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http://dx.doi.org/10.6113/JPE.2013.13.6.1080

Thermal Model for Power Converters Based on Thermal Impedance  

Xu, Yang (School of Information and Electrical Engineering, China University of Mining and Technology)
Chen, Hao (School of Information and Electrical Engineering, China University of Mining and Technology)
Lv, Sen (School of Information and Electrical Engineering, China University of Mining and Technology)
Huang, Feifei (School of Information and Electrical Engineering, China University of Mining and Technology)
Hu, Zhentao (School of Information and Electrical Engineering, China University of Mining and Technology)
Publication Information
Journal of Power Electronics / v.13, no.6, 2013 , pp. 1080-1089 More about this Journal
Abstract
In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.
Keywords
Finite Element Method (FEM); Power converter; Temperature rise; Thermal impedance; Superposition principle; Switched Reluctance Motor (SRM);
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Times Cited By KSCI : 5  (Citation Analysis)
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1 H. Chen and S. L. Lu, "Fault diagnosis digital method for power transistors in power converters of Switched Reluctance Motors," IEEE Trans. Ind. Electron., Vol. 60, No. 2, pp. 749-763, Feb. 2013.   DOI   ScienceOn
2 H. Chen and J. J. Gu, "Implementation of the Three-Phase Switched Reluctance Machine System for motors and generators," IEEE/ASME Trans. Mechatronics, Vol. 15, No. 3, pp. 421-432, Jun. 2010.   DOI   ScienceOn
3 H. Wang, D. H. Lee, and J. W. Ahn, "Radial force control of a novel hybrid pole BLSRM," Journal of Power Electronics, Vol. 9, No. 6, pp. 845-853, Nov. 2009.   과학기술학회마을
4 D. H. Lee, J. Liang, and J. W. Ahn, "Series-parallel connected capacitor type boost converter for a single-phase SRM," Journal of Power Electronics, Vol. 10, No. 4, pp. 388-395, Jul. 2010.   과학기술학회마을   DOI   ScienceOn
5 H. K. M. Khoi, J. W. Ahn, and D. H. Lee, "Current control scheme of high speed SRM using low resolution encoder," Journal of Power Electronics, Vol. 11, No. 4, pp. 520-526, Jul. 2011.   과학기술학회마을   DOI   ScienceOn
6 M. N. F. Nashed, K. Ohyama, K. Aso, H. Fujii, and H. Uehara, "Automatic turn-off angle control for high speed SRM drives," Journal of Power Electronics, Vol. 7, No. 1, pp. 81-88, Jan. 2007.   과학기술학회마을
7 D. H. Jang, "Novel SRM drive systems using variable DC-Link voltage," Journal of Power Electronics, Vol. 11, No. 3, pp. 285-293, May 2011.   과학기술학회마을   DOI   ScienceOn
8 H. Chen, Y. Xu, and H. H. C. Iu, "Analysis of temperature distribution in power converter for Switched Reluctance Motor drive," IEEE Trans. Magn., Vol. 48, No. 2, pp. 991-994, Feb. 2012.   DOI   ScienceOn
9 A. Tenconi, F. Profumo, S. E. Bauer, and M. D. Hennen, "Temperatures evaluation in an integrated motor drive for traction applications," IEEE Trans. Ind. Electron., Vol. 55, No. 10, pp. 3619-3626, Oct. 2008.
10 U. Drofenik and J. W. Kolar, "Teaching thermal design of power electronic systems with web-based interactive educational software," 18th Annual IEEE Applied Power Electronics Conference and Exposition, pp. 1029-1036, 2003.
11 G. L. Skibinski and W. A. Sethares, "Thermal parameter estimation using recursive identification," IEEE Trans. Power Electron, Vol. 6, No. 2, pp. 228-239, Apr. 1991.   DOI   ScienceOn
12 S. Dutta, B. Parkhideh, S. Bhattacharya, G. K. Moghaddam, and R. Gould, "Development of a predictive observer thermal model for power semiconductor devices for overload monitoring in high power high frequency converters," Twenty-Seventh Annual IEEE of Applied Power Electronics Conference and Exposition, pp. 2305-2310, 2012.
13 Z. Luo, H. Ahn, and M. A. El Nokali, "A thermal model for insulated gate bipolar transistor module," IEEE Trans. Power Electron, Vol. 19, No. 4, pp. 902-907, Jul. 2004.   DOI   ScienceOn
14 A. R. Hefner, "A dynamic electro-thermal model for the IGBT," IEEE Trans. Ind. Applicat., Vol. 30, No. 2, pp. 394-405, Mar/Apr. 1994.   DOI   ScienceOn
15 J. J. Rodriguez, Z. Parrilla, M. Velez-Reyes, A. Hefner, D. Berning, J. Reichl, and J. Lai, "Thermal Component Models for Electro Thermal Analysis of Multichip Power Modules", In Proceedings of IEEE Industry Application Society Annual Meeting, pp. 234-241, 2002.
16 B. Du, J. L. Hudgins, E. Santi, A. T. Bryant, P. R. Palmer, and H. A. Mantooth, "Transient electrothermal simulation of power semiconductor devices," IEEE Trans. Power Electron, Vol. 25, No. 1, pp. 237-248, Jan. 2010.   DOI   ScienceOn
17 J. Van den Keybus, T. Nobels, and R. Belmans, "Thermal design of converters using discrete power components incorporating an IGBT and a freewheeling diode," European Conference on Power Electronics and Applications, pp. 1-10, 2005.
18 I. Swan, A. Bryant, A. Mawby, T. Ueta, T. Nishijima, and K. Hamada, "A fast loss and temperature simulation method for power converters, Part II: 3-D thermal model of power module," IEEE Trans. Power Electron, Vol. 27, No. 1, pp. 258-268, Jan. 2012.   DOI   ScienceOn
19 H. H. Wu, Y. Y. Hsiao, H. S. Huang, P. H. Tang, and S. L. Chen, "A practical plate-fin heat sink model," Applied Thermal Engineering, Vol. 31, No. 5, pp. 984-992, Apr. 2011.   DOI   ScienceOn
20 Y. S. Muzychka, J. R. Culham, and M. M. Yovanovich, "Thermal spreading resistance of eccentric heat sources on rectangular flux channels," Journal of Electronic Packaging, Vol. 125, No. 2, pp. 178-185, Jun. 2003.   DOI   ScienceOn
21 L. Wei, R. J. Kerkman, R. A. Lukaszewski, B. P. Brown, N. Gollhardt, and B. W. Weiss, "Junction Temperature Prediction of a Multiple-chip IGBT Module under DC Condition," In Proceedings of IEEE Industry Application Society Annual Meeting, pp. 754-762, 2006.