• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.8
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• pp.1737-1744
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• 2010

The Image sensor needs various image processing to improve image quality. ISP(Image Signal Processor) performs various image processing. Conventional vision cameras have own software ISP functions and perform in PC instead of using commercial ISP chips. However these methods have problems such as large computation for image processing. In this paper, we proposed ISP that significantly reduced chip area by efficient sharing of hardware and software. Large operation blocks are designed to hardware for high performances, and we used hardware simultaneously with software considering the size of the hardware. The implemented ISP can process VGA(640*4800) images and has 91450 gate sizes in 0.35um process.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.628-632
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• 2003

An intelligent miniature humanoid robot system is designed and implemented as a platform for researching walking algorithm. The robot system consists of a mechanical robot body, a control system, a sensor system, and a human interface system. The robot has 6 dofs per leg, 3 dofs per arm, and 2 dofs for a neck, so it has total of 20 dofs to have dexterous motion capability. For the control system, a supervisory controller runs on a remote host computer to plan high level robot actions based on the vision sensor data, a main controller implemented with a DSP chip generates walking trajectories for the robot to perform the commanded action, and an auxiliary controller implemented with an FPGA chip controls 20 actuators. The robot has three types of sensors. A two-axis acceleration sensor and eight force sensing resistors for acquiring information on walking status of the robot, and a color CCD camera for acquiring information on the surroundings. As an example of an intelligent robot action, some experiments on playing soccer are performed.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.9
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.48 no.6
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• pp.18-26
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• 2011

Debates concerning the competitive edge of leading 3DTV technology of the shutter glasses (SG) 3D and the film-type patterned retarder (FPR) are flaring up. Although SG technology enables Full-HD 3D vision, it requires complex systems including the sync transmitter (emitter), the sync processor chip, and the LCD lens in the active shutter glasses. In addition, the transferred sync-signal is easily affected by the external noise and a 3DTV viewer may feel flicker-effect caused by cross-talk of the left and right image. The operating current of the sync processor in the 3DTV active shutter glasses is gradually increasing to compensate the sync reconstruction error. The proposed chip is a low-power hardware sync processor based discrete-event SoC(system on a chip) designed specifically for the 3DTV active shutter glasses. This processor implements the newly designed power-saving techniques targeted for low-power operation in a noisy environment between 3DTV and the active shutter glasses. This design includes a hardware pre-processor based on a universal edge tracer and provides a perfect sync reconstruction based on a floating-point timer to advance the prior commercial 3DTV shutter glasses in terms of their power consumption. These two techniques enable an accurate sync reconstruction in the slow clock frequency of the synchronization timer and reduce the power consumption to less than about a maximum of 20% compared with other major commercial processors. This article describes the system's architecture and the details of the proposed techniques, also identifying the key concepts and functions.

• Transactions of the Korean Society of Automotive Engineers
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• v.24 no.2
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• pp.127-136
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• 2016

The camera based object detection systems should satisfy the recognition performance as well as real-time constraints. Particularly, in safety-critical systems such as Autonomous Emergency Braking (AEB), the real-time constraints significantly affects the system performance. Recently, multi-core processors and system-on-chip technologies are widely used to accelerate the object detection algorithm by distributing computational loads. However, due to the advanced hardware, the complexity of system architecture is increased even though additional hardwares improve the real-time performance. The increased complexity also cause difficulty in migration of existing algorithms and development of new algorithms. In this paper, to improve real-time performance and design complexity, a task scheduling strategy is proposed for visual object tracking systems. The real-time performance of the vision algorithm is increased by applying pipelining to task scheduling in a multi-core processor. Finally, the proposed task scheduling algorithm is applied to crosswalk detection and tracking system to prove the effectiveness of the proposed strategy.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.12C
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• pp.1157-1164
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• 2006

In this paper, we proposed a method for measuring accurate positions and sizes of package and balls in a micro BGA. To find defects of BGA accurately, we focused on finding positions of package and balls. After labeling, we detected connected components of package and balls using feature parameters. After the detection of package component, we measured position and size of package by employing rectangular model which was constructed by the package information. After the detection of the ball components, we measured positions and diameters of balls by employing circular models which were constructed by the ball informations. We did calibration based on landmarks to measure real length, and we compared the measured results with the SEM data. Finally, we found that the accuracy of the proposed method is 94% in terms of ball's radius.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.32B no.11
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• pp.1445-1454
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• 1995

In this study, we have developed a prototype of the automatic defects detection system for capsule inspection using the computer vision techniques. The subjects for inspection are empty hard capsules of various sizes which are made of gelatine. To inspect both sides of a capsule, 2-stage recognition is performed. Features we have used are various lengths of a capsule, area, linearity, symmetricity, head curvature and so on. Decision making is performed based on average value which is computed from 20 good capsules in training and permission bounds in factories. Most of time-consuming process for feature extraction is computed by hardware to meet the inspection speed of more than 20 capsules/sec. The main logic for control and arithmetic computation is implemented using EPLD for the sake of easy change of design and reduction in time for developement. As a result of experiment, defects on size or contour of binary images are detected over 95%. Because of dead zone in imaging system, detection ratio of defects on surface, such as bad joint, chip, speck, etc, is lower than the former case. In this case, detection ratio is 50-85%. Defects such as collet pinch and mashed cap/body seldom appear in binary image, and detection ratio is very low. So we have to process the gray-level image directly in partial region.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.1
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• pp.684-692
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• 2016

In the manufacturing process of the LQFP/TQFP (Low-profile Quad Flat Package/Thin Quad Flat Package), the requirement of a 3 dimensional inspection is increasing rapidly and a 3D inspection of the shape of a chip has become an important report of quality control. This study developed a 3 dimensional measurement system based on PMP (Phase Measuring Profilometry) for an inspection of the LQFP/TQFP chip and image processing algorithms. The defects of the LQFP/TQFP chip were classified according to the dimensions. The 2 dimensional optical system was designed by the dorm illumination to achieve constant light distribution, In the 3 dimensional optical system, PZT was used for moving 90 degree in phase. The problem of 2 ambiguity was solved from the measured moir? pattern using the ambiguity elimination algorithm that finds the point of ambiguity and refines the phase value. The proposed 3D measurement system was evaluated experimentally.