• 한국전기전자재료학회논문지
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• 제33권2호
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• pp.141-146
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• 2020

Thermoelectric Bi₂Te₃ thin films were synthesized by a co-sputtering method at 300℃. A Fe dopant was considered to enhance the thermoelectric properties of the system. The Seebeck coefficient of the Fe-doped films increased whereas the electrical conductivity decreased. As a result, the power factor of the system increased owing to the enhanced Seebeck coefficient. Grain growth inhibition was detected in the Fe-doped system, which produced more grain boundaries in the Fe-doped films than in the undoped system. The increased grain boundary scattering was deemed to be effective for a reduced thermal conductivity. This is advantageous for the preparation of high-performance thermoelectric films.

• 세라미스트
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• 제22권2호
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• pp.133-145
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• 2019

Thermoelectric energy conversion has attracted much attention because it can convert heat into electric power directly through solid state device and vice versa. Current research is aimed at increasing the thermoelectric figure of merit (ZT ) by improving the power factor and reducing the thermal conductivity. Although there have been significant progresses in increasing ZT of material systems composed of Bi, Te, Ge, Pb, and etc. over the last few decades, their relatively high cost, toxicity, and the scarcity have hindered further development of thermoelectrics to expand practical applications. In this paper, we review the current status of research in the fields of nanostructured thermoelectric materials with eco-friendly and low cost elements, such as skutterudites and oxides, for mid-high temperature applications, highlighting the strategies to improve thermoelectric performance.

• Electronic Materials Letters
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• 제14권6호
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• pp.725-732
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• 2018

The thermoelectric and transport properties of Ti-doped FeVSb half-Heusler alloys were studied in this study. $FeV_{1-x}Ti_xSb$ (0.1 < x < 0.5) half-Heusler alloys were synthesized by mechanical alloying process and subsequent vacuum hot pressing. After vacuum hot pressing, a near singe phase with a small fraction of second phase was obtained in this experiment. Investigation of microstructure revealed that both grain and particle sizes were decreased on doping which would influence on thermal conductivity. No foreign elements pick up from the vial was seen during milling process. Thermoelectric properties were investigated as a function of temperature and doping level. The absolute value of Seebeck coefficient showed transition from negative to positive with increasing doping concentrations ($x{\geq}0.3$). Electrical conductivity, Seebeck coefficient and power factor increased with the increasing amount of Ti contents. The lattice thermal conductivity decreased considerably, possibly due to the mass disorder and grain boundary scattering. All of these turned out to increase in power factor significantly. As a result, the thermoelectric figure of merit increased comprehensively with Ti doping for this experiment, resulting in maximum thermoelectric figure of merit for $FeV_{0.7}Ti_{0.3}Sb$ at 658 K.

• 동력기계공학회지
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• 제16권2호
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• pp.17-23
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• 2012

The steady three-dimensional computational thermal flow analysis using standard k-${\varepsilon}$ turbulence model was carried out to investigate the heat transfer characteristics of a cabin cooler for a commercial vehicle. The heat exchanging method of this cabin cooler is to use the cooling effect of a thermoelectric module. In view of the results so far achieved, the air system resistance of a cabin cooler is about 12.4 Pa as a static pressure, and then the operating point of a cross-flow fan considering in this study is formed in the comparatively low flowrate region. The air temperature difference obtained from the cold part of an thermoelectric module is about $26^{\circ}C$, and the cooling water temperature difference obtained from the hot part of an thermoelectric module is about $3.5^{\circ}C$.

• 전기전자학회논문지
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• 제19권2호
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• pp.210-218
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• 2015

본 논문에서는 진동과 열에너지를 이용한 자동 스위칭 에너지 하베스팅 회로를 제안한다. 열전소자와 진동소자로부터 출력되는 에너지는 최대 가용전력지점이 개방전압의 1/2로 같기 때문에 동일한 MPPT(Maximum Power Point Tracking) 제어회로를 사용할 수 있다. 제안된 회로는 하나의 MPPT 제어회로를 사용하고, 자동 스위칭 기능을 적용하여 열전소자의 출력과 진동소자의 출력을 모니터링하여 전압이 더 큰 소자로부터 최대 가용전력을 수확한다. 제안된 회로는 $0.35{\mu}m$ CMOS 공정으로 설계하였으며, 모의실험을 통해 동작을 검증하였다. 설계된 회로의 칩 면적은 PAD를 포함하여 $1.4mm{\times}1.2mm$이다.

• 동력기계공학회지
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• 제16권2호
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• pp.36-42
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• 2012

본 논문은 고파워 전자소자로부터 에너지를 수확하는 열전생성기의 성능에 pellet의 기학학적 구조가 미치는 영향들을 보고한다. 열경계저항을 포함하는 열전모델을 적용하여, 다양한 경계조건들과 열원의 열율들에 대해 pellet의 높이, pellet의 단면적, thermocouple의 수를 최적화 하고, 이처럼 최적화된 pellet의 기하학적 구조를 갖는 열전생성기의 성능과 일반적인 pellet으로 구성된 열전생성기의 전력생성성능과 효율이 예측되고 비교되어진다. 예측된 결과는 최적화된 pellet으로 구성된 열전생성기가 일반적인 pellet으로 구성된 열전생성기보다 2-10배까지 생성효율이 우수함을 보여준다. 최적화된 pellet으로 구성된 열전생성기와 일반적인 pellet으로 구성된 열전생성기의 열적성능도 예측되고 비교된다.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2000년도 High Temperature Superconductivity Vol.X
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• pp.70-75
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• 2000

We report results of a comparative study of the normal-state and superconducting properties in the GdBa$_2$(Cu$_{2.9}$Al$_{0.1}$)O$_z$ system with substitutions by Pr for the Gd and Ba sites. It is observed that, fur both Pr-doped systems, the superconducting transition temperature(T$_c$) decreases almost linearly with the Pr-content, but Pr at Ba sites results in a faster T$_c$ drop than that of Pr at Gd sites. The thermoelectric power measurements indicate that there is a strong correlation between the T$_c$ and the room temperature value of thermoelectric power. The experimental results are discussed in connection with existing models.

• 한국연소학회:학술대회논문집
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• 한국연소학회 2015년도 제51회 KOSCO SYMPOSIUM 초록집
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• pp.323-323
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• 2015

In recent years, increasing concerns of environmental issues of global warming and limitations of conventional energy resources have resulted in extensive researches into energy harvesting from unused energy. Thermoelectric generation (TEG) is a promising technology for waste heat to power, and various kinds of applications are possible if a waste heat source meets the requirements of TEG operation. In terms of commercialization, economic feasibility is important for an emerging technology like TEG. In this study, economic analysis was conducted for the application of TEG on various sources of waste heat.

• 한국표면공학회지
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• 제49권1호
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• pp.40-45
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• 2016

Recently, $Bi_2Te_3$-based alloys are the best thermoelectric materials near to room temperature, so it has been researched to achieve increased figure of merit(ZT). Ternary compounds such as Bi-Te-Se and Bi-Sb-Te have higher thermoelectric property than binary compound Bi-Te and Sb-Te, respectively. Compared to DC plating method, pulsed electrodeposition is able to control parameters including average current density, and on/off pulse time etc. Thereby the morphology and properties of the films can be improved. In this study, we electrodeposited n-type ternary Cu-doped $Bi_2(Te-Se)_3$ thin film by modified pulse technique at room temperature. To further enhance thermoelectric properties of $Bi_2(Te-Se)_3$ thin film, we optimized Cu doping concentration in $Bi_2(Te-Se)_3$ thin film and correlated it to electrical and thermoelectric properties. Thus, the crystal, electrical, and thermoelectric properties of electrodeposited $Bi_2(Te-Se)_3$ thin film were characterized the XRD, SEM, EDS, Seebeck measurement, and Hall effect measurement, respectively. As a result, the thermoelectric properties of Cu-doped $Bi_2(Te-Se)_3$ thin films were observed that the Seebeck coefficient is $-101.2{\mu}V/K$ and the power factor is $1412.6{\mu}W/mK^2$ at 10 mg of Cu weight. The power factor of Cu-doped $Bi_2(Te-Se)_3$ thin film is 1.4 times higher than undoped $Bi_2(Te-Se)_3$ thin film.

• 전기학회논문지
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• 제59권9호
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• pp.1615-1620
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• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.