• The Transactions of the Korean Institute of Electrical Engineers P
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• v.64 no.1
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• pp.41-44
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• 2015

In cognitive radios, exponentially distributed idle period(EIP) is considered in this paper. In the EIP case, durations of idle periods are be limited and varied by primary traffic arrivals. Accordingly, we first analyze the idle period utilization which can be achieved by the slotted ALOHA in cognitive radio communications. The idle period utilization is a newly defined performance metric to measure the transmission performance of the secondary network as effective time durations utilized for successful secondary transmissions in an idle period. Then, the idle period utilization is maximized through controlling the data transmission time. All technical processes are mathematically analyzed and expressed as closed form solutions.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.4
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• pp.50-50
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• 2001

IDDQ 테스트는 CMOS VLSI 회로에서 발생 가능한 여러 종류의 물리적 결함을 효율적으로 검출 할 수 있는 테스트 방식이다. 본 논문에서는 CMOS에서 발생 빈도가 가장 높은 합선고장을 효과적으로 검출할 수 있는 IDDQ 테스트 알고리즘을 이용하여 패턴 생성기를 개발하였다. 고려한 합선고장 모델은 회로의 레이아웃 정보에 의존하지 않으며, 내부노드 혹은 외부노드에 한정시킨 합선고장이 아닌 테스트 대상회로의 모든 노드에서 발생 가능한 단락이다. 구현된 테스트 패턴 생성기는 O(n2)의 복잡도를 갖는 합선고장과 전압 테스트 방식에 비해 상대적으로 느린 IDDQ 테스트를 위해서 새롭게 제안한 이웃 조사 알고리즘과 고장 collapsing 알고리즘을 이용하여, 빠른 고장 시뮬레이션 시간과 높은 고장 검출율을 유지하면서 적은 수의 테스트 패턴 생성이 가능하다. ISCAS 벤치마크 회로의 모의실험을 통하여 기존의 다른 방식보다 우수한 성능을 보였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.10
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• pp.45-51
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• 2003

In this paper, a scan-based low power BIST (Built-In Self-Test) architecture is proposed. The proposed architecture is based on STUMPS, which uses a LFSR (Linear Feedback Shift Register) as the test generator, a MISR(Multiple Input Shift Register) as the reponse compactor, and SRL(Shift Register Latch) channels as multiple scan paths. In the proposed BIST a degenerate MISR structure is used for every SRL channel; this offers reduced area overheads and has less impact on performance than the STUMPS techniques. The proposed BIST is designed to support both test-per-clock and test-per-scan techniques, and in test-per-scan the total power consumption of the circuit can be reduced dramatically by suppressing the effects of scan data on the circuits. Results of the experiments on ISCAS 89 benchmark circuits show that this architecture is also suitable for detecting path delay faults, when the hamming distance of the data in the SRL channel is considered.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.8 s.350
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• pp.27-34
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• 2006

During Built-In Self-Test(BIST), The set of patterns generated by a pseudo-random pattern generator may not provide sufficiently high fault coverage and many patterns were undetected fault. In order to reduce the test time, we can remove useless patterns or change from them to useful patterns. In this paper, we reseed modify the pseudo-random and use an additional bit flag to improve test length and achieve high fault coverage. the fat that a random tset set contains useless patterns, so we present a technique, including both reseeding and bit modifying to remove useless patterns or change from them to useful patterns, and when the patterns change, we choose number of different less bit, leading to very short test length. the technique we present is applicable for single-stuck-at faults. the seeds we use are deterministic so 100% faults coverage can be achieve.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.919-925
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• 1999

Grain boundary characteristics and corrosion behavior of Alloy 600 material were investigated using the concept of grain boundary control by thermomechanical treatment(TMT). The grain boundary character distribution (GBCD) was analyzed by electron backscattered diffraction pattern. The effects of GBeD variation on intergranular at tack(JGA) and primary water stress corrosion cracking(PWSeC) were also evaluated. Changes in the fraction of coinci dence site lattice(CSL) boundaries in each cycle of TMT process were not distinguishable, but the total eSL boundary frequencies for TMT specimens increased about 10% compared with those of the commercial Alloy 600 material. It was found from IGA tests that the resistance to IGA was improved by TMT process. However, it was found from PWSCC test that repeating of TMT cycles resulted in the gradual decrease of the time to failure and the maximum load due to change in grain boundary characteristics, while the average crack propagation rate of primary crack increased mainly due to suppression of secondary crack propagation. It is considered that these corrosion characteristics in TMT specimens is attributed to 'fine tuning of grain boundary' mechanism.

• Progress in Medical Physics
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• v.9 no.3
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• pp.143-154
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• 1998

The image intensifier is the key component which determines the imaging characteristics in a fluoroscopic imaging system. A system performance program for clinical evaluation of two image intensifiers, that is simple, non-invasive and time effective, was described. Tests were grouped into three headings: x-ray generator, image quality, and collimation. For the x-ray generator, the kVp accuracy and the automatic exposure control operation were compared. Low- and high-contrast resolution measurements, and mesh pattern study belong to the image quality tests and those tests were performed for the video monitor and photospot images. For the collimation, usable field diameter and image distortion of image intensifiers were measured and quantified. The procedures and the results are hoped to be used for the clinical evaluation of system performance and/or acceptance tests for image intensifiers.

• Journal of the Korea Society of Computer and Information
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• v.9 no.1
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• pp.9-15
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• 2004

New WSW(Wrap Side Wall) is proposed to decrease junction electric field in this paper. WSW process is fabricated after first gate etch, followed NM1 ion implantation and deposition & etch nitride layer. New WSW structure has buffer layer to decrease electric field. Also we compared the hot carrier characteristics of WSW and conventional. Also, we design a test pattern including pulse generator, level shifter and frequency divider, so that we can evaluate AC hot carrier degradation on-chip. It came to light that the universality of the hot carrier degradation between DC and AC stress condition exists, which indicates that the device degradation comes from the same physical mechanism for both AC and DC stress. From this universality, AC lifetime under circuit operation condition can be estimated from DC hot carrier degradation characteristics.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.4
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• pp.329-334
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• 2002

For the testability, this paper proposed the algorithm at autonomous synthesis which includes the data path structure as the self testing as possible on high level synthesis method when VHDL, coding is used in the system design area. In the proposed algorithm of this paper, MUXs and registers are assigned to the data path of designed system. And the designed data path could be mapped the H/W specification of described VHDL coding to the testable library. As a results, it was mapped H/W to the assign algorithm that is minimized MUX and the registers in collision graph.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.