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http://dx.doi.org/10.6117/kmeps.2012.19.2.055

The Effects of Levelers on Electrodeposition of Copper in TSV Filling  

Jung, Myung-Won (Dept. of Materials Science and Engineering, Hongik University)
Kim, Ki-Tae (Dept. of Materials Science and Engineering, Hongik University)
Koo, Yeon-Soo (Dept. of Manufacture and Metallurgical Engineering, Gwangyang Health College)
Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.2, 2012 , pp. 55-59 More about this Journal
Abstract
Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.
Keywords
Copper electroplating; Polarization; Via Filling; Leveler;
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