• KIEE International Transactions on Electrophysics and Applications
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• v.2C no.6
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• pp.314-320
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• 2002

Three different ZnO nanomaterials (nanobelts, nanorods, and nanowires) were synthesized at 138$0^{\circ}C$ from ball-milled ZnO powders by a thermal evaporation procedure with an argon carrier gas without any catalysts. Transmission electron microscopy (TEM) revealed that the ZnO nanobelts are single crystalline with the growth direction perpendicular to the (010) lattice plane, and that the ZnO nanorods and nanowires are single crystalline with the growth directions perpendicular to the (001) and (110) lattice Planes, respectively. In cathodoluminescence (CL), the energy Position of the near band-edge (NBE) peak is 3.280 eV for the 100-, 250-, and 500-nm thick nanobelts, 3.262 eV for the 100- and 250-nm thick nanorods, and 3.237 eV for the 500-nm thick nanorods. The synthesized ZnO nanorods were coated conformally with aluminum oxide (Al$_2$O$_3$) material by atomic layer deposition (ALD). $Al_2$O$_3$films were then deposited on these ZnO nanorods by ALD at a substrate temperature of 300 $^{\circ}C$ using trimethylaluminum (TMA) and distilled water ($H_2O$). Transmission electron microscopy (TEM) images of the deposited ZnO nanorods revealed that 40nm-thick $Al_2$O$_3$ cylindrical shells surround the ZnO nanorods.

• Journal of the Korean institute of surface engineering
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• v.54 no.6
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• pp.365-370
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• 2021

In this research, we proceeded with research on plasma resistance of the cleaning process of APS(Atmospheric Plasma Spray)-Y₂O₃ coated parts used for semiconductor and display plasma process equipment. CF₄, O₂, and Ar mixed gas were used for the plasma environment, and respective alconox, surfactant, and piranha solution was used for the cleaning process. After APS-Y₂O₃ was exposed to CF₄ plasma, the surface changed from Y₂O₃ to YF₃ and a large amount of carbon was deposited. For this reason, the plasma corrosion resistance was lowered and contamination particles were generated. We performed a cleaning process to remove the defect-inducing surface YF₃ layer and carbon layer. Among three cleaning solutions, the piranha cleaning process had the highest detergency and the alconox cleaning process had the lowest detergency. Such results could be confirmed through the etching amount, morphology, composition, and accumulated contamination particle analysis results. Piranha cleaning process showed the highest detergency, but due to the very large thickness reduction, the base metal was exposed and a large number of contaminated particles were generated. In contrast, the surfactant cleaning process exhibit excellent properties in terms of surface detergency, etching amount, and accumulated contamination particle analysis.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.475-480
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• 2017

In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was $6.4{\Omega}$, the resistance after plating was $2.6{\Omega}$, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.

• Journal of Environmental Health Sciences
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• v.47 no.6
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• pp.540-547
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• 2021

Background: Indoor air pollutants are caused by a number of factors, such as coming in from the outside or being generated by internal activities. Typical indoor air pollutants include nitrogen dioxide and carbon monoxide from household items such as heating appliances and volatile organic compounds from building materials. In addition there is carbon dioxide from human breathing and bacteria from speaking, coughing, and sneezing. Objectives: According to recent research results, most indoor air pollution is known to be greatly affected by internal factors such as burning (biomass for cooking) and various pollutants. These pollutants can have a fatal effect on the human body due to a lack of ventilation facilities. Methods: We fabricated a polydopamine (PDA) layer with Ti substrates as a coating on supported glass fiber fabric to enhance its photo-activity. The PDA layer with TiO₂ was covalently attached to glass fiber fabric using the drop-casting method. The roughness and functional groups of the surface of the Ti substrate/PDA coated glass fiber fabric were verified through infrared imaging microscopy and field emission scanning electron microscopy (FE-SEM). The obtained hybrid Ti substrate/PDA coated glass fiber fabric was investigated for photocatalytic activity by the removal of ammonia and an epidermal Staphylococcus aureus reduction test with lamp (250 nm, 405 nm wavelength) at 24℃. Results: Antibacterial properties were found to reduce epidermal staphylococcus aureus in the Ti substrate/PDA coated glass fiber fabric under 405 nm after three hours. In addition, the Ti substrate/PDA coated glass fiber fabric of VOC reduction rate for ammonia was 50% under 405 nm after 30 min. Conclusions: An electron-hole pair due to photoexcitation is generated in the PDA layer and transferred to the conduction band of TiO₂. This generates a superoxide radical that degrades ammonia and removes epidermal Staphylococcus aureus.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Applied Chemistry for Engineering
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• v.23 no.1
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• pp.1-7
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• 2012

In this article, I will introduce recent developments of environmental-friendly materials fabricated using atomic layer deposition (ALD). Advantages of ALD include fine control of the thin film thickness and formation of a homogeneous thin fim on complex-structured three-dimensional substrates. Such advantages of ALD can be exploited for fabricating environmental-friendly materials. Porous membranes such as anodic aluminum oxide (AAO) can be used as a substrate for $TiO_2$ coating with a thickness of about 10 nm, and the $TiO_2$-coated AAO can be used as filter of volatile organic compound such as toluene. The unique structural property of AAO in combination with a high adsorption capacity of amorphous $TiO_2$ can be exploited in this case. $TiO_2$ can be also deposited on nanodiamonds and Ni powder, which can be used as photocatalyst for degradation of toluene, and $CO_2$ reforming of methane catalyst, respectively. One can produce structures, in which the substrates are only partially covered by $TiO_2$ domains, and these structures turns out to be catalytically more active than bare substrates, or complete core-shell structures. We show that the ALD can be widely used not only in the semiconductor industry, but also environmental science.

• Journal of the Korean Electrochemical Society
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• v.27 no.3
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• pp.88-96
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• 2024

Lithium metal has garnered attention as a promising anode active material thanks to its high specific capacity, energy density, and the lowest reduction potential. However, the formation of dendrites, dendritic crystals that arise during the charge and discharge process, has posed safety and lifetime stability challenges. To resolve this, our study has introduced a novel separator design. This separator features a composite coating of vapor-grown carbon fiber, a conductive material in nanofibers, and silver. We have meticulously studied the impact of this innovative separator on the electrochemical properties of the lithium metal anode, unveiling promising results. To confirm the synergistic effect of VGCF and Ag, a separator with no surface treatment and a separator with only VGCF coated on one side were prepared and compared with the Ag-VGCF-separator. In the case of the bare separator, the Li metal surface is covered with dendrites during the initial charge and discharge process. In contrast, both the VGCF-separator and the Ag-VGCF-separator show Li precipitation inside the conductive coating layer coated on the separator surface. Additionally, the Ag-VGCF-separator showed a more uniform precipitate shape than the VGCF-separator. As a result, the Ag-VGCF-separators show improved electrochemical properties compared to the bare separators and the VGCF-separators.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.4
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• pp.115-126
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• 2015

In this study, we investigated influence of ground calcium carbonate (GCC) modified by washless multilayering of polyelectrolytes on paper quality. Three layers of polyelectrolytes (cationic starch/anionic polyacrylamide/cationic starch) were formed on the surface of GCC using laboratory inline washless polyelectrolytes multilayering system, which was called inline LbL GCC. Base papers were prepared with untreated GCC or inline LbL GCC using a laboratory handsheet former. These handsheets were coated with rod coater, and then printed by black ink. Properties of base paper and fold crack of coated paper were evaluated. Base paper with inline LbL GCC showed much higher mechanical strength in terms of tensile index, strain, internal bond strength, and folding endurance. The fold crack of coated paper with inline LbL GCC occurred more frequently compared to coated paper with untreated GCC. This might be due to highly improved internal bond strength of base paper, which resulted in smaller delamination that played a role of stress dissipation. It would be recommended to design a proper coating layer in order to prevent fold crack.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.10 s.241
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• pp.1156-1162
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• 2005

In this study, a noble method is proposed to prevent the edge overcoating (EOC) that may develop near the edge of the steel strip in the gas wiping process of continuous hot-dip galvanizing. In our past study (Trans. of the KSME (B), Vol. 27, No. 8, pp. $1105\~1113$), it was found that EOC is caused by the alternating vortices which are generated by the collision of two opposed jets in the region outside the steel strip. When the two opposed jets collide at an angle much less than $180^{o}$, non-alternating stable vortices are established symmetrically outside the steel strip, which lead to nearly uniform pressure on the strip surface. In order to deflect both jets downward by a certain angle, a cylinder with small diameter is installed tangentially to the exit of the lower lip of the two-dimensional jet. In order to find an optimum cylinder diameter, the three dimensional flow field is analysed numerically by using the commercial code, STAR-CD. And the coating thickness is calculated by using an integral analysis method to solve the boundary layer momentum equation. In order to compare the present noble method with the conventional baffle plate method to prevent the EOC, the flow field with a baffle plate is also calculated. The calculation results show that the tangentially installed cylinder at the bottom lip of the jet exit is more effective than the baffle plate to prevent EOC.

• Journal of Powder Materials
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• v.23 no.1
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• pp.38-42
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• 2016

$BaTiO_3$-coated Fe nanofibers are synthesized via a three-step process. ${\alpha}-Fe_2O_3$ nanofibers with an average diameter of approximately 200 nm are first prepared using an electrospinning process followed by a calcination step. The $BaTiO_3$ coating layer on the nanofiber is formed by a sol-gel process, and a thermal reduction process is then applied to the core-shell nanofiber to selectively reduce the ${\alpha}-Fe_2O_3$ to Fe. The thickness of the $BaTiO_3$ shell is controlled by varying the reaction time. To evaluate the electromagnetic (EM) wave-absorbing abilities of the $BaTiO_3@Fe$ nanofiber, epoxy-based composites containing the nanofibers are fabricated. The composites show excellent EM wave absorption properties where the power loss increases to the high frequency region without any degradation. Our results demonstrate that the $BaTiO_3@Fe$ nanofibers obtained in this work are attractive candidates for electromagnetic wave absorption applications.