Warpage Simulation by the CTE mismatch in Blanket Structured Wafer Level 3D packaging |
Kim, Seong Keol
(Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
Jang, Chong-Min (Graduate School of Mechanical Design & Automation Eng., Seoul National University of Science and Technology) Hwang, Jung-Min (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) Park, Man-Chul (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) |
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