• JSTS:Journal of Semiconductor Technology and Science
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• 제16권2호
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• pp.179-184
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• 2016

In recent years, the on-resistance, power loss and cell density of Si power devices have not exhibited significant improvements, and performance is approaching the material limits. GaN is considered an attractive material for future high-power applications because of the wide band-gap, large breakdown field, high electron mobility, high switching speed and low on-resistance. Here we report on the Ohmic contact resistance and reverse-bias characteristics of AlGaN/GaN Schottky barrier diodes with and without annealing. Annealing in oxygen at $500^{\circ}C$ resulted in an increase in the breakdown voltage from 641 to 1,172 V for devices with an anode-cathode separation of $20{\mu}m$. However, these annealing conditions also resulted in an increase in the contact resistance of $0.183{\Omega}-mm$, which is attributed to oxidation of the metal contacts. Auger electron spectroscopy revealed diffusion of oxygen and Au into the AlGaN and GaN layers following annealing. The improved reverse-bias characteristics following annealing in oxygen are attributed to passivation of dangling bonds and plasma damage due to interactions between oxygen and GaN/AlGaN. Thermal annealing is therefore useful during the fabrication of high-voltage GaN devices, but the effects on the Ohmic contact resistance should be considered.

• 전기전자학회논문지
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• 제24권1호
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• pp.284-292
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• 2020

SiC 기반 소자는 silicon 소자 대비 1200V 이상의 고전압 환경에서 우수하게 동작하며 특히 매우 높은 온도에서 안정적인 특성을 보여준다. 따라서 최근 1700V급 UMOSFET이 전기 자동차, 항공기 등의 전력시스템의 사용을 목표로 활발하게 연구개발 되고 있다. 본 논문에서는 최근 연구되고 있는 세 종류의 1700급 UMOSFET-Conventional UMOSFET (C-UMOSFET), Source Trench UMOSFET (ST-UMOSFET), Local Floating Superjunction UMOSFET (LFS-UMOSFET)-에 대해 온도 변화(300K-600K)에 따른 전력소자에서 중요한 변수 (breakdown voltage(BV), on-resistance(R_on), threshold voltage(v_th), transconductance(g_m))의 신뢰성 특성을 비교 분석하였다. 세 소자 모두 온도 증가에 따른 BV 증가, R_on 증가, v_th 감소, g_m 감소를 확인하였다. 그러나 세 소자의 구조 차이에 따라 BV, R_on v_th, g_m 변화에 차이가 있어 그 정도 및 원인에 대해 비교 분석하였다. 모든 결과는 sentaurus TCAD을 통해 simulation 되었다.

• 대한전자공학회논문지SD
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• 제40권8호
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• pp.560-564
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• 2003

본 논문에서는 RTP(rapid thermal process)를 이용한 새로운 산화방법을 고안했으며, 이는 짧은 시간에 다공질 실리콘을 산화시킴으로써 이 기술은 여타 방법에 비해 경제적이고 간편한 방법으로 짧은 시간에 두꺼운 산화막을 성장시킬 수 있는 장점을 가지고 있다. 먼저, 양극반응을 통해 PSL(porous silicon layer)을 형성한 후 이를 저온 산화시킨 후에 급속 열처리 산화공정(RTO: rapid thermal oxidation)를 이용해서 OPSL(oxidized porous silicon layer)을 제조하고, 그 물성 및 전기적 특성을 조사하여, 열 산화로 제작된 OPSL과 그 특성을 비교하였다. 시편의 절연 파괴전압은 약 3.9 MV/cm의 값을 보여 벌크 산화막보다는 적은 값이지만 절연 재료로서는 충분한 값이고, 누설전류는 0 ∼ 50 V의 인가 전압에서 100 ∼ 500 ㎀의 값을 보였다. 그리고, XPS 결과는 RTO 공정 추가가 저온 산화막의 완전 산화에 크게 기여함을 확인하였으며, 저온 산화막의 표면 및 내부에서도 산화반응이 완전하게 이루어졌음을 확인하였다. 이 결과로부터 저온 OPSL을 제조할 때, RTO 공정이 OPSL의 산화 및 치밀화(densification)의 증가에 크게 기여함을 알 수 있었다. 따라서, 이의 방법으로 제조된 OPSL은 저온을 요구하는 공정에서 소자의 절연막, 전기적인 분리층 그리고 실리콘 고주파용 기판 등으로 활용될 수 있을 것으로 보인다.

• 한국전기전자재료학회논문지
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• 제37권6호
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• pp.657-661
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• 2024

Gallium oxide (Ga₂O₃) is emerging as a next-generation power semiconductor material due to its excellent electrical properties, including an ultra-wide bandgap of approximately 4.8 eV and a breakdown electric field of about 7 MV/cm. However, its low thermal conductivity of around 0.13 W/cmK presents significant challenges to the performance and reliability of Ga₂O₃-based devices. In this study, we employed the Silvaco TCAD simulator to analyze the thermal and electrical characteristics of Ga₂O₃ Schottky barrier diodes (SBDs) with heat sinks of varying thermal conductivities. The results demonstrate that heat sinks with higher thermal conductivity effectively mitigate the temperature rise in the device, leading to an increase in current density. The limitation in heat dissipation due to parasitic on-state resistance not only affects device performance but also impacts long-term reliability. Therefore, this study contributes to the development of effective thermal management strategies for Ga₂O₃-based power semiconductors.

• 한국표면공학회지
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• 제48권2호
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• 한국식품과학회지
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• 제42권3호
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• pp.292-297
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• 2010

도복 현미와 백미 곡립의 경도는 도복 시간에 따라 감소하였고, 무도복 현미와 백미의 경도는 오히려 증가하였다. 도복 현미와 백미의 DSC 열적 성질($T_o$, $T_p$, $T_c$, ${\Delta}H$)은 도복 시간에 따라 감소하였고, 무도복 현미와 백미의 경우는 증가하였다. 현미 백미 곡립의 경도와 DSC 열적 성질, 특히 ${\Delta}H$와 $T_p$는 밀접한 상관관계를 보였다. 도복 현미와 백미의 RVA 호화 특성(최대점도, 최저점도, 최종점도, breakdown, consistency)은 도복 시간에 따라 감소하였고, 무도복 현미와 백미의 경도는 오히려 증가하였다. 다만 setback의 경우는 일정한 경향을 보이지 않았다. 도복 현미밥과 백미밥의 경도, 응집성, 검성, 씹음성, 부착성, 탄성은 도복 시간에 따라 감소하였고, 무도복 현미밥과 백미밥의 경우는 증가하였다. 다만 응집성과 부착성은 백미가 현미보다 높았다.

• Transactions on Electrical and Electronic Materials
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• 제16권2호
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• pp.53-61
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• 2015

High-energy ball milling was tested as a method for producing Ultra High Molecular Weight Polyethylene (UHMWPE)- based nanodielectrics containing 1 wt% and 5 wt% OctaIsoButylPOSS (OibPOSS). Qualitative and quantitative evaluations were used to explore the compatibility between OibPOSS and PE. Several ball milling variables were optimized in a bid to achieve UHMWPE/OibPOSS nanodielectrics. The morphology, as well as the thermal and the dielectric properties of the samples, were characterized by scanning electron microscopy, thermogravimetric analysis, broadband dielectric spectroscopy, and progressive-stress breakdown tests. The results showed that (i) ball milling was an effective method for producing UHMWPE/OibPOSS dielectric composites, but appeared ineffective in dispersing OibPOSS at the nanoscale, and (ii) the resulting UHMWPE/OibPOSS dielectric composites presented thermal and dielectric properties similar to those of neat UHMWPE.

• 전자공학회논문지D
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• 제34D권8호
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• pp.26-34
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• 1997

To develop ultrathin gate oxide for ULSI MOSFETs, for the first time, we fabricated MOS capacitors with 65.angs. thick initial oxide grown by high pressure oxidation (HIPOX) at 700.deg. C in 5 atmosphere $O_{2}$ ambient and then followed by rapid thermal nitridation (RTN) in N$_{2}$O ambient. The dielectric breakdown fields of the initial HIPOX oxide are 13.0 MV/cm and 13.8MV/cm for negative and positive gate bias, respectively and are dependent on nitridation temeprature and time.The lifetimes of the HIPOX oxides extractd by TDDB method are 1.1*10$^{8}$ sec and 3.4 * 10$^{9}$ sec for negative and positive stress current, respectively. The lifetime of the HIPOX oxide dfor negative stress current increases with nitridation time in N$_{2}$O ambient at 1100.deg.C, reaching maximum value stress curretn increases with nitridation time in N$_{2}$O ambient at 1100.deg. C reacing maximum value of 1.2*10$^{9}$ sec for 30 sec of nitridation time, and then subsequently decreases at the longer nitridation time. The lifetimes of the nitrided-HIPOX oxides are longer than 10 years when nitridations are carried out longer than about 50 sec and 12 sec at 1000.deg. C, and 1100.deg. C, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.137-140
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• 1993

Electrical properties and thermal annealing effects of $C_{22}$-quinolium(TCNQ) Langmuir-Blodgett(LB) films were studied. Typical current-voltage(I-V) characteristics along the perpendicular direction chow an anomalous behavior of breakdown near the electric-field strength of $10^{6}$V/cm. To see the thermal influence of the specimen, current was measured as a function of temperature(20∼$180^{\circ}C$). It shows that the current increases about 4 orders of magnitude near 60∼$70^{\circ}C$ and remains constant far a while up to ∼$150^{\circ}C$ and then suddenly drops. Such increase of current near 60∼$70^{\circ}C$ seems tn be related to a softness of alkyl chains. Besides the electrical measurements, UV/visible absorption(300∼800 nm) of the thermally annealed sample was measured to see the internal-structure change. It is found that there are four characteristic peaks. At 494 nm, the optical absorption of the thermally annealed specimen at $60^{\circ}C$ starts increase and stays almost constant upto∼ $140^{\circ}C$. And eventually it disappears above $180^{\circ}C$. After heat treatment of the specimen up to $150^{\circ}C$, Uv/visible absorption was measured while cooling.

• 전자공학회논문지A
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• 제30A권10호
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• pp.59-66
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• 1993

PZT thin film deposited by rf magnetron sputtering was annealed by rapid thermal process(RTP) in PbO ambient to prevent vaporing of Pb and interface reactions. Si and TiN/Ti/Si substrates were prepared to survey application of TiN/Ti layer which can prevent interface interaction with Si and crack of PZT thin films. As temperature increased. PZT thin films surface on Si substrate appeared more severe cracks which should affect electrical properties deadly. TiN/Ti(40-150${\mu}{\Omega}{\cdot}cm$) layer applied for buffer layer suppressed interface interaction and film cracking. The measured leakage current(LC) and breakdown voltage(BV) of PZT thin film on TiN/Ti/Si substrate annealed at 650$^{\circ}$C for 15 sec (thickness of 2500$\AA$) were 38 nA/cm2 and 3.5 MV/cm and dielectric constant was 310 at 1 MHz, and remanent polarization (Pr) and coercive field (Ec) were 6.4${\mu}C/cm^{2}$ and 0.2MV/cm at 60 Hz, respectively.