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On the 2D Vision Inspection Algorithm for Semiconductor Chip Package  

Yu, Sang-Hyun (호서대학교 정보통신공학과)
Kim, Yong-Kwan (호서대학교 정보통신공학과)
Abstract
In this paper, we proposed a method for measuring accurate positions and sizes of package and balls in a micro BGA. To find defects of BGA accurately, we focused on finding positions of package and balls. After labeling, we detected connected components of package and balls using feature parameters. After the detection of package component, we measured position and size of package by employing rectangular model which was constructed by the package information. After the detection of the ball components, we measured positions and diameters of balls by employing circular models which were constructed by the ball informations. We did calibration based on landmarks to measure real length, and we compared the measured results with the SEM data. Finally, we found that the accuracy of the proposed method is 94% in terms of ball's radius.
Keywords
Vision Inspection; Semiconductor; BGA; Package; Ball; Measurement;
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1 Xia Nianjiong, Cao Qixin, Fu Zhuang, Jey Lee, 'A machine vision system of ball grid array inspection on RT-Linux OS', Business of Electronic Product Reliability and Liability, 2004 International Conference on, pp. 81-85, Apr 27-30, 2004
2 Mitchell, C, 'Assembly and reliability study for the micro-ball grid array', Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium, Sixteenth IEEE/CPMT International, Vol. 1, pp. 344-346, Sept. 12-14, 1994
3 Ikenaga, T. and Ogura, T., 'Real-Time Morphology Processing Using Highly Parallel 2-D Cellular Automata CAM2', Image Processing, IEEE Transactions on Volume 9, Issue 12, pp. 2018-2026, Dec. 2000
4 eVision 6.2 C++ Reference Manual, Euresys, 2002
5 R. C. Gonzalez, R. E. Woods, Digital Image Processing, 2nd Edition, Prentice Han, 2001
6 Mengxiang Li and Lavest, J.M. 'Some aspects of zoom lens camera calibration,' IEEE Transactions. on Pattern Analysis and Machine Intelligence, Vol.18, pp. 1105-1110, 1996   DOI   ScienceOn
7 Antti Soini, 'Machine vision . technology take-up in industrial applications', Image and Signal Processing and Analysis, ISPA 2001. Proceedings of the 2nd International Symposium on, pp. 332-338, Jun. 19-21, 2001
8 I. Pitas, Digital Image Processing Algorithms And Applications, WILEY, 2000