more random packing produces the severe horizontal fore change. After dissolution, the void increases and the coordination number decreases. This study demonstrates that the particle level behavior such as the changes of the force chain, void ratio, and coordination number affects the global behavior such as the change of the shear wave velocity and horizontal force of the system.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.55-57
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• 2005

In this study, modeling of the CD stud welding system was conducted considering mechanical and electrical components. The electrical components such as arc resistance, cable resistance, capacitance, internal resistance and cable inductance were found to affect the output waveform significantly. The calculated results showed food agreements with the experiment results within 20% error. The main defect of CD stud welding with 1010 steel stud and SS400 steel plate was the void trapped between stud and base metal. The effect of the spring force and stud tip size on void formation was investigated.

• Transactions of Materials Processing
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• v.7 no.1
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• pp.23-35
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• 1998

In order to analyze the tensile deformation characteristics of laser welded tailored blanks. laser welded blanks of different thikness and strength combinations were prepared and tensile tests were done. The tensile elongation along the direction perpendicular to weld line of laser welded blanks was reduced as increasing the deformation restraining force (strength X thicknes) ratio between two welded sheets and fracture occurred at weaker side of base sheets if void ration of welded sheets and fracture occurred at weaker side of base sheets if void ratio of weld section was less than 45% The tensile elongation along weld line reached above 90% of the elongation of base material if welding was done perfectly. Total elongation along the direction perpendicular to weld line was able to be predicted by force equilibrium and power law behavior of base sheets and it was related with the deformation of stronger sheet and formability of weaker side.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1349-1354
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• 2008

In this study, we try to find the root cause of water condensing failures in a headlamp using chemical and mechanical analysis. Through the surface inspection by OM, SEM and CT, it was found that water infiltrate into the headlamp through hotmelt adhesive debonding part caused by adhesion force degradation and poor quality. IR spectra shows that adhesion force degradation are characterized by increase of some functional group(1742, 1710, 1649, 1016). Through the ESPI measurement, it is turned out that bonding structural change by thermal expansion and degradation of adhesive can be the cause of void generation. So it is recommended that cooling passage and the bonding part should be redesigned to give a guarantee of less thermal stress and high adhesion quality.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.11a
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• pp.879-882
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• 2004

Two-phase flow exists in many industrial components. Characteristics of two-phase flow have been studied by many researchers; however, a further study of the two-phase is required for flow-induced vibration. Characteristics of two-phase flow were measured by force sensor at the end of a vertical pipe. The predominant frequency of fluctuation was obtained for various speeds of flow pattern. A correlation to slug frequency for horizontal flow was obtained by Heywood & Richardson (1979), while Legius et al (1997) for vertical flow. A coefficient based on the correlation is estimated and then compared to the existing ones. The existing empirical formulations for average void fraction were proposed by Wallis (1969), Zuber et al (1967) and Ishii (1970). In the present result, flow parameters, such as flow quality and real velocity, are evaluated with void fraction.