• 제목/요약/키워드: threshold voltage ($V_{th}$)

검색결과 110건 처리시간 0.038초

산화물반도체 트랜지스터 안정성 향상 연구 (Investigation on the Stability Enhancement of Oxide Thin Film Transistor)

  • 이상렬
    • 한국전기전자재료학회논문지
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    • 제26권5호
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    • pp.351-354
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    • 2013
  • Thin-film transistors(TFTs) with silicon-zinc-tin-oxide(SiZnSnO, SZTO) channel layer are fabricated by rf sputtering method. Electrical properties were changed by different annealing treatment of dry annealing and wet annealing. This procedure improves electrical property especially, stability of oxide TFT. Improved electrical properties are ascribed to desorption of the negatively charged oxygen species from the surfaces by annealing treatment. The threshold voltage ($V_{th}$) shifted toward positive as increasing Si contents in SZTO system. Because the Si has a lower standard electrode potential (SEP) than that that of Sn, Zn, resulting in the degeneration of the oxygen vacancy ($V_O$). As a result, the Si acts as carrier suppressor and oxygen binder in the SZTO as well as a $V_{th}$ controller, resulting in the enhancement of stability of TFTs.

자계 유도 고상결정화를 이용한 다결정 실리콘 박막 트랜지스터의 채널 길이와 드레인 전압에 따른 문턱 전압 변화 (Effect of Channel Length and Drain Bias on Threshold Voltage of Field Enhanced Solid Phase Crystallization Polycrystalline Thin Film Transistor on the Glass Substrate)

  • 강동원;이원규;한상면;박상근;한민구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 제38회 하계학술대회
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    • pp.1263-1264
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    • 2007
  • 자계 유도 고상결정화(FESPC)를 이용하여 제작한 다결정실리콘(poly-Si) 박막 트랜지스터(TFT)는 비정질 실리콘 박막 트랜지스터(a-Si:H TFT)보다 뛰어난 전기적 특성과 우수한 안정성을 지닌다. $V_{DS}$ = -0.1 V에서 채널 폭과 길이가 각각 $5\;{\mu}m$, $7\;{\mu}m$인 P형 TFT의 이동도(${\mu}$)와 문턱 전압($V_{TH}$)은 각각 $31.98\;cm^2$/Vs, -6.14 V 이다. FESPC TFT는 일반 poly-Si TFT에 비해 채널 내 결정 경계 숫자가 많아서 상대적으로 열악한 특성을 가진다. 채널 길이 $5\;{\mu}m$인 TFT의 $V_{TH}$는 채널 길이 $18\;{\mu}m$ 소자의 $V_{TH}$보다 1.36V 작지만, 일반적으로 큰 값이다. 이 현상은 채널에 다수의 결정 경계가 존재하고, 수평 전계가 크기 때문이다. 수평 전계가 증가하면, 결정 경계의 전위 장벽 높이가 감소하게 되는데, 이는 DIGBL 효과이다. ${\mu}$의 증가에 따라서, 드레인 전류가 증가하고 $V_{TH}$은 감소한다. 활성화 에너지($E_a$)는 드레인 전압과 결정 경계의 수에 따라 변하는데, 드레인 전압이 크거나 결정 경계의 수가 감소하면 $E_a$는 감소한다. $E_a$가 감소하면 $V_{TH}$가 감소한다. 유리기판 위의 FESPC를 이용한 P형 poly-Si TFT의 $V_{TH}$는 채널의 길이와 $V_{DS}$에 영향을 받는다. 증가한 수평 전계가 결정 경계에서 에너지 장벽을 낮추는 효과를 일으키기 때문이다.

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Design of Novel 1 Transistor Phase Change Memory

  • Kim, Jooyeon;Kim, Byungcheul
    • Transactions on Electrical and Electronic Materials
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    • 제15권1호
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    • pp.37-40
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    • 2014
  • A novel memory is reported, in which $Ge_2Sb_2Te_5$ (GST) has been used as a floating gate. The threshold voltage was shifted due to the phase transition of the GST layer, and the hysteretic behavior is opposite to that arising from charge trapping. Finite Element Modeling (FEM) was adapted, and a new simulation program was developed using c-interpreter, in order to analyze the small shift of threshold voltage. The results show that GST undergoes a partial phase transformation during the process of RESET or SET operation. A large $V_{TH}$ shift was observed when the thickness of the GST layer was scaled down from 50 nm to 25 nm. The novel 1 transistor PCM (1TPCM) can achieve a faster write time, maintaining a smaller cell size.

저온에서 수소 처리시킨 다결정 실리콘 n-TFT의 열화특성 분석 (The Degradation Characteristics Analysis of Poly-Silicon n-TFT the Hydrogenated Process under Low Temperature)

  • 송재열;이종형;한대현;이용재
    • 한국정보통신학회논문지
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    • 제12권9호
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    • pp.1615-1622
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    • 2008
  • 경사형 스페이서와 LDD 영역을 갖는 다결정 실리콘 TFT를 제작하였다. 소자 특성의 신뢰성을 위해 수소($H_2$)와 수소/플라즈마 처리 공정으로 수소 처리된 n-채널 다결정실리콘 TFT 소자를 제작하였다. 소자에 최대 누설전류의 게이트 전압 조건에서 소자에 스트레스를 인가시켰다. 게이트 전압 스트레스 조건에 의해 야기되는 열화 특성인자들인 드레인 전류, 문턱전압($V_{th}$), 부-문턱전압 기울기(S), 최대 전달 컨덕턴스($g_m$), 그리고 파워인자 값을 측정/추출하였으며, 수소처리 공정이 소자 특성의 열화 결과에 미치는 관계를 분석하였다. 특성 파라미터의 분석 결과, 수소화 처리시킨 n-채널 다결정 실리콘 박막 트랜지스터에서 열화특성의 원인들은 다결정실리콘/산화막의 계면과 다결정 실리콘의 그레인 경계에서 실리콘-수소 본드의 해리에 의한 현수 본드의 증가이었다. 따라서 새로 제안한 다결정 TFT의 구조는 제작 공정 단계가 간단하며, 소자 특성에서 누설전류가 드레인 영역 근처 감소된 수평 전계에 의해 감소되었다.

The effect of negative bias stress stability in high mobility In-Ga-O TFTs

  • Jo, Kwang-Min;Sung, Sang-Yun;You, Jae-Lok;Kim, Se-Yun;Lee, Joon-Hyung;Kim, Jeong-Joo;Heo, Young-Woo
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2013년도 춘계학술대회 논문집
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    • pp.154-154
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    • 2013
  • In this work, we investigated the characteristics and the effects of light on the negative gate bias stress stability (NBS) in high mobility polycrystalline IGO TFTs. IGO TFT showed a high drain current on/off ratio of ${\sim}10^9$, a field-effect mobility of $114cm^2/Vs$, a threshold voltage of -4V, and a subthresholdslpe(SS) of 0.28V/decade from log($I_{DS}$) vs $V_{GS}$. IGO TFTs showed large negative $V_{TH}$ shift(17V) at light power of $5mW/cm^2$ with negative gate bias stress of -10V for 10000seconds, at a fixed drain voltage ($V_{DS}$) of 0.5V.

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Atomic layer epitaxy(ALE) 방법으로 제작된 ZnS:Mn 박막전계발광소자의 전기, 광학적 특성 (Electrical and optical characeristics of ZnS:Mn thin-film electroluminescent(TFEL) devices grown by atomic layer epitaxy)

  • 이순석;윤선진;임성규
    • 전자공학회논문지D
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    • 제35D권2호
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    • pp.52-59
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    • 1998
  • The ZnS:Mn thin film electroluminescent(TFEL) devices fabricated by ALE system were investigated. Yellow-orange light emission was observed when the applied voltage exceeded 134 V and luminance increased sharply as the applied voltage increased. Luminance of 568 Cd/c $m^{2}$ was obtained under 1 KHz sinusoidal voltage wave application at the peak applied voltage of 230 V. The peak wavelength of the emissionwas 577 nm. The C-V, Q-V, $Q_{t}$ - $F_{p}$ , L- $Q_{cond}$, and V- $Q_{pol}$ have been measured under theapplication of the trapezoidal wave with its pulse width varying 0 to 75 .mu.sec. The phoshor and the insulator capacitance of the TFEL device under test were 24.3 nF/c $m^{2}$ and 9 nF/c $m^{2}$, respectively. It was observed that the threshold voltage changed from 137V to 100V as the pulse width varied from 0 to 75 .mu.sec. The L- $Q_{cond}$ characteristics showed that the light emission increased in proportion to the $Q_{cond}$. The luminance increased from 386 Cd/ $m^{2}$ to 607 Cd/ $m^{2}$ when the $Q^{+}$$_{cond}$ increased from 1.3 .mu.C/c $m^{2}$ to 2.3 .mu.C/c $m^{2}$. The V- $Q_{pol}$ characteristics showed that the V was inversely proportional to $Q_{pol}$./. th/ was inversely proportional to $Q_{pol}$./. pol/./.

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Tramadol as a Voltage-Gated Sodium Channel Blocker of Peripheral Sodium Channels Nav1.7 and Nav1.5

  • Chan-Su, Bok;Ryeong-Eun, Kim;Yong-Yeon, Cho;Jin-Sung, Choi
    • Biomolecules & Therapeutics
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    • 제31권2호
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    • pp.168-175
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    • 2023
  • Tramadol is an opioid analog used to treat chronic and acute pain. Intradermal injections of tramadol at hundreds of millimoles have been shown to produce a local anesthetic effect. We used the whole-cell patch-clamp technique in this study to investigate whether tramadol blocks the sodium current in HEK293 cells, which stably express the pain threshold sodium channel Nav1.7 or the cardiac sodium channel Nav1.5. The half-maximal inhibitory concentration of tramadol was 0.73 mM for Nav1.7 and 0.43 mM for Nav1.5 at a holding potential of -100 mV. The blocking effects of tramadol were completely reversible. Tramadol shifted the steady-state inactivation curves of Nav1.7 and Nav1.5 toward hyperpolarization. Tramadol also slowed the recovery rate from the inactivation of Nav1.7 and Nav1.5 and induced stronger use-dependent inhibition. Because the mean plasma concentration of tramadol upon oral administration is lower than its mean blocking concentration of sodium channels in this study, it is unlikely that tramadol in plasma will have an analgesic effect by blocking Nav1.7 or show cardiotoxicity by blocking Nav1.5. However, tramadol could act as a local anesthetic when used at a concentration of several hundred millimoles by intradermal injection and as an antiarrhythmic when injected intravenously at a similar dose, as does lidocaine.

Size Scaling에 따른 Gate-All-Around Silicon Nanowire MOSFET의 특성 연구

  • 이대한;정우진
    • EDISON SW 활용 경진대회 논문집
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    • 제3회(2014년)
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    • pp.434-438
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    • 2014
  • CMOS의 최종형태로써 Gate-All-Around(GAA) Silicon Nanowire(NW)가 각광받고 있다. 이 논문에서 NW FET(Field Effect Transistor)의 채널 길이와 NW의 폭과 같은 size에 따른 특성변화를 실제 실험 data와 NW FET 특성분석 simulation을 이용해서 비교해보았다. MOSFET(Metal Oxide Semiconductor Field Effect Transistor)의 소형화에 따른 쇼트 채널 효과(short channel effect)에 의한 threshold voltage($V_{th}$), Drain Induced Barrier Lowering(DIBL), subthreshold swing(SS) 또한 비교하였다. 이에 더하여, 기존의 상용툴로 NW를 해석한 시뮬레이션 결과와도 비교해봄으로써 NW의 size scaling에 대한 EDISON NW 해석 simulation의 정확도를 파악해보았다.

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Electrical characteristics of poly-Si NVM by using the MIC as the active layer

  • Cho, Jae-Hyun;Nguyen, Thanh Nga;Jung, Sung-Wook;Yi, Jun-Sin
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.151-151
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    • 2010
  • In this paper, the electrically properties of nonvolatile memory (NVM) using multi-stacks gate insulators of oxide-nitride-oxynitride (ONOn) and active layer of the low temperature polycrystalline silicon (LTPS) were investigated. From hydrogenated amorphous silicon (a-Si:H), the LTPS thin films with high crystalline fraction of 96% and low surface's roughness of 1.28 nm were fabricated by the metal induced crystallization (MIC) with annealing conditions of $650^{\circ}C$ for 5 hours on glass substrates. The LTPS thin film transistor (TFT) or the NVM obtains a field effect mobility of ($\mu_{FE}$) $10\;cm^2/V{\cdot}s$, threshold voltage ($V_{TH}$) of -3.5V. The results demonstrated that the NVM has a memory window of 1.6 V with a programming and erasing (P/E) voltage of -14 V and 14 V in 1 ms. Moreover, retention properties of the memory was determined exceed 80% after 10 years. Therefore, the LTPS fabricated by the MIC became a potential material for NVM application which employed for the system integration of the panel display.

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Temperature-Dependent Instabilities of DC characteristics in AlGaN/GaN-on-Si Heterojunction Field Effect Transistors

  • Keum, Dong-Min;Choi, Shinhyuk;Kang, Youngjin;Lee, Jae-Gil;Cha, Ho-Young;Kim, Hyungtak
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권5호
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    • pp.682-687
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    • 2014
  • We have performed reverse gate bias stress tests on AlGaN/GaN-on-Si Heterostructure FETs (HFETs). The shift of threshold voltage ($V_{th}$) and the reduction of on-current were observed from the stressed devices. These changes of the device parameters were not permanent. We investigated the temporary behavior of the stressed devices by analyzing the temperature dependence of the instabilities and TCAD simulation. As the baseline temperature of the electrical stress tests increased, the changes of the $V_{th}$ and the on-current were decreased. The on-current reduction was caused by the positive shift of the $V_{th}$ and the increased resistance of the gate-to-source and the gate-to-drain access region. Our experimental results suggest that electron-trapping effect into the shallow traps in devices is the main cause of observed instabilities.