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http://dx.doi.org/10.7736/KSPE.2014.31.9.831

Relationship between Contrast Ratio of Conductive Particle and Contact Resistance on COG Bonding using ACF  

Jin, Songwan (Department of Mechanical Engineering, Korea Polytechnic University)
Jeong, Young Hun (School of Mechanical Engineering, Kyungpook National University)
Choi, Eun Soo (Department of Mechanical system Engineering, Korea Polytechnic University)
Kim, Bosun (LG Display Co., Ltd.)
Yun, Won-Soo (Department of Mechanical Engineering, Korea Polytechnic University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.31, no.9, 2014 , pp. 831-838 More about this Journal
Abstract
Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.
Keywords
COG Bonding; ACF; Conductive Particle; Contrast Ratio; Contact Resistance;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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