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S. Samal, K. Samadi, P. Kamal, Y. Du, and S. K. Lim, "Full chip impact study of power delivery network designs in monolithic 3D ICs," in Proceedings of the IEEE International Conference on Computer-Aided Design, 2014.
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S. Panth, K. Samadi, Y. Du, and S. K. Lim, "High-density integration of functional modules using monolithic 3D-IC technology," in Proceedings of the 18th IEEE/ACM Asia and South Pacific Design Automation Conference, Yokohama, Japan, pp. 681-686, 2013.
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S. Panth, K. Samadi, Y. Du, and S. K. Lim, "Power-performance study of block-level monolithic 3D-ICs considering inter-tier performance variations," in Proceedings of the 51st IEEE/ACM Design Automation Conference, San Francisco, CA, pp. 1-6, 2014.
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S. K. Samal, S. Panth, K. Samadi, M. Saeidi, Y. Du, and S. K. Lim, "Fast and accurate thermal modeling and optimization for monolithic 3D ICs," in Proceedings of the 51st IEEE/ACM Design Automation Conference, San Francisco, CA, pp. 1-6, 2014.
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P. Batude, M. Vinet, A. Pouydebasque, C. Le Royer, B. Previtali, C. Tabone, et al., "Advances in 3D CMOS sequential integration," in Proceedings of the IEEE International Electron Devices Meeting, Baltimore, MD, pp. 1-4, 2009.
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C. Liu and S. K. Lim, "Ultra-high density 3D SRAM cell designs for monolithic 3D integration," in Proceedings of the IEEE International Interconnect Technology Conference, San Jose, CA, pp. 1-3, 2012.
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C. Liu and S. K. Lim, "A design tradeoff study with monolithic 3D integration," in Proceedings of the 13th International Symposium on Quality Electronic Design, Santa Clara, CA, pp. 529-536, 2012.
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Y. J. Lee, D. Limbrick, and S. K. Lim, "Power benefit study for ultra-high density transistor-level monolithic 3D ICs," in Proceedings of the IEEE/ACM Design Automation Conference, Austin, TX, pp. 1-10, 2013.
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Y. J. Lee, P. Morrow, and S. K. Lim, "Ultra high density logic designs using transistor-level monolithic 3D integration," in Proceedings of the IEEE International Conference on Computer-Aided Design, San Jose, CA, pp. 539-546, 2012.
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