• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.567-570
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. the thermal analysis for the proposed planar structure including temperature distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of an actual device to investigate the acceptability of the computer simulation.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.21-30
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• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2000년도 추계학술대회 논문집
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• pp.84-89
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. The thermal analyses for the proposed planar structure including temperatur distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of a actual device to investigate the acceptability of the computer simulation.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.414-419
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• 2009

Good control of thermal energy helps to increase characteristics and eliminate defects of large cast-forged part, such as large sized forged shell. Thermal energy control is a important factor. We have studied about forging process and after heat treatment process by FEM simulation. There are three ways of process. Changes of temperature and microstructure for forged shell were predicted according to temperature declination in large cast-forged product. So we will be able to choose the proper time from heat treatment conditions by FEM simulation.

• 한국산학기술학회논문지
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• 제11권2호
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• pp.696-702
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• 2010

온도 제어를 필요로 하는 많은 산업 응용분야에서는 통상적으로 온도제어 대상물체를 특정 목표온도에 매우 가깝게 도달하도록 히터들의 출력을 조절한다. 제어 대상물체의 매우 느린 온도변화 반응과 이웃한 히터들에 의해 발생하는 열 간섭 현상은 다양한 산업 응용분야에서 요구되는 성능을 충족시키는 온도 제어기 설계를 매우 어렵게 하는 요인이며 많은 연구가 지속적으로 이루어지고 있다. 그러나 온도 제어기 설계를 위해서는 반복적인 실험이 매우 중요하지만 대상물체의 가열과 냉각에 매우 많은 시간이 소모되는 개선될 수 없는 현실이 존재한다. 따라서 대상물체의 온도 변화에 대한 수치해석 결과를 적절한 시간 내에 충분히 정확하게 나타낼 수 있으며 제어기 설계에 편리하게 응용 할 수 있는 시뮬레이션 환경이 필요하다. 본 논문에서는 온도 제어를 필요로 하는 산업분야에 유용하게 적용될 수 있는 유한요소법(FEM: Finite Element Method)을 이용한 2D 시뮬레이션 환경의 프로토타입을 MATLAB을 이용해서 구현했다. 개발된 프로토타입은 기본적인 물체 외형 디자인, 추가 경계 설정, 메쉬 생성 및 FEM 수치해석 기능을 갖추고 있으며 예제를 통하여 동작의 유용함과 편리함을 보였다.

• 열처리공학회지
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• 제14권4호
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• pp.228-234
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• 2001

The present study was an attempt for systematic data conversion between FDM and FEM in order to evaluate the thermal stress distribution during quenching process. It has been generally recognized that FDM is efficient in flow and temperature analysis and FEM in that of stress. But it induced difficulty and tedious work in analysis that one uses both FDM and FEM to take their advantages because of the discrepancy of nodes between analysis tools. So we proposed field data conversion procedure from FDM to FEM in 3-dimensional space, then applied this procedure to analysis of quenching process. The simulation procedure calculates the distributions of temperature and microstructure using FDM and microstructure evolution equations of diffusion and diffusionless transformation. FEM was used for predicting the distributions of thermal stress. The present numerical code includes coupled temperaturephase transformation kinetics and temperature-microstructure dependent material properties. Calculated results were compared with previous experimental data to verify the method, which showed good agreements.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.387-390
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• 2000

The life of transformer is significantly dependent on the thermal behavior in windings. To analyse winding temperature rise, many transformer designer have calculated temperature distribution and hot spot point by finite element method(FEM). Recently, numerical analyses of transformer are studied for optimum design, that is electric field analysis, magnetic field, potential vibration, thermal distribution and thermal stress. Therefore design time and design cost are decreased by numerical analysis. In this paper, the temperature distribution and thermal stress analysis of 50kVA pole cast resin transformer for power distribution are investigated by FEM program. The temperature change according to load rates of transformer also have been investigated. We have carried out temperature rise test and test results are compared with simulation data.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.402-405
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• 2002

This paper presented the characteristic of Heat-transfer on the winding composed with Epoxy-resin in a 50 kVA cast-resin dry type transformer The resin cast transformer is used widely in supplying electricity systems. However, to know the thermal characteristics of that is very useful in designing, manufacturing, and maintaining, there is no pertinent method to calculate this. In this paper, Based on the results of the physical characteristics and the simulation by commercial software using FEM method, we established the Prototype Model for this. According to that Model, an analysis on a variation of the hottest spot temperature was discussed as a function of thermal conductivity for the individual windings composed with Epoxy-resin. The thermal conductivity of the individual windings with reference to upper way was discussed.

• Journal of Power Electronics
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• 제13권6호
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• pp.1080-1089
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• 2013

In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.121-145
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• 2001

Chip Size Packages (CSP) are now widely used in high speed DRAM. The major driving farce of CSP development is its superior electrical performance than that of conventional package. However, the power dissipation of high speed DRAM like DDR or RAMBUS DRAM chip reaches up to near 2W. This fact makes the thermal management methods in DRAM package be more carefully considered. In this study, the thermal performances of 3 type CSPs named $\mu-BGA$^{TM}$$ $UltraCSP^{TM}$ and OmegaCSP$^{TM}$ were measured under the JEDEC specifications and their thermal characteristics were of a simulation model utilizing CFD and FEM code. The results show that there is a good agreement between the simulation and measurement within Max. 10% of $\circledM_{ja}$. And they show the wafer level CSPs have a superior thermal performance than that of $\mu-BGA.$ Especially the analysis results show that the thermal performance of wafer level CSPs are excellent fur modulo level in real operational mode without any heat sink.