Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Scallop-free TSV, Copper Pillar and Hybrid Bonding for 3D Packaging

3D 패키징을 위한 Scallop-free TSV와 Cu Pillar 및 하이브리드 본딩

  • Jang, Ye Jin (Dept. of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae Pil (Dept. of Materials Science and Engineering, University of Seoul)
  • 장예진 (서울시립대학교 신소재공학과) ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Received : 2022.12.16
  • Accepted : 2022.12.28
  • Published : 2022.12.30
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Abstract

High-density packaging technologies, including Through-Si-Via (TSV) technologies, are considered important in many fields such as IoT (internet of things), 6G/5G (generation) communication, and high-performance computing (HPC). Achieving high integration in two dimensional packaging has confronted with physical limitations, and hence various studies have been performed for the three-dimensional (3D) packaging technologies. In this review, we described about the causes and effects of scallop formation in TSV, the scallop-free etching technique for creating smooth sidewalls, Cu pillar and Cu-SiO2 hybrid bonding in TSV. These technologies are expected to have effects on the formation of high-quality TSVs and the development of 3D packaging technologies.

TSV 기술을 포함한 고밀도, 고집적 패키징 기술은 IoT, 6G/5G 통신, HPC (high-performance computing)등 여러 분야에서 중요한 기술로 여겨지고 있다. 2차원에서 고집적화를 달성하는 것은 물리적 한계에 도달하게 되었으며, 따라서 3D 패키징 기술을 위하여 다양한 연구들이 진행되고 있다. 본 고에서는 scallop의 형성 원인과 영향, 매끈한 측벽을 만들기 위한 scallop-free 에칭 기술, TSV 표면의 Cu bonding에 대해서 자세히 조사하였다. 이러한 기술들은 고품질 TSV 형성 및 3D 패키징 기술에 영향을 줄 것으로 예상한다.

Keywords

Acknowledgement

본 연구는 산업통상자원부 및 산업기술평가관리원(KEIT)의 소재부품기술개발사업 연구비 지원에 의해 수행되었습니다. ('20010580', 미니-LED 미세전극 접합을 위한 도전성 나노소재 기술 개발)

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