• Title/Summary/Keyword: tunneling capacitance

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The Tunneling Effect at Semiconductor Interfaces by Hall Measurement (홀측정을 이용한 ZTO 반도체 박막계면에서의 터널링 효과)

  • Oh, Teresa
    • Korean Journal of Materials Research
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    • v.29 no.7
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    • pp.408-411
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    • 2019
  • ZTO/n-Si thin film is produced to investigate tunneling phenomena by interface characteristics by the depletion layer. For diversity of the depletion layer, the thin film of ZTO is heat treated after deposition, and the gpolarization is found to change depending on the heat treatment temperature and capacitance. The higher the heat treatment temperature is, the higher the capacitance is, because more charges are formed, the highest at $150^{\circ}C$. The capacitance decreases at $200^{\circ}C$ ZTO heat treated at $150^{\circ}C$ shows tunneling phenomena, with low non-resistance and reduced charge concentration. When the carrier concentration is low and the resistance is low, the depletion layer has an increased potential barrier, which results in a tunneling phenomenon, which results in an increase in current. However, the ZTO thin film with high charge or high resistance shows a Schottky junction feature. The reason for the great capacitance increase is the increased current due to tunneling in the depletion layer.

Compact Capacitance Model of L-Shape Tunnel Field-Effect Transistors for Circuit Simulation

  • Yu, Yun Seop;Najam, Faraz
    • Journal of information and communication convergence engineering
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    • v.19 no.4
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    • pp.263-268
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    • 2021
  • Although the compact capacitance model of point tunneling types of tunneling field-effect transistors (TFET) has been proposed, those of line tunneling types of TFETs have not been reported. In this study, a compact capacitance model of an L-shaped TFET (LTFET), a line tunneling type of TFET, is proposed using the previously developed surface potentials and current models of P- and L-type LTFETs. The Verilog-A LTFET model for simulation program with integrated circuit emphasis (SPICE) was also developed to verify the validation of the compact LTFET model including the capacitance model. The SPICE simulation results using the Verilog-A LTFET were compared to those obtained using a technology computer-aided-design (TCAD) device simulator. The current-voltage characteristics and capacitance-voltage characteristics of N and P-LTFETs were consistent for all operational bias. The voltage transfer characteristics and transient response of the inverter circuit comprising N and P-LTFETs in series were verified with the TCAD mixed-mode simulation results.

AC Voltage and Frequency Dependence in Tunneling Magnetoresistance Device (터널링 자기저항 소자의 교류 전압 및 주파수 의존성 연구)

  • Bae, Seong-Cheol;Yoon, Seok Soo;Kim, Dong Young
    • Journal of the Korean Magnetics Society
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    • v.26 no.6
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    • pp.201-205
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    • 2016
  • In this report, we measured the impedance spectrum in TMR device, and the relaxation behavior of the real and imaginary impedance spectrum was analyzed by using the equilibrant circuit of tunneling capacitance ($C_T$) and tunneling resistance ($R_T$). The relaxation frequency was increased with AC voltage in both the parallel and antiparallel alignment of two magnetic layers. The $R_T$ with AC voltage showed the typical bias voltage dependence. However, the $C_T$ showed large value than the expected geometrical capacitance. The huge increase of $C_T$ was affecting as a limiting factor for the high speed operation of TMR devices. Thus, the supercapacitance of $C_T$ should be considered to design the high speed TMR devices.

Analyses for RF parameters of Tunneling FETs (터널링 전계효과 트랜지스터의 고주파 파라미터 추출과 분석)

  • Kang, In-Man
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.49 no.4
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    • pp.1-6
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    • 2012
  • This paper presents the extraction and analysis of small-signal parameters of tunneling field-effect transistors (TFETs) by using TCAD device simulation. The channel lengths ($L_G$) of the simulated devices varies from 50 nm to 100 nm. The parameter extraction for TFETs have been performed by quasi-static small-signal model of conventional MOSFETs. The small-signal parameters of TFETs with different channel lengths were extracted according to gate bias voltage. The $L_G$-dependency of the effective gate resistance, transconductance, source-drain conductance, and gate capacitance are different with those of conventional MOSFET. The $f_T$ of TFETs is inverely proportional not to $L_G{^2}$ but to $L_G$.

Analysis of Tunnelling Rate Effect on Single Electron Transistor

  • Sheela, L.;Balamurugan, N.B.;Sudha, S.;Jasmine, J.
    • Journal of Electrical Engineering and Technology
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    • v.9 no.5
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    • pp.1670-1676
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    • 2014
  • This paper presents the modeling of Single Electron Transistor (SET) based on Physical model of a device and its equivalent circuit. The physical model is derived from Schrodinger equation. The wave function of the electrode is calculated using Hartree-Fock method and the quantum dot calculation is obtained from WKB approximation. The resulting wave functions are used to compute tunneling rates. From the tunneling rate the current is calculated. The equivalent circuit model discuss about the effect of capacitance on tunneling probability and free energy change. The parameters of equivalent circuit are extracted and optimized using genetic algorithm. The effect of tunneling probability, temperature variation effect on tunneling rate, coulomb blockade effect and current voltage characteristics are discussed.

Study on the electrical properties in the ceramic of (Sr¡¤Ca)Ti${O}_{2}$ system ((Sr.Ca)Ti${O}_{3}$계 세라믹의 전기적 특성에 관한 연구)

  • 최운식;김용주;이준웅
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.44 no.12
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    • pp.1610-1616
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    • 1995
  • The (Sr$_{1-x}$ .Ca$_{x}$)TiO$_{3}$(0.05.leq.x.leq.0.2) ceramics were fabricated to form semiconducting ceramics by sintering at about 1350[.deg. C] in a reducing atmosphere (N$_{2}$ gas). After being fired in a reducing atmosphere, metal oxides, CuO, was painted on the both surface of the specimens to diffuse to the grain boundary. They were annealed at 1100[.deg. C] for 2 hours. The 2nd phase formed by thermal diffusing from the surface lead to a very high apparent dielectric constant. The results of the capacitance-valtage measurements indicated that the grain boundary was composed of the continuous insulating layers. The capacitance is almost unchanged below about 20[V], but decreased slowly over 20[V]. The conduction mechanism of the specimens observed in the temperature range of 25~125[.deg. C], and is divided into three regions having different mechanism as the current increased: the region I below 200[V/cm] shows the ohmic conduction. The region II between 200[V/cm] and 2000[V/cm] can be explained by the Poole-Frenkel emission theory, and the region III above 2000[V/cm] is dominated by the tunneling effect.ct.

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Optical modulation characteristics of resonant tunneling diode oscillator (빛에 의한 공명투과다이오드 진동자의 주파수 변조 특성)

  • 추혜용;이일희
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.10
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    • pp.139-143
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    • 1996
  • We report on the static and dynamic characteristics of optically modulated resonant tunneling diode oscillator (RTDO) formed in double-barrier quantum-well structure. Under the illumination of Ti:Sapphire laser, the dc current-voltage (I-V) curves of RTDO shifted towared lower voltages. This characteristic was found to odify the series resistance, negtive differential resistance, capacitance, and the inductance of the RTDO. As a result, the resonant frequency of TRDO centered at 5.302 GHz was found to decrease about 20 MHz under the laser illumination. At a constnat bias voltage, the oscillation frequency decreased linearly as the laser power was increased.

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Electrical characteristics of the this film interface of amorphous chalcogenide semiconductor (비정질 칼코게나이드 반도체 박막 경계면의 전기적 특성)

  • 박창엽
    • 전기의세계
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    • v.29 no.2
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    • pp.111-117
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    • 1980
  • Contacts formed by vacuum evaporation of As-Te-Si-Ge chalcogenide glass onto Al metal (99.9999%) are studied by measuring paralle capacitance C(V), Cp(w), resistance R(V), Rp(w), and I-V characteristics. The fact that contact metal alloying produced high-resistance region is confirmed from the measurements of parallel capacitance and resistance. From the I-V characteristics in the pre-switcing region, it is found that electronic conduction and sitching occurs in the vicinity of metal-amorphous semiconductor interface. From the experimental obsevations, it is concuded that the current flow in the thin film is space-charge limited current (SCLC) due to the tunneling of electrons through the energy barriers.

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Electrostatic discharge simulation of tunneling magnetoresistance devices (터널링 자기저항 소자의 정전기 방전 시뮬레이션)

  • Park, S.Y.;Choi, Y.B.;Jo, S.C.
    • Journal of the Korean Magnetics Society
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    • v.12 no.5
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    • pp.168-173
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    • 2002
  • Electrostatic discharge characteristics were studied by connecting human body model (HBM) with tunneling magnetoresistance (TMR) device in this research. TMR samples were converted into electrical equivalent circuit with HBM and it was simulated utilizing PSPICE. Discharge characteristics were observed by changing the component values of the junction model in this equivalent circuit. The results show that resistance and capacitance of the TMR junction were determinative components that dominate the sensitivity of the electrostatic discharge(ESD). Reducing the resistance oi the junction area and lead line is more profitable to increase the recording density rather than increasing the capacitance to improve the endurance for ESD events. Endurance at DC state was performed by checking breakdown and failure voltages for applied DC voltage. HBM voltage that a TMR device could endure was estimated when the DC failure voltage was regarded as the HBM failure voltage.

RTN과 Wet Oxidation에 의한 $Ta_2O_5$의 전기적 특성의 최적화

  • 정형석;임기주;양두영;황현상
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.104-104
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    • 2000
  • MOS소자의 크기가 작아짐에 따라 gate 유전막의 두께 또한 얇아져야 한다. 두께가 얇아짐에 따라 gate 유전막으로써 기존의 SiO2는 direct tunneling으로 인해 높은 누설전류를 수반한다. 그래서 높은 유전상술르 가지는 물질들에 대한 연구의 필요성이 대두되고 있다. 그중 CVD-Ta2O5는 차세대 MOSFET소자기술에 있어서 높은 유전상수($\varepsilon$r+25)와 우수한 step coverage 때문에 각광을 받고 있는 물질중에 하나이다. 본 연구에서는 Ta2O5를 gate를 유전막으로 사용하고 RTN처리와 wet oxidation을 접목시켜 이들의 전기적인 특성을 향상시킬 수 있었다. p-형 wafer 위에 D2와 O2를 사용하여 SiO2(100 )를, NH3를 이용하여 Nitridation(10 )을 전처리로써 각각 실시하였고 그 위에 MOCVD방법으로 Ta2O5를 80 성장시켰다. 첫 번째 시편은 45$0^{\circ}C$ 10min동안 wet oxidation을 시켰고, 두 번째 시편은 $700^{\circ}C$ 60sec동안 NH3 분위기에서 RTN 처리를 하였다. 세 번째 시편은 동일조건으로 RTN 처리후 wet oxidation을 하였다. 그 후 각각의 시편을 capacitor를 제작하고 그 전기적 특성을 관찰하였다. Wet oxidation만을 시킨 시편은 as-deposited Ta2O5 시편에 비해서 -1.5V에서 누설전류는 약 2~3 order정도 감소되었고 accumulation 영역에서의 capacitance 값은 oxide층의 성장(5 )을 무시하면 거의 변화하지 않았다. RTN처리만 된 시편의 경우는 -1.5V에서 누설전류는 2~3order 정도 증가되었지만, accumulation 영역에서 capacitance 값은 거의 2qwork 증가하였다. 이 두가지 공정을 접목시킨 즉 RTN 처리후 wet oxidation 처리된 시편의 경우는 as-deposited Ta2O5 시편에 비해서 -1.5V에서 누설전류는 1 order 정도 감소하였고, accumulation 지역에서의 capacitance 값은 약 2배 증가하였다. 즉 as deposited Ta2O5 시편의 accumulation 지역의 capacitance 값은 12.8 fF/um2으로써 그 유효두께는 27.0 이었지만, RTN 처리후에 wet oxidation 시킨 시편의 accumulation 지역의 capacitance값은 21.2fF/um2으로써 그 유효두께는 16.3 이 되었다. 결론적으로 as deposited Ta2O5 시편에 RTN 처리후 wet oxidation을 실시한 결과 capacitance 값이 약 2배정도 증가하였고 누설전류는 약 1 order 정도 감소됨을 확인하였다.

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