Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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A study on Au-Sn alloy plating layer improving reliability of electrical contacts

전자부품 커넥터의 접속 신뢰성 향상을 위한 Au-Sn 합금 도금층 연구

  • Choi, Jong Hwan (Department of Materials Science and Metallurgical Engineering, Kyungpook National University) ;
  • Son, Injoon (Department of Materials Science and Metallurgical Engineering, Kyungpook National University)
  • 최종환 (경북대학교 신소재공학부 금속신소재공학전공) ;
  • 손인준 (경북대학교 신소재공학부 금속신소재공학전공)
  • Received : 2022.12.15
  • Accepted : 2022.12.18
  • Published : 2022.12.31
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Abstract

In this study, the effect of Au-Sn alloy coating on reliability of electrical contacts was investigated via comparison with Au-Co alloy coating. The results show that Au-Sn alloy exhibited lower contact resistance and higher solder spreadability than those of Au-Co alloy after thermal aging. In the case of Au-Co alloy plating, the underlying Ni element diffused into Au-Co layer to form Ni oxides on surface during thermal aging, leading to increased contact resistance and decreased solder spreadability. Meanwhile, for Au-Sn alloy plating, Au-Ni-Sn metallic compound was formed at the interface between Au-Sn layer and underlying Ni layer. This compound acted as a diffusion barrier, thereby inhibiting the diffusion of Ni to Au-Sn layer during thermal aging. Consequently, Au-Sn alloy layer showed better contact reliability than that of Au-Co alloy layer.

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References

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