• Proceedings of the Korea Concrete Institute Conference
• /
• 2003.05a
• /
• pp.333-338
• /
• 2003

Although porous concrete is resently used as a pavement at a parking lot, a public squre and a bicycle road, we use without enough examining. most the maintenance of quality for porous concrete is only dealt with strength and color tone. also, there is not yet enough fundamental data about dynamical properties for strength, rate of void and water permeability. even when it is applied to at the scene, it is been a matter. Accodingly in this study analyzed influences through the dynamical properties, combination, and time to vibration. After the analyzation, they investigated peculiar dynamics which are strength of porous concrete, rate of void, and water permeability follow the rate of increase on an admixture making pozzolan reaction. This is purpose to improve capacity of the sidewalk permeable concrete and development of the economical technique for pavement.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.24 no.1
• /
• pp.35-44
• /
• 2006

본 연구에서는 PCB에 진공인쇄 방식이 적용된 스크린 인쇄방법을 이용하여 Pattern 및 Hole충전의 신뢰성을 향상시킬 수 있는 기술을 적용하였다. 새로운 dry process 기술인 직접회로 인쇄 기술은 일반적으로 사용되고 있는 wet process 중 도금, 에칭, 박리 등의 공정을 줄일 수 있어 제조원가, 공정 리드타임 감소, 폐기물 감소로 환경 친화적 공정이라고 할 수 있다. 직접회로 인쇄는 진공도 100 Pa, 인쇄압력 0.45 MPa, 인쇄 속도 30 mm/sec, 인쇄각도 85도, 스크린 마스크와 기판 사이의 Gap 2 mm에서 인쇄될 때 가장 좋은 결과를 보였다. 직접회로 인쇄에 사용된 인쇄기는 일반 PCB공정에서 사용되는 동일한 형태에 진공조건을 유지시킬 수 있도록 개선하여 사용하였다.

• ETRI Journal
• /
• v.29 no.1
• /
• pp.116-119
• /
• 2007

In this letter, we design a collision resolution protocol for optical burst switching ring networks to avoid burst collision. We define the offset time condition for no burst transmission collision and manage the free time list of nodes for no burst reception collision. In order to improve the throughput, we use a fiber delay line, void-filling, and void-compression. This protocol does not require any additional procedures for bandwidth reservation such as centralized assignment of bandwidth, lightpath setup of WDM ring networks, or token capturing for the burst transmission. The simulation results show that the proposed protocol can achieve high throughput while saving 70% of wavelengths when compared to round robin with random selection, round robin with persistent, and round robin with non-persistent with only destination delay.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.4
• /
• pp.99-104
• /
• 2015

The requirement for success of via filling is its ability to fill via holes completely without producing voids or seams. Defect free via filling was obtained by optimizing plating conditions such as current mode, current density and additives. However, byproducts stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this study, the relationship between JGB and current density on the copper via filling was investigated without the addition of other additives to minimize the contamination of copper via. AR 4 with $15{\mu}m$ diameter via were used for this study. The pulse current was used for the electroplating of copper and the current densities were varied from 10 to $20mA/cm^2$ and the concentrations of JGB were varied from 0 to 25 ppm. The map for the JGB concentration and current density was developed. And the optimum conditions for the AR 4 via filling with $15{\mu}m$ diameter were obtained.

• Proceedings of the Korean Information Science Society Conference
• /
• 1998.10c
• /
• pp.674-676
• /
• 1998

소자가 sub-quarter um급으로 축소됨에 따라 STI(Shallow Trench Isolation) 기술은 고 집적도의 ULSI 구현에 있어서 중요한 격리 방법으로 많이 사용되고 있다. 현재의 STI 기술은 주로 실리콘 기판을 식각 후 절연물질로 빈 공백이 없이 채우는 (void-free gap filling) 방법 [1,2]과 절연물질을 다시 표면 근처까지 CMP(Chemical Mechnical Polishing)로 etchback하여 평탄화를 하는 방법이 주요한 기술이 되고 있다. 또한 STI 구조로된 격리구조에서 만들어진 MOSFET의 전기적인 특성은 트랜치 격리의 상부 부분의 형태와 gap-filling 물질에 따라 큰 영향을 받게된다. 따라서 본 논문에서는 STI 구조로 만들어진 격리 구조에서 MOSFET의 hump 특성에 관해 연구하였다. 그 결과 hump는 STI 모서리에서 필드 옥사이드의 recess에 의한 모서리 부분에서의 전계 집중과 boron의 segration에 기인한 농도 감소로 인해 hump가 발생하는 것으로 나타났다.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2004.04a
• /
• pp.292-296
• /
• 2004

In case of Resin Transfer Molding(RTM) process, 'race-track' effects and non-uniform fiber volume fraction may cause undesirable resin flow pattern and thus result in dry spots, which affect the mechanical properties of the finished parts. In this study, a real time RTM control strategy to prevent these unfavorable effects is proposed. The control strategy consists of two 'stages' depending on the extent the resin front has reached. Through numerical simulations and experiments, the validity of the proposed scheme is demonstrated. The results show that the proposed scheme is effective in reducing the void formation during RTM mold filling.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2009.10a
• /
• pp.171-172
• /
• 2009

TSV(through via silicon)를 이용한 Via의 Cu 충전에서 Seed 층의 역할은 전류의 흐름을 가능하게 하는 중요한 역할을 하고 있다. Via에 각각 Ti/Au, Ti/Cu를 증착한 후 Ti/Cu가 Ti/Au를 대체 할 수 있는지를 알아보기 위해 먼저 실리콘 웨이퍼에 via를 형성하고, 형성된 via에 기능성 박막층으로 절연층(SiO2) 및 시드층을 형성하였다. 전해도금을 이용하여 Cu를 충전한 결과 Ti/Au 및 Ti/Cu를 증착한 두 시편 모두 via와 seed층 접합면에 박리 등의 결함이 없었고, via 내부 또한 void나 seam 등이 관찰되지 않고 우수하게 충전된 것을 확인할 수 있었다.

• Proceedings of the Korean Geotechical Society Conference
• /
• 2008.03a
• /
• pp.725-733
• /
• 2008

A thixotropic grout has been developed for the use of filling a tail void in the shield TBM and as well as various ground voids. The grout developed in this study is a mixture of inorganic substance, cement and some functional additives. Its engineering characteristics was investigated by measuring a viscosity and unconfined compressive strengths. The optimum mix proportion for an effective thixotropic grout was proposed through several repeated laboratory tests. The various physical properties such as thixotropy, unconfined compressive strengths, and durability of the thixotropic grout and the gels produced from the grout were compared with those of the well-known waterglass-type grout such as L.W.. The thixotropic grout developed in the study exhibited an excellent performance for back-filling of tail voids in the shield TBM based on experimental results compared to the existing waterglass grout.

• Proceedings of the Korean Geotechical Society Conference
• /
• 2005.03a
• /
• pp.1283-1290
• /
• 2005

A thixotropic grout has been newly developed for the use of back-filling a tail void in the shield tunnel and filling up ground voids. The grout developed in the study is a mixture of colloidal silica, cement and some functional additives. Its engineering characteristics was investigated by measuring a viscosity and unconfined compressive strengths. The optimum mixing proportion for an effective thixotropic grout was proposed through several repeated laboratory tests. The various physical properties such as thixotropy, unconfined compressive strengths, and durability of the thixotropic grout and the gels produced from the grout were compared with those of the well-known waterglass grout such as L.W.. The thixotropic grout developed in the study exhibited an excellent performance for back-filling of tail voids, based on experimental results compared to the existing waterglass grout.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.55-59
• /
• 2012

Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.