• Geosystem Engineering
• /
• 제21권6호
• /
• pp.309-317
• /
• 2018

We employ a three-dimensional indirect boundary element method (BEM) to simulate temperature change around an underground liquefied natural gas storage cavern. The indirect BEM (IBEM) uses fictitious heat source strength on boundary elements as basic variables which are solved from equations of boundary conditions and then used to compute the temperature change at other points in the considered problem domain. The IBEM requires evaluation of singular integration for temperature change due to heat conduction from a constant heat source on a planar (triangular) region. The singularity can be eliminated by a semi-analytical integration scheme. However, it is found that the semi-analytical integration scheme yields sharp temperature gradient for points close to vertices of triangle. This affects the accuracy of heat flux, if they are evaluated by finite difference method at these points. This difficulty can be overcome by a combination of using a direct numerical integration for these points and the semi-analytical scheme for other points distance away from the vertices. The IBEM and the hybrid integration scheme have been verified with an analytic solution and then used to the application of the underground storage.

• 유체기계공업학회:학술대회논문집
• /
• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
• /
• pp.517-518
• /
• 2006

Transient and asymmetric density distributions have been investigated by three-dimensional digital speckle tomography with a novel integration method. Multiple CCD images captured movements of speckles in three angles of view simultaneously because the flows were asymmetric and unsteady. The speckle movements which have been formed by a ground glass between no flow and downward butane flow from a circular half opening have been calculated by a cross-correlation tracking method so that those distances can be transferred to deflection angles of laser rays for density gradients. A novel integration method has been developed to obtain projection data from the deflection angles for the speckle tomography.'The three-dimensional density fields have been reconstructed from the accurate projection values by a real-time multiplicative algebraic reconstruction technique (MART) with the developed integration method.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2001년도 ICCAS
• /
• pp.94.5-94
• /
• 2001

Unrestricted measurement method of three-dimensional walking distance utilizing body acceleration and terrestrial magnetism is discussed. The three-dimensional walking distance is derived by the integration of the three dimensional acceleration of foot during swing phase. Since the sensor system attached on the foot rotates during swing phase, the acceleration data measured on the foot include acceleration of gravity which causes inaccurate calculation of the velocity and the distance. Three gyros are used to compensate the rotation of the sensor system. Moreover, one geomagnetic sensor is employed to derive the heading direction of the subject Healthy volunteers performed ...

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제4권3호
• /
• pp.196-203
• /
• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• 한국전자통신학회논문지
• /
• 제8권1호
• /
• pp.99-104
• /
• 2013

소형화된 고기능성 휴대용 전자기기의 수요 급증에 따라 기존에 사용되던 수평구조의 2차원 회로의 크기를 줄이는 것은, 전기 배선의 신호지연 증가로 한계에 도달했다. 이러한 문제를 해결하기 위해 회로들을 수직으로 적층한 뒤, 수평구조의 긴 신호배선을 짧은 수직 배선으로 만들어 신호지연을 최소화하는 3차원 집적 회로 적층기술이 새롭게 제안되었다. 본 연구에서는 차세대 반도체 소자의 회로 집적도를 비약적으로 증가시킬 수 있고, 현재 문제점으로 대두 되고 있는 선로의 증가, 소비전력, 소자의 소형화, 다기능 회로 문제를 동시에 해결 할 수 있는 3차원 구조를 갖는 회로소자에 대한 특성을 연구하였다.

• 한국전산구조공학회:학술대회논문집
• /
• 한국전산구조공학회 2008년도 정기 학술대회
• /
• pp.172-176
• /
• 2008

In this paper, three dimensional linear conforming variable-finite elements are presented with the aid of a smoothed integration (a class of stabilized conforming nodal integration), for mnltiscale mechanics problems. These elements meet the desirable properties of an interpolation such as the Kronecker delta condition, the partition of unity condition and the positiveness of interpolation function. The necessary condition of linear exactness is fully relaxed by employing the smoothed integration, which renders us to meet the linear exactness in a straightforward manner. This novel element description extend the category of the conventional finite elements space to ration type function space and give the flexibility on the number of nodes of element which are fixed in the conventional finite elements. Several examples are provided to show the convergence and the accuracy of the proposed elements, and to demonstrate their potential with emphasis on the multiscale mechanics problems such as global/local analysis, nonmatching contact problems, and modeling of composite material with defects.

• 한국실내디자인학회논문집
• /
• 제25권4호
• /
• pp.43-50
• /
• 2016

This study tries to categorize trends of "structure and skin integration" and understand the expressive characters of each architectural type. To do so, we listed up 8 architects who are quoted twice or more in related researches, then analyzed their 25 contemporary buildings which integrated structure and skin since 2000. As a result, this study defined four types based on the way of building tectonic system of structure and skin. Key feature of "linear structure-two dimensional skin" type is the communication with the surroundings as a result of .geometric architectural forms, patterned surface and reflection. Characters of "linear-three dimensional" type are organic architectural forms, sculptural skin, and the mysterious space. "Planar-two dimensional" type is a transformational geometry form to express the dramatic images through the skin, therefore gives a sense of rhythm and dynamics to space. "Planar structure-three dimensional" type highlights the texture, and exposes boundary of the inside and outside. In architectures we studied, the structure is the way to make a creative forms and space, and the skin to express various meanings. That said, the "structure and skin integration" is the means of aggressive design expression.

• 대한수학회지
• /
• 제40권2호
• /
• pp.251-272
• /
• 2003

Multidimensional integrals are expressed in terms of lower dimensional integrals and function evaluations. An iterative process is used where a trapezoidal and three point identities are used as generators for higher dimensional identities. Bounds are obtained utilising the resulting identities. It is demonstrated that earlier Ostrowski type results are obtained as particular instances of the current work.

• 한국지리정보학회지
• /
• 제23권4호
• /
• pp.16-41
• /
• 2020

실제 공간의 분포 또는 양적 속성을 대변하는 지리정보 입력은 지구시스템 모의 내에서 주요 관심사가 되고 있다. 많은 연구에서 다양한 격자 해상도에서의 지표면 특성에 대한 부정확한 추정이 모델링 결과를 크게 바꾸는 것으로 나타났다. 따라서, 이 논문은 도시지역 건물들의 분포와 면적·체적 속성을 반영하기 위해서, 항공라이다로 수집된 3DPC(three-dimensional point cloud) 샘플링 체계에 Monte Carlo Integration(MCI) 기법 기반 공간확률(spatial probability)을 적용을 제안하였다. 건물 식별과 관련해 공간확률(SP) 임계치, 격자 크기, 3차원점군 밀도 세 인자의 결정규칙 적용 결과가 비교되었다. 연구 결과, 건물의 격자가 커짐에 따라 식별되는 건물의 면적 속성이 증가하였다. 공간 모델링 및 분석의 신뢰성을 높이기 위해서는 샘플링 체계에서의 결정규칙을 사용하여 건물의 면적 속성을 조정하는 것이 권장된다. 제안된 방법은 모델링 분야가 요구하는 크고 작은 격자의 변화에서도 일정하게 건물 면적 속성이 유지되도록 지원할 것이다.

• 전자공학회논문지D
• /
• 제34D권8호
• /
• pp.15-25
• /
• 1997

The integration method of carier concentrations to redcue the discretization error of th box integratio method used in the discretization of the three-dimensional poisson's equation is presented. The carrier concentration is approximated in the closed form as an exponential function of the linearly varying potential in the element. The presented method is implemented in the three-dimensional poisson's equation solver running under the windows 95. The accuracy and the convergence chaacteristics of the three-dimensional poisson's equation solver are compared with those of DAVINCI for the PN junction diode and the n-MOSFET under the thermal equilibrium and the DC reverse bias. The potential distributions of the simulatied devices from the three-dimensional poisson's equation solver, compared with those of DAVINCI, has a relative error within 2.8%. The average number of iterations needed to obtain the solution of the PN junction diode and the n-MOSFET using the presented method are 11.47 and 11.16 while the those of DAVINCI are 21.73 and 23.0 respectively.