• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.709-712
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• 2002

For the electro-discharge machining of an electro-conductive anisotropic composite, an unsteady state formulation was established and solved by Galerkin's finite element method. The distribution of temperature on work piece, the shape of the crater and the material removal rate were obtained in terms of the process parameters. As the spark was initiated the workpiece immediately started to melt and the heat affected zone was formed. The moving boundary of the crater was also identified with time. When the radial and axial conductivities were increased separately the temperature distribution and the shape of the crater were shifted in the same direction respectively and the material removal rate was found to be higher in the case of increasing radial conductivity rather than the axial conductivity.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2002년도 학술대회 논문집
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• pp.221-224
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• 2002

Superconducting electrical devices are under development in a national project in Korea. And KEPCO and LGIS are in charge of development of a resistive type fault current limiters(FCLs) with YBCO thin films. In order to realize FCLs, the rated power of FCLs must be increased. For this purpose, it is of great interest to increase of allowed voltage of unit component without electrical and thermal damages. So, meander lines were widely used for the conducting path to increase maximum electric field. In this research, numerical simulations on the electromagnetic behaviors of the device were carried out, especially focusing on the effect of meander line structures on the YBCO thin films. To evaluate the structures of meander lines, three types of meander lines were considered for numerical analysis using finite element method (FEM). In this simulation, both normal state and fault conditions were considered for calculation of electric field, current density, magnetic field density. And the simulation resulted are compared to find the optimum design of meander lines for resistive FCLs.

• 한국생산제조학회지
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• 제23권3호
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• pp.230-236
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• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• Journal of Electrical Engineering and Technology
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• 제6권5호
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• pp.671-676
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• 2011

A multilayer square-type piezoelectric transformer with a hole at the center was investigated in this paper. Temperature distribution at the center was improved by using this construction, therefore increasing input voltage and output power. This model was simulated and investigated successfully by applying a finite element method (FEM) in ATILA software. An optimized structure was then fabricated, examined, and compared to the simulation results. Electrical characteristics, including output voltage and output power, were measured at different load resistances. The temperature distribution was also monitored using an infrared camera. The piezoelectric transformer operated at first radial vibration mode and a frequency area of 70 kHz. The 16 W output power was achieved in a three-layer transformer with 96% efficiency and $20^{\circ}C$ temperature rise from room temperature under 115 V driving voltage, 100 ${\Omega}$ matching load, $28{\times}28{\times}1.8mm$ size, and 2 mm hole diameter. With these square-type multilayer piezoelectric transformers, the temperature was concentrated around the hole and lower than in piezoelectric transformers without a hole.

• 한국초전도ㆍ저온공학회논문지
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• 제11권1호
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• pp.25-29
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• 2009

To reduce the power loss in normal state, non-inductively wound high temperature superconducting (HTS) coils are used for fault current limiter (FCL) application. Non-inductively wound coils can be classified into two types: solenoid type and pancake type. These two types have different electrical and thermal and mechanical characteristics due to their winding structure difference. This paper deals with the current limiting characteristics, magnetic field analysis of the two coils. Simulation using finite element method (FEM) was used to analyze the magnetic field distribution and inductance of the coils. Short circuit test using stabilizer-free coated conductor (CC) was also carried out. We can compare the characteristics of the two types of coil by using the data obtained from simulation and short circuit test. We confirmed the feasibility of FCL application by the analysis about the characteristics of non-inductively wound coil using CC.

• 한국재료학회지
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• 제8권8호
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• pp.744-750
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• 1998

마이크로 머신 소자는 일반전자 소자와 달리 소자 자체에 미세한 기계적 구조물을 갖고 있으며, 이의 구동을 통하여 센서 또는 엑츄에이터의 기능을 갖게 된다. 이 소자들은 그 작동 요구특성에 따라 패키지의 기계적, 환경적 격리를 요구하거나 분위기조절이 요구되는 등 까다로운 패키지 특성을 필요로 한다. 또한 미세한 작동소자들로 인하여 열 및 열응력에 매우 민감하며, 패키지방법에 따라 구동부위의 작동 특성이 크게 변화할 수 있다. 본 연구에서는 마이크로 머신 소자가 패키지 상에 접촉되어 패키지 될 때, 소자의 접촉 재료 및 공정온도, 크기 등이 마이크로 머신 소자에 미치는 열응력을 연구하였다. 유한요소해석법을 사용하여 소자에 미치는 열응력과 이로 인한 마이크로머신 소자의 물리적 변형을 예측하고, 이를 통하여 마이크로 머신 소자 패키지에 최소한의 열응력을 미치는 소자접속 재료의 선별과 패키지 설계의 최적화를 이루고자 하였다.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• 해양환경안전학회지
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• 제25권4호
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• pp.468-475
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• 2019

엔드라인 폭연방지기는 수직 환기장치에 폭연방지와 함께 대기방출을 하도록 한다. 엔드라인 폭연방지장치는 선박과 같은 산업현장의 다양한 분야에 적용된다. 폭연방지기에서 스프링은 스프링 부하와 스프링의 탄성이 후드 개방 모멘트를 결정하므로 필수 부품이다. 더욱이, 장치 내 스프링은 고온의 상태에서도 작동해야 한다. 따라서, 폭연이 나타나기 시작할 때 스프링의 기계적 하중과 탄성을 분석할 필요가 있다. 이 연구에서는 엔드라인 폭연방지기의 작동 프로세스의 시뮬레이션을 기반으로 열 및 구조해석을 수행하으며, 스프링의 3차원 모델은 CFD 시뮬레이션을 이용하였다. CFD 해석은 FEM 시뮬레이션 값을 입력하여 스프링 구조를 분석한다. 본 연구에서는 스프링 부하의 43 kg, 93 kg 및 56 kg 세 가지 경우 즉, 150 mm 스프링 디플렉션에 부합하도록 집중적으로 관찰하였다. 결과적으로, $1,000^{\circ}C$ 가열조건 하에서 5분 후에 스프링 부하가 10 kg 감소했다. 시뮬레이션 결과는 연소 시간 변화에 따라 스프링의 부하와 탄성을 예측하고 추정할 수 있었다. 또한, 연구의 결과는 폭연방지기의 제조자들에게 역화방지장치뿐만 아니라 스프링의 설계를 최적화하기 위한 참고 자료로 활용할 수 있다.

• 한국생산제조학회지
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• 제22권1호
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• pp.168-172
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• 2013

In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D packaging, because the thickness of each layer in wafer level 3D packaging was too small (micro meter or nano meter scale) comparing with diameter of wafer (6 or 8 inches). In this study, the FE model using the shell element was selected and simulated by the ANSYS WorkBench to investigate effects of the CTE on the warpage. To verify the FE model, it was compared by experimental results.