• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Structural Engineering and Mechanics
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• v.75 no.6
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• pp.747-769
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• 2020

This paper provides a semi-analytical approach to investigate the variations of 3D displacement components, electric potential, stresses, electric displacements and transverse vibration frequencies in laminated piezoelectric composite plates based on the scaled boundary finite element method (SBFEM) and the precise integration algorithm (PIA). The proposed approach can analyze the static and dynamic responses of multilayered piezoelectric plates with any number of laminae, various geometrical shapes, boundary conditions, thickness-to-length ratios and stacking sequences. Only a longitudinal surface of the plate is discretized into 2D elements, which helps to improve the computational efficiency. Comparing with plate theories and other numerical methods, only three displacement components and the electric potential are set as the basic unknown variables and can be represented analytically through the transverse direction. The whole derivation is built upon the three dimensional key equations of elasticity for the piezoelectric materials and no assumptions on the plate kinematics have been taken. By virtue of the equilibrium equations, the constitutive relations and the introduced set of scaled boundary coordinates, three-dimensional governing partial differential equations are converted into the second order ordinary differential matrix equation. Furthermore, aided by the introduced internal nodal force, a first order ordinary differential equation is obtained with its general solution in the form of a matrix exponent. To further improve the accuracy of the matrix exponent in the SBFEM, the PIA is employed to make sure any desired accuracy of the mechanical and electric variables. By virtue of the kinetic energy technique, the global mass matrix of the composite plates constituted by piezoelectric laminae is constructed for the first time based on the SBFEM. Finally, comparisons with the exact solutions and available results are made to confirm the accuracy and effectiveness of the developed methodology. What's more, the effect of boundary conditions, thickness-to-length ratios and stacking sequences of laminae on the distributions of natural frequencies, mechanical and electric fields in laminated piezoelectric composite plates is evaluated.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.639-643
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• 2021

In this study, fluorinated ethylene propylene (FEP) nanoparticle as an adhesive for fabricating a three-dimensional multilayered microfluidic device was studied. The formation of evenly distributed FEP nanoparticles layer with 3 ㎛ in thickness on substrates was achieved by simple spin coating of FEP dispersion solution at 1500 rpm for 30 s. It is confirmed that FEP nanoparticles transformed into a hydrophobic thin film after thermal treatment at 300 ℃ for 1 hour, and fabricated polyimide film-based microfluidic device using FEP nanoparticle was endured pressure up to 2250 psi. Finally, a three-dimensional multilayered microfluidic device composed of 16 microreactors, which are difficult to fabricate with conventional photolithography, was successfully realized by simple one-step alignment of FEP coated nine polyimide films. The developed three-dimensional multilayered microfluidic device has the potential to be a powerful tool such as high-throughput screening, mass production, parallelization, and large-scale microfluidic integration for various applications in chemistry and biology.

• Journal of information and communication convergence engineering
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• v.12 no.3
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• pp.186-192
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• 2014

Monolithic three-dimensional integrated chips (3D ICs) are an emerging technology that offers an integration density that is some orders of magnitude higher than the conventional through-silicon-via (TSV)-based 3D ICs. This is due to a sequential integration process that enables extremely small monolithic inter-tier vias (MIVs). For a monolithic 3D memory, we first explore the static random-access memory (SRAM) design. Next, for digital logic, we explore several design styles. The first is transistor-level, which is a design style unique to monolithic 3D ICs that are enabled by the ultra-high-density of MIVs. We also explore gate-level and block-level design styles, which are available for TSV-based 3D ICs. For each of these design styles, we present techniques to obtain the graphic database system (GDS) layouts, and perform a signoff-quality performance and power analysis. We also discuss various challenges facing monolithic 3D ICs, such as achieving 50% footprint reduction over two-dimensional (2D) ICs, routing congestion, power delivery network design, and thermal issues. Finally, we present design techniques to overcome these challenges.

• Journal of Positioning, Navigation, and Timing
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• v.7 no.2
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• pp.61-71
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• 2018

Existing radio positioning systems have a drawback that the attitude of user's tag is difficult to be determined. Although forward link angle of arrival (FLAOA) technology that uses measurements of array antenna arranged in a tag among the angle of arrival (AOA) technologies can estimate attitude and positioning of tags, it cannot extend the estimated results into three-dimensional (3D) results due to complex non-linear model displayed because of the effects of 3D positioning and attitude in tags. This paper proposed a radio navigation technique that determines 3D attitude and positioning via FLAOA / time of arrival (TOA) integration. According to the order of determining attitude and positioning, two integration techniques were proposed. To analyze the performance of the proposed technique, MATLAB-based simulations were used to verify the performance. The simulation results showed that the first proposed method, TOA-FLAOA integrated technique, showed about 0.15 m of positioning error, and $2-3^{\circ}$ of attitude error performances regardless of the positioning space size whereas the second method, differenced FLAOA-TOA integrated technique, revealed a problem that a positioning error became larger as the size of the positioning space became larger.

• Ocean Systems Engineering
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• v.1 no.4
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• pp.355-372
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• 2011

Based on the fully nonlinear velocity potential theory, the liquid sloshing in a three dimensional tank under random excitation is studied. The governing Laplace equation with fully nonlinear boundary conditions on the moving free surface is solved using the indirect desingularized boundary integral equation method (DBIEM). The fourth-order predictor-corrector Adams-Bashforth-Moulton scheme (ABM4) and mixed Eulerian-Lagrangian (MEL) method are used for the time-stepping integration of the free surface boundary conditions. A smoothing scheme, B-spline curve, is applied to both the longitudinal and transverse directions of the tank to eliminate the possible saw-tooth instabilities. When the tank is undergoing one dimensional regular motion of small amplitude, the calculated results are found to be in very good agreement with linear analytical solution. In the simulation, the normal standing waves, travelling waves and bores are observed. The extensive calculation has been made for the tank undergoing specified random oscillation. The nonlinear effect of random sloshing wave is studied and the effect of peak frequency used for the generation of random oscillation is investigated. It is found that, even as the peak value of spectrum for oscillation becomes smaller, the maximum wave elevation on the side wall becomes bigger when the peak frequency is closer to the natural frequency.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.1-8
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• 2022

High-density packaging technologies, including Through-Si-Via (TSV) technologies, are considered important in many fields such as IoT (internet of things), 6G/5G (generation) communication, and high-performance computing (HPC). Achieving high integration in two dimensional packaging has confronted with physical limitations, and hence various studies have been performed for the three-dimensional (3D) packaging technologies. In this review, we described about the causes and effects of scallop formation in TSV, the scallop-free etching technique for creating smooth sidewalls, Cu pillar and Cu-SiO₂ hybrid bonding in TSV. These technologies are expected to have effects on the formation of high-quality TSVs and the development of 3D packaging technologies.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.223-226
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• 1995

A three-dimensional elastic-plastic finite element analysis using the explicit time integration method has been performed for the characterization of theimpact forming machines. The block upsetting using a forging hammer has been analyzed. The effects of machine type, work capacity of equipment and the mass ratio in an anvil-type hammer have been studied through the analysis.

• Journal of Korean Port Research
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• v.13 no.1
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• pp.167-174
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• 1999

Numerical analysis of two-fluid flows for both water and air is carried out. Free-Surface flows with an arbitrary deformation have been simulated around two dimensional submerged hydrofoil. The computation is performed using a finite volume method with unstructured meshes and an interface capturing scheme to determine the shape of the free surface. The method uses control volumes with an arbitrary number of faces and allows cell-wise local mesh refinement. the integration in space is of second order based on midpoint rule integration and linear interpolation. The method is fully implicit and uses quadratic interpolation in time through three time levels The linear equation systems are solved by conjugate gradient type solvers and the non-linearity of equations is accounted for through picard iterations. The solution method is of pressure-correction type and solves sequentially the linearized momentum equations the continuity equation the conservation equation of one species and the equations or two turbulence quantities.