• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.951-954
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• 2004

We report the recent reliability test results of SpatiaLight's liquid crystal on Silicon (LCOS) microdisplays. Two different types of reliability tests have been performed: 1) thermal and 2) thermal with high intensity UV light. Various important device parameters were regularly monitored including the contrast ratio, color uniformity, and switching time. The test data shows that there are no degradations that fail the pass criteria. Lifetime estimations are given from the test data.

• Journal of the Korean institute of surface engineering
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• v.55 no.6
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• pp.408-416
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• 2022

In this study, the effect of Au-Sn alloy coating on reliability of electrical contacts was investigated via comparison with Au-Co alloy coating. The results show that Au-Sn alloy exhibited lower contact resistance and higher solder spreadability than those of Au-Co alloy after thermal aging. In the case of Au-Co alloy plating, the underlying Ni element diffused into Au-Co layer to form Ni oxides on surface during thermal aging, leading to increased contact resistance and decreased solder spreadability. Meanwhile, for Au-Sn alloy plating, Au-Ni-Sn metallic compound was formed at the interface between Au-Sn layer and underlying Ni layer. This compound acted as a diffusion barrier, thereby inhibiting the diffusion of Ni to Au-Sn layer during thermal aging. Consequently, Au-Sn alloy layer showed better contact reliability than that of Au-Co alloy layer.

• Journal of Power Electronics
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• v.16 no.2
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• pp.685-694
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• 2016

This paper presents a reliability assessment model for the power semiconductors used in wind turbine power converters. In this study, the thermal loadings at different timescales of wind speed are considered. First, in order to address the influence of long-term thermal cycling caused by variations in wind speed, the power converter operation state is partitioned into different phases in terms of average wind speed and wind turbulence. Therefore, the contributions can be considered separately. Then, in regards to the reliability assessment caused by short-term thermal cycling, the wind profile is converted to a wind speed distribution, and the contribution of different wind speeds to the final failure rate is accumulated. Finally, the reliability of an actual power converter semiconductor for a 2.5 MW wind turbine is assessed, and the failure rates induced by different timescale thermal behavior patterns are compared. The effects of various parameters such as cut-in, rated, cut-out wind speed on the failure rate of power devices are also analyzed based on the proposed model.

• Transactions of the Society of Information Storage Systems
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• v.4 no.1
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• pp.6-12
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• 2008

The paper deals with the numerical analysis and design optimization of polysilicon micro thermal flexure actuator. The deflection of a thermal actuator is implicitly related to the actuation time so that such deflection is to be maximized under the consideration of structural performances such as maximum stress and natural frequencies. At first, the structural formulation of a thermal actuator is reviewed, and its CAE based simulation is performed to verify the numerical model. A parametric study is then conducted to identify the mainly effective design variables. Finally, the design of a micro thermal actuator is explored in the context of deterministic optimization and reliability based design optimization in the present study.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• International Journal of Reliability and Applications
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• v.15 no.2
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• pp.125-150
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• 2014

Accelerated life tests (ALTs) are extensively used to determine the reliability of a product in a short period of time. Test units are subject to elevated stresses which yield quick failures. ALT can be carried out using constant-stress, step-stress, progressive-stress, cyclic-stress or random-stress loading and their various combinations. An ALT with linearly increasing stress is ramp-stress test. Much of the previous work on planning ALTs has focused on constant-stress, step-stress, ramp-stress schemes and their various combinations where the stress is generally increased. This paper presents an optimal design of ramp soak-stress ALT model which is based on the principle of Thermal cycling. Thermal cycling involves applying high and low temperatures repeatedly over time. The optimal plan consists in finding out relevant experimental variables, namely, stress rates and stress rate change points, by minimizing variance of reliability function with pre-specified mission time under normal operating conditions. The Burr type XII life distribution and time-censored data have been used for the purpose. Burr type XII life distribution has been found appropriate for accelerated life testing experiments. The method developed has been explained using a numerical example and sensitivity analysis carried out.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.566-569
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• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Journal of the Korean Ceramic Society
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• v.54 no.6
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• pp.492-498
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• 2017

A thermal barrier coating (TBC) with self-healing property for cracks was proposed to improve reliability during gas turbine operation, including structural design. Effect of healing agent on crack propagation behavior in TBCs with and without buffer layer was investigated through furnace cyclic test (FCT). Molybdenum disilicide ($MoSi_2$) was used as the healing agent; it was encapsulated using a mixture of tetraethyl orthosilicate and sodium methoxide. Buffer layers with composition ratios of 90 : 10 and 80 : 20 wt%, using yttria stabilized zirconia and $MoSi_2$, respectively, were prepared by air plasma spray process. After generating artificial cracks in TBC samples by using Vickers indentation, FCTs were conducted at $1100^{\circ}C$ for a dwell time of 40 min., followed by natural air cooling for 20 min. at room temperature. The cracks were healed in the buffer layer with the healing agent of $MoSi_2$, and it was found that the thermal reliability of TBC can be enhanced by introducing the buffer layer with healing agent in the top coat.

• Structural Engineering and Mechanics
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• v.50 no.3
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• pp.305-322
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• 2014

Reliability-based design limit states and associated partial load factors provide a consistent level of design safety across bridge types and members. However, limit states in the current AASHTO LRFD have not been developed explicitly for the situation encountered by integral abutment bridges (IABs) that have unique boundary conditions and loads with inherent uncertainties. Therefore, new reliability-based limit states for IABs considering the variability of the abutment support conditions and thermal loading must be developed to achieve IAB designs that achieve the same safety level as other bridge designs. Prestressed concrete girder bridges are considered in this study and are subjected to concrete time-dependent effects (creep and shrinkage), backfill pressure, temperature fluctuation and temperature gradient. Based on the previously established database for bridge loads and resistances, reliability analyses are performed. The IAB limit states proposed herein are intended to supplement current AASHTO LRFD limit states as specified in AASHTO LRFD Table 3.4.1-1.