• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.9-12
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• 2004

In this paper, a new small sized Lateral Trench Electrode Power MOS was proposed. This new structure, called LTEMOS(Lateral Trench Electrode Power MOS), was based on the conventional lateral power MOS. But the entire electrodes of LTEMOS were placed in trench oxide. The forward blocking voltage of the proposed LTEMOS was improved by 1.5 times with that of the conventional lateral power MOS. The forward blocking voltage of LTEMOS was about 240 V. At the same size, an improvement of the forward blocking voltage of about 1.5 times relative to the conventional MOS was observed by using ISE-TCAD which was used for analyzing device's electrical characteristics. Because all of the electrodes of the proposed device were formed in each trench oxide, the electric field was crowded to trench oxide and punch-through breakdown was occurred, lately.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권5호
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• pp.270-277
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• 2000

A new Lateral Trench-MOS Bipolar-Mode Field-Effect Transistor(LTMBMFET) is proposed and verified by MEDICI simulation. By using a trench MOS structure, the proposed device can enhance the current gain without sacrificing other device characteristics such as the breakdown voltage. The channel region of the proposed device is formed between the trench MOS structure. So the effect of the substrate voltage is negligible when compared with the conventional device which has a channel region between the gate junction and the buried oxide layer.

• KIEE International Transactions on Electrophysics and Applications
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• 제5C권2호
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• pp.58-62
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• 2005

A trench MOS barrier Schottky (TMBS) rectifier is proposed which utilizes the upper half of the trench sidewall as an active area. The proposed structure improves the forward voltage drop by 20$\%$ in comparison with the conventional one without degradation in breakdown voltage. An analytical model for the field distribution is given and compared with two-dimensional numerical simulations.

• 전기전자학회논문지
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• 제17권4호
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• pp.428-433
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• 2013

본 논문에서는 전력반도체 소자의 재료로써 주목받고 있는 탄화규소 기반의 Trench MOS Barrier Schottky(TMBS)의 순방향 및 역방향 특성을 개선시키기 위한 구조를 제안한다. 순방향 전압강하와 역방향 항복전압을 개선시키기 위하여 사다리꼴 mesa 구조와 trench sidewall의 길이를 조절하는 기법을 사용하는 4H-SiC TMBS 정류기를 제안하고 있다. 제안된 구조는 사다리꼴 mesa 구조를 적용하여 trench sidewall에 경사를 줌으로써 1508V의 역방향 항복전압을 얻었다. 이것은 기존의 4H-SiC TMBS 정류기에 비하여 역방향 항복전압을 11% 개선시켰음을 나타낸다. 또한 trench sidewall 상단의 길이를 조절하여 순방향 전류 $200A/cm^2$에 대하여 12% 감소된 1.6V의 순방향 전압강하를 얻었다. 제안된 소자는 Silvaco사의 T-CAD를 사용하여 전기적 특성을 분석하였다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2010년도 춘계학술대회
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• pp.779-781
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• 2010

Trench D-MOS(double-diffusion MOS)는 기존의 D-MOS를 대체한 것으로 전체 전류의 길이를 짧게 함으로써 온전압강하가 낮아지게 된다. 따라서 소자가 턴-온시에 전력소모가 작게 되며, 온저항과 트레이드 오프관계인 턴-오프 특성도 그다지 나빠지지 않아 트레이드 오프 특성도 개선되어지는 장점이 있다. 본 논문은 MicoroTec 시뮬레이션을 이용하여 Trench D-MOS의 산화벽을 다르게하여 전류-전압 특성을 연구하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.118-119
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• 2009

This paper presents the feature profile evolution silicon deep trench etching, which is very crucial for the commercial wafer process application. The silicon deep trenches were etched with the SF6 gas & Hbr gas based process recipe. The optimized silicon deep trench process resulted in vertical profiles (87o~90o) with loading effect of < 1%. The process recipes were developed for the silicon deep trench etching applications. This scheme provides vertically profiles without notching of top corner was observed. In this study, the production of SF6 gas based silicon deep trench etch process much more strongly than expected on the basis of Hbr gas trench process that have been investigated by scanning electron microscope (SEM). Based on the test results, it is concluded that the silicon deep trench etching shows the sufficient profile for practical MOS FET silicon deep trench technology process.

• 한국전기전자재료학회논문지
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• 제21권10호
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• pp.889-895
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• 2008

This paper presents a comprehensive mathematical analysis and simulation of trench IGBT with the help of PIN-PNP combinational model. Since trench IGBT is characteristically influenced by PIN diode, it may be almost impossible to analyze the trench IGBT using PNP-MOS modeling methods, even PIN-MOS techniques which neglect the hole current components coming into p-base region. A new PIN-PNP complementary cooperational model is developed in order to make up the drawbacks of existing models. It would allow us to make qualitative analysis as well as simulation about switching and on-state characteristics of 1,700 V trench IGBT. Moreover, if we improve the PIN diode effects through the optimization of trench structure, trench IGBT is expected to be one of the most promising devices in the not only high-voltage but also high speed switching device field.

• 전기전자학회논문지
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• 제14권3호
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• pp.199-204
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• 2010

본 논문에서는 전력반도체의 내압을 유지하는데 있어서 가장 중요한 필드 링의 개선을 위해 새로운 구조의 필드 링을 제안하였다. 제안한 트렌치 필드 링은 기존의 일반 필드 링에 비해 10%이상 효율을 개선하였다. 트렌치 필드 링의 설계를 위해 5가지의 변수를 두고 최적화 시뮬레이션을 수행하였으며, 수행한 파라미터 결과를 가지고 마스크를 설계하여 제작을 진행하였다. 내압이 증가하면 증가할 수록 트렌치 필드링이 일반 필드 링보다 더 좋은 결과를 가져올 수 있었다. 이러한 결과는 앞으로 전력반도체 소자인 IGBT, Power MOS 및 MCT 소자의 설계에 충분히 활용할 수 있을 것으로 판단된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.3-6
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• 2004

반도체 디자인, 공정 기술 및 패기지 기술의 발달에 따라 전력용 반도체는 소형화, 고성능화, 지능화하고 있다. 고속 구동이 용이한 때문에 MOSFET이나 IGBT등의 MOS-gate형 전력 반도체의 발전이 두드려지며, trench, charge balance, NPT 기술등이 패키지 기술과 더불어 이를 위한 주요 기술이 될것으로 보인다. SiC나 GaN등의 Wide Band Gap 물질들을 사용한 차세대 전력 반도체 연구도 활발히 진행되고 있다.

• 한국컴퓨터산업교육학회:학술대회논문집
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• 한국컴퓨터산업교육학회 2003년도 제4회 종합학술대회 논문집
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• pp.95-98
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• 2003

Power semiconductors are being currently used as a application of intelligent power inverters to a refrigerator, a washing machine and a vacuum cleaner as well as core parts of industrial system. The rating of semiconductor devices is an important factor in decision on the field of application and the forward blocking voltage is one of factors in decision of the rating. The Power MOS device has a merit of high input impedance, short switching time, and stability in temperature as well known. Power MOS devices are mainly used as switches in the field of power electronics, especially the on-state resistance and breakdown voltage are regarded as the most important parameters. Power MOS devices that enable a small size, a light weight, high-integration and relatively high voltage are required these days. In this paper, we proposed the new lateral power MOS which has forward blocking voltage of 250V and contains trench electrodes and verified manufactural possibility by using TSUPREM-4 that is process simulator.