• 한국전기전자재료학회논문지
• /
• 제24권6호
• /
• pp.449-457
• /
• 2011

Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.

• 한국초전도ㆍ저온공학회논문지
• /
• 제24권4호
• /
• pp.65-70
• /
• 2022

A vacuum system is designed for thermal insulation of a 10 ton/day class air liquefaction cold box for liquid air energy storage. The vacuum system is composed of a turbomolecular pump, a backing pump and vacuum piping for the vacuum pumps. The turbomolecular pump is in combination with the backing pump for pumping capacity. The vacuum piping is designed with system installation conditions, such as distance from the cold box, connections to vacuum pumps and installation space. The capacity of the vacuum pump combination, namely pumping speed, is determined by analysis of the vacuum system, and pump-down time to 1×10^-5 mbar is estimated. Vacuum piping conductance, system pumping speed and outgassing rate are calculated for the pump-down time with the ultimate pumping speed range of the vacuum pump combination of 1400 - 2300 l/s. Although the pump-down time gets shorter by larger capacity vacuum pumps, it mainly depends on target vacuum degree and outgassing rate in the cold box. The pump-down time is estimated as 3 - 6 hours appropriate for cold box operation for the pumping speed range. Considering the outgassing rate has uncertainty, the vacuum pump combination with pumping speed of 1900 l/s is chosen for the vacuum system, which is middle value of the pumping speed range.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2008년도 제35회 하계학술대회 초록집
• /
• pp.263-263
• /
• 2008

• 한국인터넷방송통신학회논문지
• /
• 제12권2호
• /
• pp.77-83
• /
• 2012

진공 시스템의 성능에 대한 밸브 컨덕턴스의 영향은 진공시스템의 설계 최적화를 위해 전산모사 되었다. 본 연구에서는, 전산모사기인 VacSimMulti에 의한 모델링기구가 제시되었다. 진공 시스템의 설계는 진공 장비의 다양한 산업적 구현을 위해 특정한 프로세스 조건을 충족해야 한다. 진공 밸브의 구조, 길이, 직경 등은 컨덕턴스 영향의 전산모사 변수로서 모델링 되었으며, 직렬 진공 시스템의 배기 밸브 또한, 다양한 크기와 구조로 모델링하여 전산모사되었다. 밸브 직경의 변화는 도관의 길이의 변화보다 진공특성에 있어 더 유의미한 효과를 보여주었으며 슬릿형의 밸브도관 시스템은 모델링된 밸브구조 중 가장 뛰어난 진공특성을 가지는 것으로 관찰 되었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
• /
• pp.59-59
• /
• 2012

Vacuum pumping remains central to the performance and economy of many manufacturing processes, scientific instruments and scientific research. More vacuum is being used in many of the latest or leading edge manufacturing processes: Current examples include 3D semiconductor devices, EUV lithography, 450 mm silicon wafers, AMOLED displays, LEDs, Lithium-ion batteries and steel degassing. In other applications, vacuum pumping technology developments have led to much lower product costs which for example have enabled mass spectrometers to become a ubiquitous tool is life science research. Vacuum pumps have continuously evolved during the past 100 years of vacuum-based industrial processing but remain a key component which is often on the critical path of process and product improvements. This is especially so in the growing number of applications where the pumps are highly stressed. This presentation outlines significant developments in vacuum that have brought about this progress. The likely course of continued improvements is discussed in terms of increased performance and reliability, robust by-product handling, better cost efficiency and reduced environmental impact especially power consumption.

• Transactions on Electrical and Electronic Materials
• /
• 제14권6호
• /
• pp.334-338
• /
• 2013

In this study, the outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the turbomolecular pump system than in the diffusion pump system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

• 반도체디스플레이기술학회지
• /
• 제8권1호
• /
• pp.7-12
• /
• 2009

The outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the TMP system than in the DP system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

• 진공이야기
• /
• 제1권3호
• /
• pp.14-20
• /
• 2014

Lithography is widely recognized as one of the key steps in the manufacture of ICs and other devices and/or structures. However, as the dimensions of features made using lithography become smaller, lithography is becoming a more critical factor for enabling miniature IC or other devices and/or structures to be manufactured. As explained above, to make it happen, many other important technologies will have to be addressed. The vacuum technology is one of them and the engineers and experts are paying attention on vacuum technology including vacuum pumps. Especially high Vacuum(HV) and Ultra high vacuum(UHV) are not easy and not simple one. So the manpower who can understand vacuum technology with long experience in vacuum industry is important with basic study.

• International Journal of Internet, Broadcasting and Communication
• /
• 제7권2호
• /
• pp.28-35
• /
• 2015

Thin film electronic devices which brought the current mobile environment could be fabricated only under the high quality vacuum conditions provided by high vacuum systems. Especially for the development of advanced thin film devices, constant high quality vacuum as the deposition pressure is definitely needed. For this purpose, the variable conductance throttle valves were employed to the high vacuum system. In this study, the effects of throttle valve applications on vacuum characteristics were simulated to obtain the optimum design modelling of variable conductance of high vacuum system. Commercial simulator of vacuum system, $VacSim^{(multi)}$, was used on this investigation. Reliability of employed simulator was verified by the simulation of the commercially available models of high vacuum system. Simulated vacuum characteristics of the proposed modelling were agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve were schematized as the modelling of throttle valve for the constant process-pressure of below $10^{-3}torr$. Simulation results were plotted as pump down curve of chamber, variable valve conductance and conductance logic of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably.

• 한국진공학회지
• /
• 제17권4호
• /
• pp.292-301
• /
• 2008

반도체 및 디스플레이 공정과 같이 진공의 높은 청결도의 진공이 필수적으로 요구되어 지는 산업분야가 확대됨에 따라 건식진공펌프의 중요성은 급격히 증대되어 왔다. 다단루츠형 진공펌프와 함께 건식진공펌프 양대 축의 하나를 형성하는 스크류형 건식진공펌프는 공정부산물 발생이 많은 고 난이도 응용분야에서 그 장점을 발휘하여 왔다. 최근 들어 에너지 효율이 획기적으로 개선된 스크류형 건식진공펌프의 개발이 활발히 진행되고 있다. 이 총설논문에서는 스크류형 건식진공펌프의 전반적 기술사항들을 살펴보고 실제 반도체 공정에의 응용 및 스크류형 건식진공펌프의 향후 발전 방향에 대하여 살펴보았다.