• Health Policy and Management
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• v.25 no.3
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• pp.229-239
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• 2015

Background: The hospital accreditation program in Korea has been conducted since 2011 in order to improve patient safety and healthcare service quality. This study was conducted to find factors associated with satisfaction as surveyor and reliability of surveyors in hospital accreditation program. Methods: This study was performed targeting 217 responded to the survey among 412 surveyors who had participated in the accreditation survey for acute care hospitals from December 2010 to February 2014. Results: The average number of survey per surveyor is 2.35. We divided surveyors into those who participated in the survey more than 3 times and less than 3 times in order to judge the professionalism of surveyors according to the number of survey participation. Those factors that have an influence on the satisfaction as surveyors include: activity period as surveyor, role in the survey team, experience of survey in other fields, experience as consultant and the useful education and proper composition of survey team (p<0.05). Those factors that have an influence on the reliability for fellow surveyors include: number of beds of hospitals they belong, experience of survey in other fields, useful education, proper composition of survey team and difficulty in leadership interview (p<0.05). Conclusion: It is important to provide useful education and proper composition of survey team to increase the satisfaction as surveyors and the reliability for fellow surveyors.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.3
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• pp.141-157
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• 2001

Highly reliable packaged 64kbit ferroelectric memories with $0.8{\;}\mu\textrm{m}$ CMOS ensuring ten-year retention and imprint at 125^{\circ}C$ have been successfully developed. These superior reliabilities have resulted from steady integration schemes free from the degradation, due to layer stress and attacks of process impurities. The resent results of research and development for ferroelectric memories at Hynix Semiconductor Inc. are summarized in this invited paper.

• Journal of Korean Society for Quality Management
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• v.27 no.4
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• pp.241-255
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• 1999

This paper concerns Reliability Analysis System(RAS) developed by LG Electronics, Inc. for collecting, classifying, and analyzing field failure data. To develop this system, a database for the management of field failure data was built and several functions were included to analyze and assess the product reliability. Nonparametric estimation and cumulative hazard plotting techniques were applied to estimate the reliability for a specific period. This system serves not only engineers in charge of quality but also designers who wish to monitor the reliability of their own products.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1538-1541
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• 2005

For reliability evaluation of AC-PDP, one of the most important factor is sealing property. In this paper, the reliability evaluation test method of the commercialized sealing glass frit in AC-PDP was studied. 6 inch AC-PDP panels were tested for evaluation of sealing glass frit by vibration shock test, thermal shock test, non -destructive X-ray inspection, residual stress inspection and residual gas detection. These test methods are proposed as a standard for testing the reliability of sealing glass frit. The main failure mode of sealing glass frit in AC-PDP seems to be the crack propagation from thermal cycling rather than mechanical factor.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.327-337
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• 2005

Accelerated life test models and procedure are developed to assess the reliability of Door switch. The main function of door switch is to operate bulb lamp and fan motor. The accelerated life test method and test equipments are developed using the relationship between stresses and life characteristics of the products. Using the developed accelerated life test method, the parameters of the ALT model and life time distribution are estimated and the reliability of the Door S/W at use condition if assessed. The proposed accelerated life test method and procedure may be extended and applied to testing similar kinds of products to reduce test time and costs of the tests remarkably.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.851-854
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• 2008

In order to reduce the manufacturing cost of TFT LCDs and cut down an amount facilities invested, there are many LCD panel makers contributes to convert the current Five-mask manufacturing process into the noble Four-mask fabrication process. We optimized the slit mask to improve the poor process reliability.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.866-867
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• 2011

As part of the green growth, The Green Car has attracted wide attention. Types of the Green Car are Electric Vehicle, Plug-in Hybrid Electric Vehicle, Hybrid Electric Vehicle, Fuel Cell Vehicle and Clean Diesel Vehicle. Of these, The electric vehicle is equipped with the BDU(Battery Disconnecting Unit). BDU is supplying stable battery power and blocking it to protect electrical system of the electric vehicle. The BDU consists of electric components such as current sensor, fuse and pre-charge resistor. These must pass Voltage withstand test, Salt mist test, Thermal shock test, Vibration test and Short-circuit test commonly to verify reliability of the electric components. In addition, The current sensor should be verified whether normal operation. The breaking capacity of fuse should be verified. The durability of pre-charge resistor should be verified by supplying battery power and blocking it repeatedly. The reliability of BDU as well as the electric vehicle is secured by verifying the reliability of electric components. In addition, It will contribute to the acceleration and promotion of Green Car Technology.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.273-287
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• 2005

Accelerated life test models and procedure are developed to assess the reliability of Refrigerator door switch. The main function of door switch is to operate bulb lamp and fan motor in the refrigerating room. The accelerated life test method and test equipments are developed using the relationship between stresses and life characteristics of the products. Using the developed accelerated life test method, the parameters of the ALT model and life time distribution are estimated and the reliability of the Door S/W at use condition if assessed. The proposed accelerated life test method and procedure may be extended and applied to testing similar kinds of products to reduce test time and costs of the tests remarkably.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Korean Journal of Metals and Materials
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• v.47 no.5
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• pp.311-315
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• 2009

2-dimensional (2D) dopant profiling in semiconductor device was carried out by electron holography and scanning capacitance microscopy methods with the same multi-layered p-n junction sample. The dopant profiles obtained from two methods are in good agreement with each other. It demonstrates that reliability of dopant profile measurement can be increased through precise comparison of 2D profiles obtained from various techniques.