• Journal of the Korean Vacuum Society
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• v.12 no.2
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• pp.130-135
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• 2003

Polycrystalline silicon thin films have been used for low cost thin film device application. However, it was very difficult to fabricate high performance poly-Si at a temperature lower than $600^{\circ}C$ for glass substrate because the crystallization process technologies like conventional solid phase crystallization (SPC) require the number of high temperature (600-$1000^{\circ}C$) process. The objective of this paper is to grow poly-Si on flexible substrate using a rapid thermal crystallization (RTC) of amorphous silicon (a-Si) layer and make the high temperature process possible on molybdenum substrate. For the high temperature poly-Si growth, we deposited the a-Si film on the molybdenum sheet having a thickness of 150 $\mu\textrm{m}$ as flexible and low cost substrate. For crystallization, the heat treatment was performed in a RTA system. The experimental results show the grain size larger than 0.5 $\mu\textrm{m}$ and conductivity of $10^{-5}$ S/cm. The a-Si was crystallized at $1050^{\circ}C$ within 3min and improved crystal volume fraction of 92 % by RTA. We have successfully achieved a field effect mobility over 67 $\textrm{cm}^2$/Vs.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.81-81
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• 2011

Sol-gel spin-coating법을 이용하여 ZnO 박막을 증착하였다. Sol 전구체 용액을 Si(100) 기판에 증착하고 전열처리(pre-heat treatment)하여 gel 상태의 ZnO 박막을 형성시킨 후 다른 속도로 냉각시켰다. Atomic force microscopy (AFM), X-ray diffraction (XRD), Raman, photoluminescence (PL)을 이용하여 냉각속도가 ZnO 박막의 구조적 및 광학적 특성에 미치는 영향을 분석하였다. 느린 속도($5^{\circ}C$/min)로 냉각시킨 ZnO 박막은 나노섬유질구조(nano-fibrous structure)를 나타내었고, 상온에서 바로 냉각시킨 ZnO 박막은 매우 매끄러운 표면(mirror-like surface)을 나타내었다. ZnO (100), ZnO (002), ZnO (101) 방향을 나타내는 회절피크가 관찰되었고, 냉각속도에 따른 ZnO 박막의 배향성을 알아보기 위하여 texture coefficient (TC)를 계산해 보았다. 상온에서 바로 냉각시킨 ZnO 박막(TC(002)=76.3%)이 느린 속도로 냉각시킨 박막(TC(002)=45.2%)보다 (002) 방향으로의 배향성이 우세하게 나타났으며, 잔류응력도 작았다. 뿐만 아니라 PL을 이용한 광학적 특성평가에서도 상온에서 바로 냉각시킨 ZnO 박막에서 더 강한 강도와 좁은 반치폭(full-width at halt-maximum)을 갖는 near-band-edge emission (NBE) 피크가 관찰되었다. 후열처리에 따른 구조적 및 광학적 특성 변화 또한 연구하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.127-127
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• 2011

전하 트랩형 비휘발성 메모리는 10년 이상의 데이터 보존 능력과 빠른 쓰기/지우기 속도가 요구 된다. 그러나 두 가지 특성은 터널 산화막의 두께에 따라 서로 trade off 관계를 갖는다. 즉, 두 가지 특성을 모두 만족 시키면서 scaling down 하기는 매우 힘들다. 이것의 해결책으로 적층된 유전막을 터널 산화막으로 사용하여 쓰기/지우기 속도와 데이터 보존 특성을 만족하는 Tunnel Barrier engineered Memory (TBM)이 있다. TBM은 가운데 장벽은 높고 기판과 전극쪽의 장벽이 낮은 crested barrier type이 있으며, 이와 반대로 가운데 장벽은 낮고 기판과 전극쪽의 장벽이 높은 VARIOT barrier type이 있다. 일반적으로 유전율과 밴드갭(band gap)의 관계는 유전율이 클수록 밴드갭이 작은 특성을 갖는다. 이러한 관계로 인해 일반적으로 crested type의 터널 산화막층은 high-k/low-k/high-k의 물질로 적층되며, VARIOT type은 low-k/high-k/low-k의 물질로 적층된다. 이 형태는 밴드갭이 다른 물질을 적층했을 때 전계에 따라 터널 장벽의 변화가 민감하여 전자의 장벽 투과율이 매우 빠르게 변화하는 특징을 갖는다. 결국 전계에 민감도 향상으로 쓰기/지우기 속도가 향상되며 적층된 유전막의 물리적 두께의 증가로 인해 데이터 보존 특성 또한 향상되는 장점을 갖는다. 본 연구에서는 SiO2/Al2O3 (2/3 nm)와 SiO2/HfAlO (2/3 nm)의 이중 터널 산화막을 증착 시킨 MIS capacitor를 제작한 후 터널 산화막에 전하가 트랩되는 것을 피하기 위하여 다양한 열처리 온도에 따른 current-voltage (I-V), capacitance-voltage (C-V), constant current stress (CCS) 특성을 평가하였다. 급속열처리 공정온도는 600, 700, 800, 900 ${^{\circ}C}$에서 진행하였으며, 낮은 누설전류, 터널링 전류의 증가, 전하의 트랩현상이 최소화되는 열처리 공정의 최적화 실험을 진행하였다.

• Korean Journal of Materials Research
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• v.26 no.3
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• pp.130-135
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• 2016

To alloy high melting point elements such as boron, ruthenium, and iridium with copper, heat treatment was performed using metal oxides of $B_2O_3$, $RuO_2$, and $IrO_2$ at the temperature of $1200^{\circ}C$ in vacuum for 30 minutes. The microstructure analysis of the alloyed sample was confirmed using an optical microscope and FE-SEM. Hardness and trace element analyses were performed using Vickers hardness and WD-XRF, respectively. Diffusion profile analysis was performed using D-SIMS. From the microstructure analysis results, crystal grains were found to have formed with sizes of 2.97 mm. For the copper alloys formed using metal oxides of $B_2O_3$, $RuO_2$, and $IrO_2$ the sizes of the crystal grains were 1.24, 1.77, and 2.23 mm, respectively, while these sizes were smaller than pure copper. From the Vickers hardness results, the hardness of the Ir-copper alloy was found to have increased by a maximum of 2.2 times compared to pure copper. From the trace element analysis, the copper alloy was fabricated with the expected composition. From the diffusion profile analysis results, it can be seen that 0.059 wt%, 0.030 wt%, and 0.114 wt% of B, Ru, and Ir, respectively, were alloyed in the copper, and it led to change the hardness. Therefore, we verified that alloying of high melting point elements is possible at the low temperature of $1200^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.12a
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• pp.68-70
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• 2006

$CuInS_2$ thin films were synthesized by sulpurization of Cu/In Stacked elemental layer deposited onto glass Substrates by vacuum furance annealing at temperature 200[$^{\circ}C$]. And structural and electrical properties were measured in order to certify optimum conditions for growth of the ternary compound semiconductor $CuInS_2$ thin films with non-stoichiometry composition. $CuInS_2$ thin film was well made at the heat treatment 200 [$^{\circ}C$] of SLG/Cu/In/S stacked elemental layer which was prepared by thermal evaporator, and chemical composition of the thin film was analyzed nearly as the proportion of 1:1:2. Physical properties of the thin film were investigated at various fabrication conditions substrate temperature, annealing and temperature, annealing time by XRD, FE-SEM and hall measurement system. At the same time, carrier concentration, hall mobility and resistivity of the thin films was $9.10568{\times}10^{17}[cm^{-3}]$, $312.502[cm^2/V{\cdot}s]$ and $2.36{\times}10^{-2}[{\Omega}{\cdot}cm]$, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.218-218
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• 2010

기존의 비휘발성 메모리 소자는 터널 절연막으로 $SiO_2$ 단일 절연막을 이용하였다. 그러나 소자의 축소화와 함께 비휘발성 메모리 소자의 동작 전압을 낮추기 위해서 $SiO_2$ 단일 절연막의 두께도 감소 시켜야만 하였다. 하지만 $SiO_2$ 단일 절연막의 두께 감소에 따라, 메모리의 동작 횟수와 데이터 보존 시간의 감소등의 문제점들로 인해 기술적인 한계점에 이르렀다. 이러한 문제점들을 해결하기 위한 연구가 활발히 진행되고 있는 가운데, 최근 high-k 물질을 기반으로 하는 Tunnel Barrier Engineered (TEB) 기술이 주목 받고 있다. TBE 기술이란, 터널 절연막을 위해 서로 다른 유전율을 갖는 유전체를 적층함으로써 쓰기/지우기 속도의 향상과 함께, 물리적인 두께 증가로 인한 데이터 보존 시간을 향상 시킬 수 있는 기술이다. 따라서, 본 연구에서는 적층된 터널 절연막에 이용되는 $HfO_2$를 FGA (Forming Gas Annealing)와 RTA (Rapid Thermal Annealing) 공정에 의한 열처리 효과를 알아보기 위해, 온도에 따른 전기적인 특성을 MIS-Capacitor 제작을 통하여 분석하였다. 이를 위해 먼저 Si 기판 위에 $SiO_2$를 약 3 nm 성장시킨 후, $HfO_2$를 Atomic Layer Deposition (ALD) 방법으로 약 8 nm를 증착 하였고, Aluminum을 약 150 nm 증착 하여 게이트 전극으로 이용하였다. 이를 C-V와 I-V 특성을 이용하여 분석함으로 써, 열처리 공정을 통한 $HfO_2$의 터널 절연막 특성이 향상됨을 확인 하였다. 특히, $450^{\circ}C$ $H_2/N_2$(98%/2%) 분위기에서 진행한 FGA 공정은 $HfO_2$의 전하 트랩핑 현상을 줄일 뿐 만 아니라, 낮은 전계에서는 낮은 누설 전류를, 높은 전계에서는 높은 터널링 전류가 흐르는 것을 확인 하였다. 이와 같은 전압에 대한 터널링 전류의 민감도의 향상은 비휘발성 메모리 소자의 쓰기/지우기 특성을 개선할 수 있음을 의미한다. 반면 $N_2$ 분위기에서 실시한 RTA 공정에서는, 전하 트랩핑 현상은 감소 하였지만 FGA 공정 후 보다는 전하 트랩핑 현상이 더 크게 나타났다. 따라서, 적층된 터널 절연막은 적절한 열처리 공정을 통하여 비휘발성 메모리 소자의 성능을 향상 시킬 수 있음이 기대된다.

• Journal of the Korean Vacuum Society
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• v.22 no.4
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• pp.204-210
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• 2013

In order to improve osseointegration for biomedical implants, it is crucial to understand the interactions between nanostructured surfaces and cells. In this study, $TiO_2$ nanowires were prepared via Vapor-Liquid-Solid (VLS) process with Sn as a metal catalyst in the tube furnace. Nanowires were grown with $N_2$ heat treatment with their size controlled by the agglomeration of Sn layers in various thicknesses. MC3T3-E1 (pre-osteoblast) were cultured on the $TiO_2$ nanowires for a week. Preliminary results of the cell culture showed that the cells adhere well on the $TiO_2$ nanowires.

• Journal of the Korean Ceramic Society
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• v.49 no.6
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• pp.620-624
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• 2012

The role of moisture remaining inside the deposition chamber during the formation of the cubic boron nitride (c-BN) phase in BN film was investigated. BN films were deposited by an unbalanced magnetron sputtering (UBM) method. Single-crystal (001) Si wafers were used as substrates. A hexagonal boron nitride (h-BN) target was used as a sputter target which was connected to a 13.56 MHz radiofrequency electric power source at 400 W. The substrate was biased at -60 V using a 200 kHz high-frequency power supply. The deposition pressure was 0.27 Pa with a flow of Ar 18 sccm - $N_2$ 2 sccm mixed gas. The inside of the deposition chamber was maintained at a moisture level of 65% during the initial stage. The effects of the evacuation time, duration time of heating the substrate holder at $250^{\circ}C$ as well as the plasma treatment on the inside chamber wall on the formation of c-BN were studied. The effects of heating as well as the plasma treatment very effectively eliminated the moisture adsorbed on the chamber wall. A pre-deposition condition for the stable and repeatable deposition of c-BN is suggested.

• Journal of Korea Foundry Society
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• v.17 no.4
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• pp.356-364
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• 1997

In order to study effects of Cu and Be on the microstructure and tensile properties of rapidly solidified Al-Mg alloys, Al-Mg-Cu-Be alloys have been rapidly solidified by inert gas atomization process. Microstructure of rapidly solidified Al-Mg-Cu-Be powders exhibited refinement and good dispersion of Be particles as increasing of solidification rate. Solidification rate of atomized powders was estimated to be about $5{\times}10^{3{\circ}}C/s$. Inert gas atomized Al-Mg-Cu-Be powders were hot-processed by vacuum hot pressing at $450^{\circ}C$ under 100 MPa and hot extruded with reduction ratio in area of 25: 1 at $450^{\circ}C$. The extruded Al-Mg-Cu-Be powders consisted of recrystallized fine Al grains and homogeneously dispersed fine Be particles, and exhibited improved tensile properties with increase in Cu content. $Al_2CuMg$ compounds precipitated in grain and grain boundaries of Al-Mg-Cu-Be alloys with aging heat treatment after solution treatment. Hardness and tensile properties were improved by increasing Cu content and Be addition. Compared with extruded Al-Mg-Cu powders, the extruded Al-Mg-Cu-Be powders exhibited finer recrystallized grains and improved tensile properties by dispersion hardening of Be and subgrain boundaries pinned by fine Be particles. After aging treatment, hardness and tensile properties were improved due to restricted precipitation by increasing of dislocation density around Be particles in matrix.

• The Journal of Korean Academy of Prosthodontics
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• v.47 no.4
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• pp.445-456
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• 2009

Statement of problem: Many studies have been conducted to improve the primary stability of implants by providing bioactive surfaces via surface treatments. Increase of surface roughness may increase osteoblast activity and promote stronger bonding between bone and implant surface and it has been reported that bioactive surface or titanium can be obtained through alkali and heat treatment. Purpose: The purpose of this study was to evaluate the stability of alkali and heat treated implants via histomorphometric analysis. Material and methods: Specimens were divided into three groups; group 1 was the control group with machined surface, the other groups were treated for 24 hours in 5 M NaOH solution and heat treated for 1 hour at $600^{\circ}C$ in the atmosphere (group 2) and vacuum (group 3) conditions respectively. Surface characteristics were analyzed and fixtures were implanted into rabbits. The specimens were histologically and histomorphometrically compared according to healing periods and change in bone composition were analyzed with EPMA (Electron Probe Micro Analyzer). Results: 1. Groups treated with alkali and heat showed increase of oxidization layer and Na ions. Groups 2 which was heat treated in atmosphere showed significant increase of surface roughness (P<.05). 2. Histomorphometric analysis showed significant increase in BIC (bone to implant contact) according to increase in healing period and there was significant increases in groups 2 and 3 (P<.05). 3. BA(bone area) ratio showed similar results as contact ratio, but according to statistical analysis there was significant increase according to increase in healing period in group 2 only (P<.05). 4. EPMA analysis revealed no difference in gradation of bone composition of K, P, Ca, Ti in surrounding bone of implants according to healing periods but groups 2 and 3 showed increase of Ca and P in the initial stages. Conclusion: From the results above, it can be considered that alkali and heat treated implants in the atmosphere have advantages in osseointegration in early stages and may decrease the time interval between implantation and functional adaptation.